TW200732668A - Probe needle for probe card - Google Patents

Probe needle for probe card

Info

Publication number
TW200732668A
TW200732668A TW095139698A TW95139698A TW200732668A TW 200732668 A TW200732668 A TW 200732668A TW 095139698 A TW095139698 A TW 095139698A TW 95139698 A TW95139698 A TW 95139698A TW 200732668 A TW200732668 A TW 200732668A
Authority
TW
Taiwan
Prior art keywords
probe
probe needle
needle
card
probe card
Prior art date
Application number
TW095139698A
Other languages
English (en)
Inventor
Norihisa Himeno
Original Assignee
Tokusen Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokusen Kogyo Kk filed Critical Tokusen Kogyo Kk
Publication of TW200732668A publication Critical patent/TW200732668A/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW095139698A 2005-10-31 2006-10-27 Probe needle for probe card TW200732668A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005315912 2005-10-31
JP2006003418 2006-01-11
JP2006006304A JP2007212139A (ja) 2005-10-31 2006-01-13 プロ−ブカ−ド用プロ−ブピン

Publications (1)

Publication Number Publication Date
TW200732668A true TW200732668A (en) 2007-09-01

Family

ID=38005659

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139698A TW200732668A (en) 2005-10-31 2006-10-27 Probe needle for probe card

Country Status (3)

Country Link
JP (1) JP2007212139A (zh)
TW (1) TW200732668A (zh)
WO (1) WO2007052508A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115109962A (zh) * 2022-06-24 2022-09-27 有研工程技术研究院有限公司 一种汇流环用耐磨高硬度金基合金材料及其制备方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009099183A1 (ja) * 2008-02-06 2009-08-13 Kabushiki Kaisha Toshiba プローブ針およびその製造方法
JP2011022051A (ja) * 2009-07-17 2011-02-03 Kanai Hiroaki プローブピン及びプローブピンの製造方法
JP2011158329A (ja) * 2010-01-29 2011-08-18 Citizen Tohoku Kk コンタクトプローブ及びこれを用いた電子回路試験装置
JP2011180034A (ja) * 2010-03-02 2011-09-15 Citizen Tohoku Kk コンタクトプローブ用プランジャー
US20210088552A1 (en) * 2017-07-10 2021-03-25 Kyosei Co., Ltd. Conductive Member Using Copper-Silver Alloy, Contact Pin and Device
CN115747556A (zh) * 2022-12-21 2023-03-07 江苏苏青电子材料股份有限公司 一种新型的铂基材料、制备方法及其应用和铂合金探针

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270654A (ja) * 2001-03-13 2002-09-20 Kanai Hiroaki プローブカード用プローブピン

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115109962A (zh) * 2022-06-24 2022-09-27 有研工程技术研究院有限公司 一种汇流环用耐磨高硬度金基合金材料及其制备方法
CN115109962B (zh) * 2022-06-24 2023-10-13 有研工程技术研究院有限公司 一种汇流环用耐磨高硬度金基合金材料及其制备方法

Also Published As

Publication number Publication date
WO2007052508A1 (ja) 2007-05-10
JP2007212139A (ja) 2007-08-23

Similar Documents

Publication Publication Date Title
TW200732668A (en) Probe needle for probe card
TW200510552A (en) Cu-Ni-Si based alloy having excellent fatigue property
WO2008033603A3 (en) Medical devices having alloy compositions
TW200602501A (en) Titanium copper having excellent strength, conductivity, and bending workability, and its production method
DE60003654D1 (de) Biomedizinisches gerät oder implantat
BRPI0510535A (pt) liga e produto formado de uma liga
WO2009016706A1 (ja) Cu合金材
CN101681729A (zh) 用于可动接点部件的银包覆材料及其制造方法
EP2088214A4 (en) COPPER ALLOY PLATE FOR ELECTRICAL AND ELECTRONIC COMPONENTS
TW200842212A (en) Silver-coated material for movable contact parts and method of producing the same
TNSN08486A1 (en) Method for connecting two electrically conductive components to one another
JPWO2012077378A1 (ja) 電気・電子用材
ATE345586T1 (de) Elektrischer kontakt
JP2012226994A (ja) コネクタ構造および雌コンタクト
DE502006008364D1 (de) Arbeitselektrode für eine elektrodynamische fragmentierungsanlage
MY149452A (en) Copper-based alloy
AU2015262624B2 (en) Connecting component material
JP2024010013A (ja) 金属製板ばね及びその製造方法
JP2002231357A (ja) 電気接点およびコネクタ
WO2003053843A3 (en) Metal alloy elements in micromachined devices
ATE422372T1 (de) Elektrodeneinrichtung für die elektrodiagnose und/oder -therapie
RU2769371C1 (ru) Электрический контактный элемент
TW200706881A (en) Probe and its manufacturing method
PL2088885T3 (pl) But z elektrycznie przewodzącą podeszwą
MY135981A (en) Titanium article having improved corrosion resistance