TW200630198A - Mold for molding disk substrate and method for molding disk substrate - Google Patents

Mold for molding disk substrate and method for molding disk substrate

Info

Publication number
TW200630198A
TW200630198A TW094145253A TW94145253A TW200630198A TW 200630198 A TW200630198 A TW 200630198A TW 094145253 A TW094145253 A TW 094145253A TW 94145253 A TW94145253 A TW 94145253A TW 200630198 A TW200630198 A TW 200630198A
Authority
TW
Taiwan
Prior art keywords
disk substrate
mold
interior hole
cutter
molding
Prior art date
Application number
TW094145253A
Other languages
Chinese (zh)
Other versions
TWI289500B (en
Inventor
Toshiyuki Ebina
Kazuki Nishi
Original Assignee
Meiki Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiki Seisakusho Kk filed Critical Meiki Seisakusho Kk
Publication of TW200630198A publication Critical patent/TW200630198A/en
Application granted granted Critical
Publication of TWI289500B publication Critical patent/TWI289500B/en

Links

Abstract

To solve the following problem: burrs higher than the central area surface of a disk substrate are formed in the interior hole end part of the disk substrate during the molding of the disk substrate, crushed in the following process, dropped on the transfer surface of the disk substrate to cause the occurrence of a defective, and contacted with each other when laminated on another disk substrate to obstruct the lamination. In a mold for molding the disk substrate having a fixed mold (12) and a movable mold (13) forming a cavity (4) when put together, a male cutter (28) which is set in the movable mold (13) and can be projected, a female cutter (19) set in the fixed mold (12) and provided with an interior hole (19a) into which the male cutter (28) is inserted, and a sprue bush (20) which is set in the interior hole (19a) of the female cutter (19) or formed integrally and to which a molten resin is supplied, an annular projection part (30) of the height of 30-80 μm is formed in the tip surface of the female cutter (19) to adjoin the interior hole (19a).
TW94145253A 2005-02-24 2005-12-20 Mold for molding disk substrate and method for molding disk substrate TWI289500B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005049161A JP4369381B2 (en) 2005-02-24 2005-02-24 Disk substrate molding die and disk substrate molding method

Publications (2)

Publication Number Publication Date
TW200630198A true TW200630198A (en) 2006-09-01
TWI289500B TWI289500B (en) 2007-11-11

Family

ID=36935398

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94145253A TWI289500B (en) 2005-02-24 2005-12-20 Mold for molding disk substrate and method for molding disk substrate

Country Status (3)

Country Link
JP (1) JP4369381B2 (en)
CN (1) CN100429065C (en)
TW (1) TWI289500B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI621118B (en) * 2012-11-15 2018-04-11 Sony Corp Manufacturing method of substrate for optical recording medium

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2095928A4 (en) * 2006-11-29 2011-03-02 Sumitomo Heavy Industries Disc forming die, disc substrate and method for forming the disc substrate
CN103737827B (en) * 2014-01-15 2016-04-13 晟扬精密模具（昆山）有限公司 Supporting cast gate
CA2989900C (en) 2015-07-08 2021-08-10 Husky Injection Molding Systems Ltd. Injection molding apparatuses

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11240048A (en) * 1998-02-25 1999-09-07 Meiki Co Ltd Mold for molding disc base and method for molding disc base

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI621118B (en) * 2012-11-15 2018-04-11 Sony Corp Manufacturing method of substrate for optical recording medium

Also Published As

Publication number Publication date
JP2006231687A (en) 2006-09-07
CN100429065C (en) 2008-10-29
TWI289500B (en) 2007-11-11
JP4369381B2 (en) 2009-11-18
CN1824485A (en) 2006-08-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees