TW200741925A - Wire bonding machine and method for processing a semiconductor device - Google Patents
Wire bonding machine and method for processing a semiconductor deviceInfo
- Publication number
- TW200741925A TW200741925A TW096114438A TW96114438A TW200741925A TW 200741925 A TW200741925 A TW 200741925A TW 096114438 A TW096114438 A TW 096114438A TW 96114438 A TW96114438 A TW 96114438A TW 200741925 A TW200741925 A TW 200741925A
- Authority
- TW
- Taiwan
- Prior art keywords
- wire bonding
- semiconductor device
- bonding machine
- processing
- site area
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/781—Means for controlling the bonding environment, e.g. valves, vacuum pumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85053—Bonding environment
- H01L2224/85054—Composition of the atmosphere
- H01L2224/85075—Composition of the atmosphere being inert
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/380,233 US20070251980A1 (en) | 2006-04-26 | 2006-04-26 | Reduced oxidation system for wire bonding |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200741925A true TW200741925A (en) | 2007-11-01 |
Family
ID=38647404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096114438A TW200741925A (en) | 2006-04-26 | 2007-04-24 | Wire bonding machine and method for processing a semiconductor device |
Country Status (6)
Country | Link |
---|---|
US (2) | US20070251980A1 (zh) |
JP (1) | JP2007294975A (zh) |
KR (1) | KR100874328B1 (zh) |
CN (1) | CN100501958C (zh) |
SG (2) | SG136864A1 (zh) |
TW (1) | TW200741925A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI508248B (zh) * | 2008-06-20 | 2015-11-11 | United Test & Assembly Ct Lt | 有機保焊之互連上之銅及加強之打線接合製程 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4043495B2 (ja) * | 2006-04-20 | 2008-02-06 | 株式会社カイジョー | ワーククランプ及びワイヤボンディング装置 |
CN101971314B (zh) * | 2008-06-10 | 2013-10-09 | 库力索法工业公司 | 用于在引线接合操作中降低氧化的输气系统 |
US20100078464A1 (en) * | 2008-10-01 | 2010-04-01 | Kabushiki Kaisha Shinkawa | Wire bonding apparatus and ball forming method |
CN101862897B (zh) * | 2010-02-11 | 2013-07-03 | 深圳市贵鸿达电子有限公司 | 一种功率器件的铜线键合方法 |
CN102254841B (zh) * | 2010-05-17 | 2013-04-03 | 南茂科技股份有限公司 | 导气管装置 |
CN101894770B (zh) * | 2010-05-28 | 2013-12-11 | 日月光封装测试(上海)有限公司 | 半导体封装打线表面的预氧化处理方法及其预氧化层结构 |
US8186562B1 (en) * | 2010-12-14 | 2012-05-29 | Asm Technology Singapore Pte Ltd | Apparatus for increasing coverage of shielding gas during wire bonding |
JP5618974B2 (ja) | 2011-08-16 | 2014-11-05 | 株式会社新川 | ワイヤボンディング装置 |
CN102513687B (zh) * | 2011-12-16 | 2014-03-05 | 先进光电器材(深圳)有限公司 | 焊线机及其防氧化结构 |
CN102554526A (zh) * | 2012-01-18 | 2012-07-11 | 福建福顺半导体制造有限公司 | 一种半导体器件铜线焊接铜球保护方法及其保护装置 |
WO2013111452A1 (ja) | 2012-01-26 | 2013-08-01 | 株式会社新川 | 酸化防止ガス吹き出しユニット |
KR101620351B1 (ko) | 2012-01-30 | 2016-05-12 | 삼성전자주식회사 | 회로소자의 와이어 본딩 방법 |
CN103311136A (zh) * | 2012-03-06 | 2013-09-18 | 深圳赛意法微电子有限公司 | 基于bga封装的铜线焊接装置及铜线焊接实现方法 |
JP2014075519A (ja) | 2012-10-05 | 2014-04-24 | Shinkawa Ltd | 酸化防止ガス吹き出しユニット |
WO2014054305A1 (ja) | 2012-10-05 | 2014-04-10 | 株式会社新川 | 酸化防止ガス吹き出しユニット |
CN112427796B (zh) * | 2020-11-11 | 2022-03-25 | 广西天正钢结构有限公司 | 一种高强度低密度钢材焊接工艺 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3281571A (en) * | 1964-12-08 | 1966-10-25 | American Chain & Cable Co | Flexible conduit assembly for welding apparatus |
