TW200736128A - Thin-plate storage container - Google Patents

Thin-plate storage container

Info

Publication number
TW200736128A
TW200736128A TW096105459A TW96105459A TW200736128A TW 200736128 A TW200736128 A TW 200736128A TW 096105459 A TW096105459 A TW 096105459A TW 96105459 A TW96105459 A TW 96105459A TW 200736128 A TW200736128 A TW 200736128A
Authority
TW
Taiwan
Prior art keywords
tray
storage container
storage body
tray storage
loading
Prior art date
Application number
TW096105459A
Other languages
Chinese (zh)
Other versions
TWI382948B (en
Inventor
Yukihiro Hyobu
Original Assignee
Miraial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miraial Co Ltd filed Critical Miraial Co Ltd
Publication of TW200736128A publication Critical patent/TW200736128A/en
Application granted granted Critical
Publication of TWI382948B publication Critical patent/TWI382948B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67369Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/54Containers, packaging elements or packages, specially adapted for particular articles or materials for articles of special shape not otherwise provided for
    • B65D85/544Containers, packaging elements or packages, specially adapted for particular articles or materials for articles of special shape not otherwise provided for for gramophone records
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67376Closed carriers characterised by sealing arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67383Closed carriers characterised by substrate supports

Abstract

A thin-plate storage container includes: a tray storage body for loading a plurality of mutually detachable loading trays, holding and storing a semiconductor wafer in a space between the loading trays; and an external storage container for storing the tray storage body therein. Both opposing side ends of each loading tray are provided with a pair of holding portions which a working arm of an external machine device fits and holds. The external storage container includes: a container body; a lid unit; a sealing member, provided between the container body and the lid unit, for sealing the inside; a pair of tray storage body supporting portions for supporting the tray storage body; and a tray storage body retainer for holding and supporting, from the bottom and the lid unit sides, the tray storage body stored in the storage container body.
TW096105459A 2006-02-15 2007-02-14 Thin-plate storage container TWI382948B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006038445A JP5025962B2 (en) 2006-02-15 2006-02-15 Thin plate storage container

Publications (2)

Publication Number Publication Date
TW200736128A true TW200736128A (en) 2007-10-01
TWI382948B TWI382948B (en) 2013-01-21

Family

ID=38371504

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105459A TWI382948B (en) 2006-02-15 2007-02-14 Thin-plate storage container

Country Status (4)

Country Link
JP (1) JP5025962B2 (en)
KR (1) KR101354029B1 (en)
TW (1) TWI382948B (en)
WO (1) WO2007094324A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103283012A (en) * 2010-11-11 2013-09-04 齐默尔曼和席尔普搬运技术有限责任公司 Method for loading and unloading a cassette

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JP4852020B2 (en) * 2007-11-13 2012-01-11 信越ポリマー株式会社 Buffer body and packing body
JP5160298B2 (en) * 2008-05-08 2013-03-13 信越ポリマー株式会社 Substrate storage container
JP2009283537A (en) * 2008-05-20 2009-12-03 Shin Etsu Polymer Co Ltd Substrate-ousing container
JP5532796B2 (en) * 2009-09-29 2014-06-25 凸版印刷株式会社 Glass substrate storage tray
KR20140032942A (en) * 2010-10-20 2014-03-17 인티그리스, 인코포레이티드 Front opening wafer container with door deflection minimization
KR101331839B1 (en) * 2011-11-23 2013-11-21 (주)뉴옵틱스 Nano cylinder vacuum box
KR101408669B1 (en) 2012-10-30 2014-07-02 주식회사 삼에스코리아 Thin plate storage container
KR102154303B1 (en) 2013-08-22 2020-09-09 미라이얼 가부시키가이샤 Substrate storing container
TWI579215B (en) 2016-10-07 2017-04-21 家登精密工業股份有限公司 Vertical Fixing Transmission Box and Transmission Method Using the Same
EP3336615B1 (en) * 2016-12-15 2019-07-31 Nivarox-FAR S.A. Packaging of appliques for timepieces
JP6877317B2 (en) * 2017-11-10 2021-05-26 三菱電機株式会社 Wafer container
KR102075351B1 (en) * 2019-11-04 2020-02-10 이주철 Box jig for control board of the vehicle
US20210300635A1 (en) * 2020-03-24 2021-09-30 Gudeng Precision Industrial Co., Ltd Container system
JP2022076873A (en) * 2020-11-10 2022-05-20 信越ポリマー株式会社 Substrate housing container
KR102498995B1 (en) * 2020-11-30 2023-02-13 주식회사 삼에스코리아 Tray bonding structure of panel storage container
KR102446066B1 (en) * 2021-04-22 2022-09-23 주식회사 삼에스코리아 Tray installed in the panel storage container
KR102546445B1 (en) * 2021-06-25 2023-08-01 (주)이엠씨 Fixing Ribs of Wafer Carrier having a Filter Module made of Antistatic Material
KR102546444B1 (en) * 2021-06-25 2023-08-01 (주)이엠씨 Fixing Ribs of Wafer Carrier having a Filter Module with Antistatic Function
KR102546443B1 (en) * 2021-06-25 2023-06-23 (주)이엠씨 Fixing Ribs of Wafer Carrier having a Filter Module made of Antistatic Material

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63138984A (en) * 1986-11-27 1988-06-10 松下電子工業株式会社 Pallet for carrying semiconductor device
JP2564303B2 (en) * 1987-05-08 1996-12-18 株式会社日立製作所 Wafer carrier jig
JP2584668B2 (en) * 1989-03-09 1997-02-26 富士通株式会社 Method for manufacturing semiconductor device
JPH0974131A (en) * 1995-09-05 1997-03-18 Sony Corp Wafer carrying case and wafer carrying method
JPH0974231A (en) * 1995-09-07 1997-03-18 Nippon Telegr & Teleph Corp <Ntt> Superconductive three terminal element
JP2910684B2 (en) * 1996-07-31 1999-06-23 日本電気株式会社 Wafer container
JPH1126566A (en) * 1997-06-30 1999-01-29 Komatsu Ltd Semiconductor wafer package
JP2004059116A (en) * 2002-07-31 2004-02-26 Sharp Corp Tray for storing substrate for display, taking out mechanism for the substrate for display, and method for taking out the substrate for display
US6877194B2 (en) * 2003-07-14 2005-04-12 Peak Plastic & Metal Products (International) Ltd. Open frame tray clip
US7316325B2 (en) * 2003-11-07 2008-01-08 Entegris, Inc. Substrate container
JP4667769B2 (en) * 2004-06-11 2011-04-13 信越ポリマー株式会社 Substrate storage container

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103283012A (en) * 2010-11-11 2013-09-04 齐默尔曼和席尔普搬运技术有限责任公司 Method for loading and unloading a cassette

Also Published As

Publication number Publication date
JP5025962B2 (en) 2012-09-12
TWI382948B (en) 2013-01-21
KR101354029B1 (en) 2014-01-23
WO2007094324A1 (en) 2007-08-23
KR20080101863A (en) 2008-11-21
JP2007220823A (en) 2007-08-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees