TW200732668A - Probe needle for probe card - Google Patents
Probe needle for probe cardInfo
- Publication number
- TW200732668A TW200732668A TW095139698A TW95139698A TW200732668A TW 200732668 A TW200732668 A TW 200732668A TW 095139698 A TW095139698 A TW 095139698A TW 95139698 A TW95139698 A TW 95139698A TW 200732668 A TW200732668 A TW 200732668A
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- probe needle
- needle
- card
- probe card
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005315912 | 2005-10-31 | ||
JP2006003418 | 2006-01-11 | ||
JP2006006304A JP2007212139A (ja) | 2005-10-31 | 2006-01-13 | プロ−ブカ−ド用プロ−ブピン |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200732668A true TW200732668A (en) | 2007-09-01 |
Family
ID=38005659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095139698A TW200732668A (en) | 2005-10-31 | 2006-10-27 | Probe needle for probe card |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2007212139A (zh) |
TW (1) | TW200732668A (zh) |
WO (1) | WO2007052508A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115109962A (zh) * | 2022-06-24 | 2022-09-27 | 有研工程技术研究院有限公司 | 一种汇流环用耐磨高硬度金基合金材料及其制备方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5498173B2 (ja) * | 2008-02-06 | 2014-05-21 | 株式会社東芝 | プローブ針およびその製造方法 |
JP2011022051A (ja) * | 2009-07-17 | 2011-02-03 | Kanai Hiroaki | プローブピン及びプローブピンの製造方法 |
JP2011158329A (ja) * | 2010-01-29 | 2011-08-18 | Citizen Tohoku Kk | コンタクトプローブ及びこれを用いた電子回路試験装置 |
JP2011180034A (ja) * | 2010-03-02 | 2011-09-15 | Citizen Tohoku Kk | コンタクトプローブ用プランジャー |
WO2019013163A1 (ja) * | 2017-07-10 | 2019-01-17 | 株式会社協成 | 銅銀合金を用いた導電性部材、コンタクトピン及び装置 |
CN115747556A (zh) * | 2022-12-21 | 2023-03-07 | 江苏苏青电子材料股份有限公司 | 一种新型的铂基材料、制备方法及其应用和铂合金探针 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002270654A (ja) * | 2001-03-13 | 2002-09-20 | Kanai Hiroaki | プローブカード用プローブピン |
-
2006
- 2006-01-13 JP JP2006006304A patent/JP2007212139A/ja active Pending
- 2006-10-25 WO PCT/JP2006/321233 patent/WO2007052508A1/ja active Application Filing
- 2006-10-27 TW TW095139698A patent/TW200732668A/zh unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115109962A (zh) * | 2022-06-24 | 2022-09-27 | 有研工程技术研究院有限公司 | 一种汇流环用耐磨高硬度金基合金材料及其制备方法 |
CN115109962B (zh) * | 2022-06-24 | 2023-10-13 | 有研工程技术研究院有限公司 | 一种汇流环用耐磨高硬度金基合金材料及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2007052508A1 (ja) | 2007-05-10 |
JP2007212139A (ja) | 2007-08-23 |
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