TW200736128A - Thin-plate storage container - Google Patents
Thin-plate storage containerInfo
- Publication number
- TW200736128A TW200736128A TW096105459A TW96105459A TW200736128A TW 200736128 A TW200736128 A TW 200736128A TW 096105459 A TW096105459 A TW 096105459A TW 96105459 A TW96105459 A TW 96105459A TW 200736128 A TW200736128 A TW 200736128A
- Authority
- TW
- Taiwan
- Prior art keywords
- tray
- storage container
- storage body
- tray storage
- loading
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/54—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles of special shape not otherwise provided for
- B65D85/544—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles of special shape not otherwise provided for for gramophone records
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
Abstract
A thin-plate storage container includes: a tray storage body for loading a plurality of mutually detachable loading trays, holding and storing a semiconductor wafer in a space between the loading trays; and an external storage container for storing the tray storage body therein. Both opposing side ends of each loading tray are provided with a pair of holding portions which a working arm of an external machine device fits and holds. The external storage container includes: a container body; a lid unit; a sealing member, provided between the container body and the lid unit, for sealing the inside; a pair of tray storage body supporting portions for supporting the tray storage body; and a tray storage body retainer for holding and supporting, from the bottom and the lid unit sides, the tray storage body stored in the storage container body.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006038445A JP5025962B2 (en) | 2006-02-15 | 2006-02-15 | Thin plate storage container |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200736128A true TW200736128A (en) | 2007-10-01 |
TWI382948B TWI382948B (en) | 2013-01-21 |
Family
ID=38371504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096105459A TWI382948B (en) | 2006-02-15 | 2007-02-14 | Thin-plate storage container |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5025962B2 (en) |
KR (1) | KR101354029B1 (en) |
TW (1) | TWI382948B (en) |
WO (1) | WO2007094324A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103283012A (en) * | 2010-11-11 | 2013-09-04 | 齐默尔曼和席尔普搬运技术有限责任公司 | Method for loading and unloading a cassette |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4852020B2 (en) * | 2007-11-13 | 2012-01-11 | 信越ポリマー株式会社 | Buffer body and packing body |
JP5160298B2 (en) * | 2008-05-08 | 2013-03-13 | 信越ポリマー株式会社 | Substrate storage container |
JP2009283537A (en) * | 2008-05-20 | 2009-12-03 | Shin Etsu Polymer Co Ltd | Substrate-ousing container |
JP5532796B2 (en) * | 2009-09-29 | 2014-06-25 | 凸版印刷株式会社 | Glass substrate storage tray |
KR20140032942A (en) * | 2010-10-20 | 2014-03-17 | 인티그리스, 인코포레이티드 | Front opening wafer container with door deflection minimization |
KR101331839B1 (en) * | 2011-11-23 | 2013-11-21 | (주)뉴옵틱스 | Nano cylinder vacuum box |
KR101408669B1 (en) | 2012-10-30 | 2014-07-02 | 주식회사 삼에스코리아 | Thin plate storage container |
KR102154303B1 (en) | 2013-08-22 | 2020-09-09 | 미라이얼 가부시키가이샤 | Substrate storing container |
TWI579215B (en) | 2016-10-07 | 2017-04-21 | 家登精密工業股份有限公司 | Vertical Fixing Transmission Box and Transmission Method Using the Same |
EP3336615B1 (en) * | 2016-12-15 | 2019-07-31 | Nivarox-FAR S.A. | Packaging of appliques for timepieces |
JP6877317B2 (en) * | 2017-11-10 | 2021-05-26 | 三菱電機株式会社 | Wafer container |
KR102075351B1 (en) * | 2019-11-04 | 2020-02-10 | 이주철 | Box jig for control board of the vehicle |
US20210300635A1 (en) * | 2020-03-24 | 2021-09-30 | Gudeng Precision Industrial Co., Ltd | Container system |
JP2022076873A (en) * | 2020-11-10 | 2022-05-20 | 信越ポリマー株式会社 | Substrate housing container |
KR102498995B1 (en) * | 2020-11-30 | 2023-02-13 | 주식회사 삼에스코리아 | Tray bonding structure of panel storage container |
KR102446066B1 (en) * | 2021-04-22 | 2022-09-23 | 주식회사 삼에스코리아 | Tray installed in the panel storage container |
KR102546445B1 (en) * | 2021-06-25 | 2023-08-01 | (주)이엠씨 | Fixing Ribs of Wafer Carrier having a Filter Module made of Antistatic Material |
KR102546444B1 (en) * | 2021-06-25 | 2023-08-01 | (주)이엠씨 | Fixing Ribs of Wafer Carrier having a Filter Module with Antistatic Function |
KR102546443B1 (en) * | 2021-06-25 | 2023-06-23 | (주)이엠씨 | Fixing Ribs of Wafer Carrier having a Filter Module made of Antistatic Material |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63138984A (en) * | 1986-11-27 | 1988-06-10 | 松下電子工業株式会社 | Pallet for carrying semiconductor device |
JP2564303B2 (en) * | 1987-05-08 | 1996-12-18 | 株式会社日立製作所 | Wafer carrier jig |
JP2584668B2 (en) * | 1989-03-09 | 1997-02-26 | 富士通株式会社 | Method for manufacturing semiconductor device |
JPH0974131A (en) * | 1995-09-05 | 1997-03-18 | Sony Corp | Wafer carrying case and wafer carrying method |
JPH0974231A (en) * | 1995-09-07 | 1997-03-18 | Nippon Telegr & Teleph Corp <Ntt> | Superconductive three terminal element |
JP2910684B2 (en) * | 1996-07-31 | 1999-06-23 | 日本電気株式会社 | Wafer container |
JPH1126566A (en) * | 1997-06-30 | 1999-01-29 | Komatsu Ltd | Semiconductor wafer package |
JP2004059116A (en) * | 2002-07-31 | 2004-02-26 | Sharp Corp | Tray for storing substrate for display, taking out mechanism for the substrate for display, and method for taking out the substrate for display |
US6877194B2 (en) * | 2003-07-14 | 2005-04-12 | Peak Plastic & Metal Products (International) Ltd. | Open frame tray clip |
US7316325B2 (en) * | 2003-11-07 | 2008-01-08 | Entegris, Inc. | Substrate container |
JP4667769B2 (en) * | 2004-06-11 | 2011-04-13 | 信越ポリマー株式会社 | Substrate storage container |
-
2006
- 2006-02-15 JP JP2006038445A patent/JP5025962B2/en not_active Expired - Fee Related
-
2007
- 2007-02-13 KR KR1020087012345A patent/KR101354029B1/en not_active IP Right Cessation
- 2007-02-13 WO PCT/JP2007/052528 patent/WO2007094324A1/en active Application Filing
- 2007-02-14 TW TW096105459A patent/TWI382948B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103283012A (en) * | 2010-11-11 | 2013-09-04 | 齐默尔曼和席尔普搬运技术有限责任公司 | Method for loading and unloading a cassette |
Also Published As
Publication number | Publication date |
---|---|
JP5025962B2 (en) | 2012-09-12 |
TWI382948B (en) | 2013-01-21 |
KR101354029B1 (en) | 2014-01-23 |
WO2007094324A1 (en) | 2007-08-23 |
KR20080101863A (en) | 2008-11-21 |
JP2007220823A (en) | 2007-08-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |