TW200735254A - Electrostatic chuck and producing method thereof - Google Patents

Electrostatic chuck and producing method thereof

Info

Publication number
TW200735254A
TW200735254A TW095111781A TW95111781A TW200735254A TW 200735254 A TW200735254 A TW 200735254A TW 095111781 A TW095111781 A TW 095111781A TW 95111781 A TW95111781 A TW 95111781A TW 200735254 A TW200735254 A TW 200735254A
Authority
TW
Taiwan
Prior art keywords
electrostatic chuck
producing method
layer
ceramics
electrostatic
Prior art date
Application number
TW095111781A
Other languages
English (en)
Inventor
Yasuyoshi Imai
Mitsuru Ohta
Takeru Torigoe
Original Assignee
Ngk Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006057811A external-priority patent/JP2006287210A/ja
Application filed by Ngk Insulators Ltd filed Critical Ngk Insulators Ltd
Publication of TW200735254A publication Critical patent/TW200735254A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095111781A 2006-03-03 2006-04-03 Electrostatic chuck and producing method thereof TW200735254A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006057811A JP2006287210A (ja) 2005-03-07 2006-03-03 静電チャック及びその製造方法

Publications (1)

Publication Number Publication Date
TW200735254A true TW200735254A (en) 2007-09-16

Family

ID=38517561

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095111781A TW200735254A (en) 2006-03-03 2006-04-03 Electrostatic chuck and producing method thereof

Country Status (4)

Country Link
US (1) US20070217117A1 (zh)
KR (1) KR100793676B1 (zh)
CN (1) CN101030550A (zh)
TW (1) TW200735254A (zh)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008041993A (ja) * 2006-08-08 2008-02-21 Shinko Electric Ind Co Ltd 静電チャック
US7633738B2 (en) * 2006-11-01 2009-12-15 Ngk Insulators, Ltd. Electrostatic chuck and manufacturing method thereof
US9631128B2 (en) * 2007-02-09 2017-04-25 Ngk Insulators, Ltd. Bonding material and semiconductor supporting device
JP4976911B2 (ja) * 2007-04-27 2012-07-18 新光電気工業株式会社 静電チャック
JP4974873B2 (ja) * 2007-12-26 2012-07-11 新光電気工業株式会社 静電チャック及び基板温調固定装置
TWI450353B (zh) * 2008-01-08 2014-08-21 Ngk Insulators Ltd A bonding structure and a semiconductor manufacturing apparatus
CN102308378A (zh) * 2008-11-25 2012-01-04 M丘比德技术公司 静电吸盘
US8023247B2 (en) * 2008-12-10 2011-09-20 Axcelis Technologies, Inc. Electrostatic chuck with compliant coat
JP5293211B2 (ja) * 2009-01-14 2013-09-18 Ｔｏｔｏ株式会社 静電チャックおよび静電チャックの製造方法
CN102986017B (zh) * 2010-05-28 2015-09-16 恩特格林斯公司 高表面电阻率静电吸盘
WO2012014873A1 (ja) * 2010-07-26 2012-02-02 京セラ株式会社 静電チャック
KR101353157B1 (ko) * 2010-12-28 2014-01-22 도쿄엘렉트론가부시키가이샤 정전 척
JP6010296B2 (ja) * 2010-12-28 2016-10-19 東京エレクトロン株式会社 静電チャック
KR101981766B1 (ko) * 2011-06-02 2019-05-23 어플라이드 머티어리얼스, 인코포레이티드 정전기 척 aln 유전체 수리
JP5724657B2 (ja) * 2011-06-14 2015-05-27 旭硝子株式会社 ガラス基板保持手段、およびそれを用いたｅｕｖマスクブランクスの製造方法
KR102032744B1 (ko) 2012-09-05 2019-11-11 삼성디스플레이 주식회사 기판 고정장치 및 이의 제조방법
EP2948818B1 (en) * 2013-01-22 2020-07-01 ASML Netherlands B.V. Electrostatic clamp
JP5621142B2 (ja) * 2013-04-02 2014-11-05 独立行政法人産業技術総合研究所 半導体プロセス用キャリア
US20150062772A1 (en) * 2013-08-27 2015-03-05 Varian Semiconductor Equipment Associates, Inc Barrier Layer For Electrostatic Chucks
KR20170002603A (ko) * 2014-05-09 2017-01-06 어플라이드 머티어리얼스, 인코포레이티드 보호 커버링을 갖는 기판 캐리어 시스템
JP6868553B2 (ja) 2014-08-15 2021-05-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ プラズマ化学気相堆積システムにおいて高温で圧縮又は引張応力を有するウェハを処理する方法及び装置
US9909197B2 (en) * 2014-12-22 2018-03-06 Semes Co., Ltd. Supporting unit and substrate treating apparatus including the same
CN104576490A (zh) * 2014-12-31 2015-04-29 上海卡贝尼精密陶瓷有限公司 一种静电吸盘及其制造方法
JP6312926B2 (ja) * 2015-04-02 2018-04-18 株式会社アルバック 吸着方法及び真空処理方法
JP6238097B1 (ja) * 2016-07-20 2017-11-29 Toto株式会社 静電チャック
CN114551322A (zh) * 2017-03-10 2022-05-27 台湾积体电路制造股份有限公司 静电式晶圆吸附座及其制造方法
CN112166497B (zh) * 2018-06-22 2021-12-21 应用材料公司 半导体晶片处理中最小化晶片背侧损伤的方法
TWI819046B (zh) * 2018-08-02 2023-10-21 日商創意科技股份有限公司 靜電吸附體
KR102556739B1 (ko) * 2018-11-19 2023-07-17 엔테그리스, 아이엔씨. 전하 소산 코팅이 적용된 정전 척
CN112534705A (zh) * 2019-04-16 2021-03-19 日本特殊陶业株式会社 保持装置及其制造方法、保持装置用的构造体的制造方法
WO2020261991A1 (ja) * 2019-06-28 2020-12-30 日本碍子株式会社 静電チャック
CN111620701B (zh) * 2020-03-27 2022-05-13 烟台睿瓷新材料技术有限公司 一种多层复合陶瓷盘及其制造方法
KR20220004893A (ko) * 2020-07-03 2022-01-12 삼성디스플레이 주식회사 표시 장치의 제조 장치 및 표시 장치의 제조 방법
CN114388423A (zh) * 2022-01-18 2022-04-22 浙江新纳陶瓷新材有限公司 一种静电吸盘的组装方法
KR102705731B1 (ko) 2024-03-08 2024-09-11 (주)디센하이텍 내마모 기능성층 형성용 조성물을 적용한 정전 척 제조방법
KR102705730B1 (ko) 2024-03-08 2024-09-11 (주)디센하이텍 내마모 기능성 정전 척의 제조 방법

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US3873355A (en) * 1971-01-28 1975-03-25 Ibm Coated carrier particles
US4853300A (en) * 1986-09-24 1989-08-01 United Technologies Corporation Amorphous hydrated metal oxide primer for organic adhesively bonded joints
JP3208029B2 (ja) * 1994-11-22 2001-09-10 株式会社巴川製紙所 静電チャック装置およびその作製方法
US6117246A (en) * 1997-01-31 2000-09-12 Applied Materials, Inc. Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck
JPH1187479A (ja) 1997-09-10 1999-03-30 Shin Etsu Chem Co Ltd 静電チャック
US5903428A (en) * 1997-09-25 1999-05-11 Applied Materials, Inc. Hybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separating the chuck from a wafer supported thereupon and method of fabricating same
TW525256B (en) * 1998-11-25 2003-03-21 Applied Materials Inc Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck
US6490145B1 (en) * 2001-07-18 2002-12-03 Applied Materials, Inc. Substrate support pedestal
US20030047283A1 (en) * 2001-09-10 2003-03-13 Applied Materials, Inc. Apparatus for supporting a substrate and method of fabricating same
JP4260450B2 (ja) * 2002-09-20 2009-04-30 東京エレクトロン株式会社 真空処理装置における静電チャックの製造方法
JP2005285825A (ja) * 2004-03-26 2005-10-13 Advantest Corp 静電チャック及び静電チャックによる基板固定方法

Also Published As

Publication number Publication date
KR100793676B1 (ko) 2008-01-10
US20070217117A1 (en) 2007-09-20
KR20070090701A (ko) 2007-09-06
CN101030550A (zh) 2007-09-05

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