US4572772A (en) * | 1983-11-07 | 1986-02-25 | Texas Instruments Incorporated | Method for cleaning an electrode |
JPS61172343A (ja) * | 1985-01-28 | 1986-08-04 | Toshiba Corp | ワイヤボンデイング方法及び装置 |
JPS62136835A (ja) * | 1985-12-10 | 1987-06-19 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
DE3915472C2 (de) * | 1988-06-02 | 1995-11-30 | Samsung Electronics Co Ltd | Bondvorrichtung |
JPH0354837A (ja) * | 1989-07-24 | 1991-03-08 | Nippon Steel Corp | ワイヤーボンディング方法 |
JPH04186852A (ja) * | 1990-11-21 | 1992-07-03 | Shinkawa Ltd | ボンデイング装置 |
US5295619A (en) * | 1992-05-22 | 1994-03-22 | Rohm Co., Ltd. | Method and apparatus for performing wire bonding by using solder wire |
US5205463A (en) * | 1992-06-05 | 1993-04-27 | Kulicke And Soffa Investments, Inc. | Method of making constant clearance flat link fine wire interconnections |
JPH07273138A (ja) * | 1994-03-31 | 1995-10-20 | Tatsuta Electric Wire & Cable Co Ltd | ワイヤボンデイング法 |
US6062462A (en) * | 1997-08-12 | 2000-05-16 | Kulicke And Soffa Investments, Inc. | Apparatus and method for making predetermined fine wire ball sizes |
US6156990A (en) * | 1998-06-22 | 2000-12-05 | Kulicke & Soffa Industries, Inc. | Long-wearing impervious conductive wire clamp |
US6234376B1 (en) * | 1999-07-13 | 2001-05-22 | Kulicke & Soffa Investments, Inc. | Supplying a cover gas for wire ball bonding |
JP3798983B2 (ja) * | 2000-04-05 | 2006-07-19 | パスウェイ メディカル テクノロジーズ インコーポレイテッド | 経管的に閉塞物質を除去するシステム |
JP2003179092A (ja) | 2001-12-10 | 2003-06-27 | Nitto Denko Corp | 半導体装置の製造方法及びそれに用いるワイヤボンディング装置 |
TWI287282B (en) * | 2002-03-14 | 2007-09-21 | Fairchild Kr Semiconductor Ltd | Semiconductor package having oxidation-free copper wire |
US7229906B2 (en) * | 2002-09-19 | 2007-06-12 | Kulicke And Soffa Industries, Inc. | Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine |
US6866182B2 (en) * | 2002-10-08 | 2005-03-15 | Asm Technology Singapore Pte Ltd. | Apparatus and method to prevent oxidation of electronic devices |
US7182793B2 (en) * | 2004-01-22 | 2007-02-27 | Asm Technology Singapore Pty Ltd. | System for reducing oxidation of electronic devices |
-
2006
- 2006-04-26 US US11/380,233 patent/US20070251980A1/en not_active Abandoned
-
2007
- 2007-03-20 SG SG200701973-0A patent/SG136864A1/en unknown
- 2007-03-20 SG SG200906737-2A patent/SG156626A1/en unknown
- 2007-04-24 CN CNB2007101012222A patent/CN100501958C/zh active Active
- 2007-04-24 TW TW096114438A patent/TW200741925A/zh unknown
- 2007-04-26 JP JP2007116269A patent/JP2007294975A/ja active Pending
- 2007-04-26 KR KR1020070040888A patent/KR100874328B1/ko active IP Right Grant
-
2010
- 2010-05-27 US US12/788,827 patent/US20100230476A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI508248B (zh) * | 2008-06-20 | 2015-11-11 | United Test & Assembly Ct Lt | 有機保焊之互連上之銅及加強之打線接合製程 |
Also Published As
Publication number | Publication date |
---|---|
CN100501958C (zh) | 2009-06-17 |
SG156626A1 (en) | 2009-11-26 |
CN101064263A (zh) | 2007-10-31 |
US20100230476A1 (en) | 2010-09-16 |
SG136864A1 (en) | 2007-11-29 |
KR100874328B1 (ko) | 2008-12-18 |
JP2007294975A (ja) | 2007-11-08 |
US20070251980A1 (en) | 2007-11-01 |
KR20070105912A (ko) | 2007-10-31 |
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