TW200739254A - Radiation sensitive resin composition suitable for spinless, slit coating - Google Patents

Radiation sensitive resin composition suitable for spinless, slit coating

Info

Publication number
TW200739254A
TW200739254A TW096101989A TW96101989A TW200739254A TW 200739254 A TW200739254 A TW 200739254A TW 096101989 A TW096101989 A TW 096101989A TW 96101989 A TW96101989 A TW 96101989A TW 200739254 A TW200739254 A TW 200739254A
Authority
TW
Taiwan
Prior art keywords
resin composition
sensitive resin
spinless
composition suitable
radiation sensitive
Prior art date
Application number
TW096101989A
Other languages
Chinese (zh)
Other versions
TWI387849B (en
Inventor
Junichi Shimakura
Shuichi Takahashi
Yong Zhang
Original Assignee
Az Electronic Materials Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Az Electronic Materials Japan filed Critical Az Electronic Materials Japan
Publication of TW200739254A publication Critical patent/TW200739254A/en
Application granted granted Critical
Publication of TWI387849B publication Critical patent/TWI387849B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)

Abstract

There is provided a photo-sensitive resin composition with highly homogeneous coating film thickness, which is suitable for spinless, split coating method. The characteristic of photo-sensitive resin composition is that it consists of alkali-soluble novolak resin, photo-sensitizer, esters made from fatty acids with lower alcohols. And there are a production method of resist substrate by using the composition and the resist substrate made by the method.
TW096101989A 2006-01-31 2007-01-19 Radiation sensitive resin composition suitable for spinless, slit coating TWI387849B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006023388A JP4813193B2 (en) 2006-01-31 2006-01-31 Photosensitive resin composition suitable for spinless and slit coating

Publications (2)

Publication Number Publication Date
TW200739254A true TW200739254A (en) 2007-10-16
TWI387849B TWI387849B (en) 2013-03-01

Family

ID=38485798

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096101989A TWI387849B (en) 2006-01-31 2007-01-19 Radiation sensitive resin composition suitable for spinless, slit coating

Country Status (4)

Country Link
JP (1) JP4813193B2 (en)
KR (1) KR101285574B1 (en)
CN (1) CN101013263B (en)
TW (1) TWI387849B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5090833B2 (en) * 2007-09-11 2012-12-05 東京応化工業株式会社 Positive photoresist composition and photosensitive film-coated substrate using the same
JP5329999B2 (en) * 2009-01-29 2013-10-30 ＡｚエレクトロニックマテリアルズＩｐ株式会社 Pattern formation method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3842446B2 (en) * 1997-09-25 2006-11-08 富士写真フイルム株式会社 Positive photosensitive composition for infrared laser
JP2001264979A (en) * 2000-03-22 2001-09-28 Fuji Photo Film Co Ltd Positive type photosensitive planographic printing plate
JP4213366B2 (en) * 2001-06-12 2009-01-21 Ａｚエレクトロニックマテリアルズ株式会社 Method for forming thick film resist pattern
JP2004138995A (en) * 2002-08-21 2004-05-13 Fuji Photo Film Co Ltd Plate making method for planographic printing plate
JP4545553B2 (en) * 2004-03-12 2010-09-15 東京応化工業株式会社 Non-spin coating positive photoresist composition and resist pattern forming method

Also Published As

Publication number Publication date
KR20070079028A (en) 2007-08-03
JP2007206256A (en) 2007-08-16
CN101013263B (en) 2012-05-30
KR101285574B1 (en) 2013-07-15
TWI387849B (en) 2013-03-01
CN101013263A (en) 2007-08-08
JP4813193B2 (en) 2011-11-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees