TW200746349A - Stacking rings for wafers - Google Patents
Stacking rings for wafersInfo
- Publication number
- TW200746349A TW200746349A TW096104642A TW96104642A TW200746349A TW 200746349 A TW200746349 A TW 200746349A TW 096104642 A TW096104642 A TW 096104642A TW 96104642 A TW96104642 A TW 96104642A TW 200746349 A TW200746349 A TW 200746349A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafers
- ring
- wafer
- shippers
- rings
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US77183906P | 2006-02-08 | 2006-02-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200746349A true TW200746349A (en) | 2007-12-16 |
Family
ID=38345802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096104642A TW200746349A (en) | 2006-02-08 | 2007-02-08 | Stacking rings for wafers |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200746349A (zh) |
WO (1) | WO2007092557A2 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107004627A (zh) * | 2014-11-27 | 2017-08-01 | 阿基里斯株式会社 | 环形间隔件 |
CN112352307A (zh) * | 2018-06-27 | 2021-02-09 | 村田机械株式会社 | 基材载体及基材载体堆叠 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202008013468U1 (de) * | 2008-10-14 | 2008-12-18 | Christian Senning Verpackungsmaschinen Gmbh & Co. | Verpackungen für dünnflächige, scheibenförmige Produkte |
US10896834B2 (en) | 2014-02-25 | 2021-01-19 | Entegris, Inc. | Wafer shipper with stacked support rings |
EP3231009B1 (en) * | 2014-12-08 | 2021-07-07 | Entegris, Inc. | Horizontal substrate container with integral corner spring for substrate containment |
US10832927B2 (en) * | 2015-12-18 | 2020-11-10 | Texas Instruments Incorporated | Interlocking nest wafer protector |
DE102016113924B4 (de) | 2016-07-28 | 2024-06-13 | Infineon Technologies Ag | Waferbox und Verfahren zum Anordnen von Wafern in einer Waferbox |
US11257700B2 (en) * | 2017-08-29 | 2022-02-22 | Daewon Semiconductor Packaging Industrial Company | Separators for handling, transporting, or storing semiconductor wafers |
HUE054704T2 (hu) * | 2018-12-06 | 2021-09-28 | Heraeus Deutschland Gmbh & Co Kg | Csomagolási egység szubsztrátok számára |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6550619B2 (en) * | 2000-05-09 | 2003-04-22 | Entergris, Inc. | Shock resistant variable load tolerant wafer shipper |
US6926150B2 (en) * | 2003-02-05 | 2005-08-09 | Texas Instruments Incorporated | Protective interleaf for stacked wafer shipping |
US20050072121A1 (en) * | 2003-10-06 | 2005-04-07 | Texas Instruments Incorporated | Method and system for shipping semiconductor wafers |
-
2007
- 2007-02-08 TW TW096104642A patent/TW200746349A/zh unknown
- 2007-02-08 WO PCT/US2007/003367 patent/WO2007092557A2/en active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107004627A (zh) * | 2014-11-27 | 2017-08-01 | 阿基里斯株式会社 | 环形间隔件 |
CN112352307A (zh) * | 2018-06-27 | 2021-02-09 | 村田机械株式会社 | 基材载体及基材载体堆叠 |
Also Published As
Publication number | Publication date |
---|---|
WO2007092557A2 (en) | 2007-08-16 |
WO2007092557A3 (en) | 2008-07-17 |
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