TW200739974A - Thermoelectric module and process for producing the same - Google Patents
Thermoelectric module and process for producing the sameInfo
- Publication number
- TW200739974A TW200739974A TW096107281A TW96107281A TW200739974A TW 200739974 A TW200739974 A TW 200739974A TW 096107281 A TW096107281 A TW 096107281A TW 96107281 A TW96107281 A TW 96107281A TW 200739974 A TW200739974 A TW 200739974A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor crystal
- thermoelectric semiconductor
- electrodes
- support substrate
- thermoelectric
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000013078 crystal Substances 0.000 abstract 5
- 239000004065 semiconductor Substances 0.000 abstract 5
- 239000000758 substrate Substances 0.000 abstract 4
- 239000012943 hotmelt Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 230000000717 retained effect Effects 0.000 abstract 2
- 230000004927 fusion Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
With respect to a thermoelectric module structured so that nearly the central part of each thermoelectric semiconductor crystal is retained by a substrate and so that both end faces of the thermoelectric semiconductor crystal are connected to electrodes, it is intended to prevent any drop of mechanical strength by soldering failure for the electrodes. There is provided a structure wherein nearly the central part of each thermoelectric semiconductor crystal (202) is retained by support substrate (201) and wherein both end faces of the thermoelectric semiconductor crystal (202) are connected to electrodes (203,204). Hot melt material sheet (205) is stuck to an upper surface of the support substrate (201) in accordance with a vacuum laminating technique, etc. In the production process, the hot melt material melted by heating attains fusion bonding of the thermoelectric semiconductor crystal (202) to the support substrate (201).
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006066339A JP2007243050A (en) | 2006-03-10 | 2006-03-10 | Thermoelectric module, and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200739974A true TW200739974A (en) | 2007-10-16 |
Family
ID=38509344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096107281A TW200739974A (en) | 2006-03-10 | 2007-03-02 | Thermoelectric module and process for producing the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2007243050A (en) |
| TW (1) | TW200739974A (en) |
| WO (1) | WO2007105510A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006032849A (en) * | 2004-07-21 | 2006-02-02 | Okano Electric Wire Co Ltd | Thermoelectric conversion module |
| EP1965446B1 (en) * | 2007-02-28 | 2011-11-16 | Corning Incorporated | Glass-ceramic thermoelectric module |
| FR2965404B1 (en) * | 2010-09-29 | 2012-09-14 | Valeo Systemes Thermiques | METHOD OF MANUFACTURING A THERMO ELECTRICAL DEVICE, PARTICULARLY FOR GENERATING AN ELECTRICAL CURRENT IN A MOTOR VEHICLE. |
| DE102012022328B4 (en) | 2012-11-13 | 2018-05-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Thermoelectric module |
| JP6070509B2 (en) * | 2013-10-30 | 2017-02-01 | 株式会社デンソー | Anemometer |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09181362A (en) * | 1995-12-26 | 1997-07-11 | Union Material Kk | Flexible thermoelectric device and cooler/heater employing it |
| JP2000286464A (en) * | 1999-03-30 | 2000-10-13 | Seiko Seiki Co Ltd | Thermoelectric module and manufacture of the same |
| JP4035948B2 (en) * | 2000-10-06 | 2008-01-23 | 株式会社タイカ | Thermoelectric module and manufacturing method thereof |
| JP2005174985A (en) * | 2003-12-08 | 2005-06-30 | Morix Co Ltd | Thermoelement |
| JP4344600B2 (en) * | 2003-12-22 | 2009-10-14 | 京セラ株式会社 | Thermoelectric module |
-
2006
- 2006-03-10 JP JP2006066339A patent/JP2007243050A/en active Pending
-
2007
- 2007-03-02 TW TW096107281A patent/TW200739974A/en unknown
- 2007-03-05 WO PCT/JP2007/054173 patent/WO2007105510A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007243050A (en) | 2007-09-20 |
| WO2007105510A1 (en) | 2007-09-20 |
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