TW200744436A - Layered thermal conductive interface - Google Patents

Layered thermal conductive interface

Info

Publication number
TW200744436A
TW200744436A TW095118666A TW95118666A TW200744436A TW 200744436 A TW200744436 A TW 200744436A TW 095118666 A TW095118666 A TW 095118666A TW 95118666 A TW95118666 A TW 95118666A TW 200744436 A TW200744436 A TW 200744436A
Authority
TW
Taiwan
Prior art keywords
conductive plate
conductive
heat
plate
adhered
Prior art date
Application number
TW095118666A
Other languages
English (en)
Chinese (zh)
Other versions
TWI306014B (enExample
Inventor
Chih-Liang Fang
Original Assignee
Adlink Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adlink Technology Inc filed Critical Adlink Technology Inc
Priority to TW095118666A priority Critical patent/TW200744436A/zh
Publication of TW200744436A publication Critical patent/TW200744436A/zh
Application granted granted Critical
Publication of TWI306014B publication Critical patent/TWI306014B/zh

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW095118666A 2006-05-25 2006-05-25 Layered thermal conductive interface TW200744436A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095118666A TW200744436A (en) 2006-05-25 2006-05-25 Layered thermal conductive interface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095118666A TW200744436A (en) 2006-05-25 2006-05-25 Layered thermal conductive interface

Publications (2)

Publication Number Publication Date
TW200744436A true TW200744436A (en) 2007-12-01
TWI306014B TWI306014B (enExample) 2009-02-01

Family

ID=45071278

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095118666A TW200744436A (en) 2006-05-25 2006-05-25 Layered thermal conductive interface

Country Status (1)

Country Link
TW (1) TW200744436A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115500043A (zh) * 2021-06-18 2022-12-20 亚旭电脑股份有限公司 散热装置组装方法与散热装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115500043A (zh) * 2021-06-18 2022-12-20 亚旭电脑股份有限公司 散热装置组装方法与散热装置

Also Published As

Publication number Publication date
TWI306014B (enExample) 2009-02-01

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