TW200741047A - Method of smoothing wafer surface and device - Google Patents

Method of smoothing wafer surface and device

Info

Publication number
TW200741047A
TW200741047A TW096101935A TW96101935A TW200741047A TW 200741047 A TW200741047 A TW 200741047A TW 096101935 A TW096101935 A TW 096101935A TW 96101935 A TW96101935 A TW 96101935A TW 200741047 A TW200741047 A TW 200741047A
Authority
TW
Taiwan
Prior art keywords
wafer surface
smoothing
salient
wafer
applying
Prior art date
Application number
TW096101935A
Other languages
English (en)
Other versions
TWI370185B (en
Inventor
Takeo Katoh
Tomohiro Hashii
Katsuhiko Murayama
Sakae Koyata
Kazushige Takaishi
Original Assignee
Sumco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumco Corp filed Critical Sumco Corp
Publication of TW200741047A publication Critical patent/TW200741047A/zh
Application granted granted Critical
Publication of TWI370185B publication Critical patent/TWI370185B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02019—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Weting (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW096101935A 2006-01-20 2007-01-18 Method of smoothing wafer surface and device TWI370185B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006012188 2006-01-20
JP2007002661 2007-01-10

Publications (2)

Publication Number Publication Date
TW200741047A true TW200741047A (en) 2007-11-01
TWI370185B TWI370185B (en) 2012-08-11

Family

ID=38287607

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096101935A TWI370185B (en) 2006-01-20 2007-01-18 Method of smoothing wafer surface and device

Country Status (7)

Country Link
US (1) US7955982B2 (zh)
EP (1) EP1981071A4 (zh)
KR (1) KR101019028B1 (zh)
CN (1) CN101371340B (zh)
MY (1) MY149984A (zh)
TW (1) TWI370185B (zh)
WO (1) WO2007083656A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384541B (zh) * 2008-04-25 2013-02-01 Sumco Techxiv Corp Semiconductor wafer manufacturing apparatus and method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106170848A (zh) * 2014-09-16 2016-11-30 Mt系统公司 采用高温湿法进行的蓝宝石减薄和平滑化
JP2018147908A (ja) * 2015-07-27 2018-09-20 東京エレクトロン株式会社 基板処理方法および基板処理装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5291415A (en) * 1991-12-13 1994-03-01 Hughes Aircraft Company Method to determine tool paths for thinning and correcting errors in thickness profiles of films
US5433650A (en) * 1993-05-03 1995-07-18 Motorola, Inc. Method for polishing a substrate
JPH0750234A (ja) * 1993-08-04 1995-02-21 Komatsu Electron Metals Co Ltd 半導体ウェーハ製造装置および製造方法
US5700180A (en) * 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
JP3194037B2 (ja) 1996-09-24 2001-07-30 東京エレクトロン株式会社 枚葉回転処理方法及びその装置
TW346649B (en) * 1996-09-24 1998-12-01 Tokyo Electron Co Ltd Method for wet etching a film
US5968239A (en) * 1996-11-12 1999-10-19 Kabushiki Kaisha Toshiba Polishing slurry
JPH11135464A (ja) 1997-10-30 1999-05-21 Komatsu Electron Metals Co Ltd 半導体ウェハの製造方法
US6294469B1 (en) 1999-05-21 2001-09-25 Plasmasil, Llc Silicon wafering process flow
US6376395B2 (en) * 2000-01-11 2002-04-23 Memc Electronic Materials, Inc. Semiconductor wafer manufacturing process
JP2002134466A (ja) * 2000-10-25 2002-05-10 Sony Corp 半導体装置の製造方法
US7086933B2 (en) * 2002-04-22 2006-08-08 Applied Materials, Inc. Flexible polishing fluid delivery system
US6939210B2 (en) * 2003-05-02 2005-09-06 Applied Materials, Inc. Slurry delivery arm
KR100582837B1 (ko) * 2003-12-23 2006-05-23 동부일렉트로닉스 주식회사 웨이퍼 평탄화 장치 및 방법
JP4974904B2 (ja) * 2006-01-31 2012-07-11 株式会社Ｓｕｍｃｏ ウェーハの枚葉式エッチング方法
JP2008198906A (ja) * 2007-02-15 2008-08-28 Sumco Corp シリコンウェーハの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384541B (zh) * 2008-04-25 2013-02-01 Sumco Techxiv Corp Semiconductor wafer manufacturing apparatus and method

Also Published As

Publication number Publication date
TWI370185B (en) 2012-08-11
MY149984A (en) 2013-11-15
US7955982B2 (en) 2011-06-07
KR20080078724A (ko) 2008-08-27
CN101371340A (zh) 2009-02-18
CN101371340B (zh) 2012-01-11
US20100151597A1 (en) 2010-06-17
WO2007083656A1 (ja) 2007-07-26
KR101019028B1 (ko) 2011-03-04
EP1981071A4 (en) 2009-01-14
EP1981071A1 (en) 2008-10-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees