TW200735095A - Molding method of disk substrate and blue-ray disc - Google Patents
Molding method of disk substrate and blue-ray discInfo
- Publication number
- TW200735095A TW200735095A TW095144524A TW95144524A TW200735095A TW 200735095 A TW200735095 A TW 200735095A TW 095144524 A TW095144524 A TW 095144524A TW 95144524 A TW95144524 A TW 95144524A TW 200735095 A TW200735095 A TW 200735095A
- Authority
- TW
- Taiwan
- Prior art keywords
- disc substrate
- cutter
- blue
- external cutter
- molding method
- Prior art date
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
The present invention provides a blue-ray disc substrate or a disc substrate molded in a similar way for overcoming the problems of defectives caused by the burrs formed on a loading part during opening a center hole of a disc substrate or the problems of subsequent processes for dealing with the burrs. With respect to technical means, in a disc substrate molding method for molding a disc substrate (D1) in a cavity (14) formed among a female die (16) for forming a message area (D3), a movable mold tool (12) employed for an external cutter (21) to open a center hole (D2) on the disc substrate (D1), and a fixed mold tool (13) for an internal cutter (27) to be embedded with the external cutter (21) when the external cutter (21) moves forward, the external cutter (21) moves forward towards and embeds with an inner circumferential hole (27c) of the internal cutter (27) after a molten resin is ejected into and filled the cavity (14) so as to mold the disc substrate (D1), which has a loading part (D4) but no burr protruding from a horizontal surface (D10) on the inner circumferential side, on the same message area (D3) surface having a magnetic track interval of 0.010~0.040 μm.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006058819A JP2007237407A (en) | 2006-03-06 | 2006-03-06 | Disk substrate molding method and blue lay disk |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200735095A true TW200735095A (en) | 2007-09-16 |
TWI326082B TWI326082B (en) | 2010-06-11 |
Family
ID=38583418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095144524A TW200735095A (en) | 2006-03-06 | 2006-11-30 | Molding method of disk substrate and blue-ray disc |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2007237407A (en) |
CN (2) | CN101637961A (en) |
TW (1) | TW200735095A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009006615A (en) * | 2007-06-28 | 2009-01-15 | Taiyo Yuden Co Ltd | Optical disk and mold assembly |
CN101777361B (en) * | 2009-12-30 | 2011-08-31 | 东莞宏威数码机械有限公司 | Blue-ray disc die assembly |
CN109648806B (en) * | 2018-11-16 | 2024-01-02 | 温州海航机械有限公司 | Multi-station material shearing device |
CN113681797A (en) * | 2021-08-23 | 2021-11-23 | 合肥通泰光电科技有限公司 | Injection molding flash processing equipment for display screen rubber frame |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04518U (en) * | 1990-04-16 | 1992-01-06 | ||
JP4156982B2 (en) * | 2003-06-13 | 2008-09-24 | 富士フイルム株式会社 | Manufacturing method of optical disk substrate and optical disk substrate |
JP4024775B2 (en) * | 2004-04-13 | 2007-12-19 | 株式会社名機製作所 | Drilling method for the central opening of a disk substrate |
JP4331060B2 (en) * | 2004-06-23 | 2009-09-16 | 株式会社リコー | Organic thin film and manufacturing method thereof, optical recording medium using the thin film, and recording / reproducing method |
-
2006
- 2006-03-06 JP JP2006058819A patent/JP2007237407A/en active Pending
- 2006-11-30 TW TW095144524A patent/TW200735095A/en not_active IP Right Cessation
- 2006-12-19 CN CN200910146732A patent/CN101637961A/en active Pending
- 2006-12-19 CN CNB2006101677236A patent/CN100519139C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101032856A (en) | 2007-09-12 |
CN101637961A (en) | 2010-02-03 |
JP2007237407A (en) | 2007-09-20 |
TWI326082B (en) | 2010-06-11 |
CN100519139C (en) | 2009-07-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |