TW200736830A - Photosensitive resin composite - Google Patents

Photosensitive resin composite

Info

Publication number
TW200736830A
TW200736830A TW096105737A TW96105737A TW200736830A TW 200736830 A TW200736830 A TW 200736830A TW 096105737 A TW096105737 A TW 096105737A TW 96105737 A TW96105737 A TW 96105737A TW 200736830 A TW200736830 A TW 200736830A
Authority
TW
Taiwan
Prior art keywords
alkyl group
carbons
photosensitive resin
formula
resin composite
Prior art date
Application number
TW096105737A
Other languages
Chinese (zh)
Other versions
TWI396941B (en
Inventor
Yusuke Yamamoto
Takuro Oike
Shinya Adachi
Original Assignee
Sanyo Chemical Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006045676A external-priority patent/JP4568237B2/en
Priority claimed from JP2006296791A external-priority patent/JP4231076B2/en
Application filed by Sanyo Chemical Ind Ltd filed Critical Sanyo Chemical Ind Ltd
Publication of TW200736830A publication Critical patent/TW200736830A/en
Application granted granted Critical
Publication of TWI396941B publication Critical patent/TWI396941B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)

Abstract

A photosensitive resin composite having excellent alkali developing property and a photospacer having excellent flexibility and elastic recovery property are provided. A alkali developing photosensitive resin composite (Q) for photospacer includes hydrophilic polymer (A), mutli functional (meth)acrylate monomer (B), polysiloxane (C) having more than one hydrolytic alkoxy group, and initiators of photo free radical polymerization (D). Preferably, the photosensitive resin composite includes a (C) which is a condensation compound (C1) obtained by condensating at least one of the silane compound (c1) as shown in formula (1) and the silane compound (c2) as shown in formula (2) as absolutely necessary monomer. R2mSi(R1)(OR3)3-m (1) In the formula (1), R1 is an organic group selected from at least one of (meth)acryloyloxy alkyl group, glycidoxy alkyl group, mercapto alkyl group and amino alkyl group, in which the alkyl group has 1-6 carbons. R2 is an aliphatic saturated alkyl group having 6-12 carbons or an aromatic alkyl group having 6-12 carbons. R3 is an alkyl group having 1-4 carbons, and m is an integer of 0 or 1. R4nSi(OR5)4-n (2) In the formula (2), R4 is an aliphatic saturated alkyl group having 6-12 carbons or an aromatic alkyl group having 6-12 carbons. R5 is an alkyl group having 1-4 carbons, and n is an integer of 0 or 1.
TW096105737A 2006-02-22 2007-02-15 Photosensitive resin composite TWI396941B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006045676A JP4568237B2 (en) 2006-02-22 2006-02-22 Photosensitive resin composition
JP2006296791A JP4231076B2 (en) 2006-10-31 2006-10-31 Photosensitive resin composition

Publications (2)

Publication Number Publication Date
TW200736830A true TW200736830A (en) 2007-10-01
TWI396941B TWI396941B (en) 2013-05-21

Family

ID=38613158

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105737A TWI396941B (en) 2006-02-22 2007-02-15 Photosensitive resin composite

Country Status (2)

Country Link
KR (1) KR101311505B1 (en)
TW (1) TWI396941B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100924103B1 (en) * 2009-02-02 2009-10-29 주식회사 엠.에스.라이팅 Lighting apparatus
KR101225126B1 (en) * 2009-03-19 2013-01-22 주식회사 엘지화학 Photosensitive silicone resin composition containing thiol group, semiconductor and diplay device using the same
CN105190440B (en) * 2013-05-30 2019-08-06 三洋化成工业株式会社 Photosensitive polymer combination, photospacer, color filter protective film and touch panel protective film or insulating film
KR102219054B1 (en) * 2017-12-04 2021-02-22 삼성에스디아이 주식회사 Photosensitive resin composition, photosensitive resin using the same and electronic device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW482817B (en) * 1998-06-18 2002-04-11 Jsr Corp Photosetting compositions and photoset articles
JP3718632B2 (en) 1999-12-10 2005-11-24 株式会社日本触媒 Photosensitive resin for liquid crystal spacer and photosensitive resin composition
JP3726652B2 (en) * 2000-07-27 2005-12-14 Ｊｓｒ株式会社 Radiation-sensitive composition, spacer, and color liquid crystal display device

Also Published As

Publication number Publication date
KR20070085142A (en) 2007-08-27
TWI396941B (en) 2013-05-21
KR101311505B1 (en) 2013-09-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees