TW200732462A - Polishing composition for polishing semiconductor wafer, method for manufacturing the same, and polishing method - Google Patents

Polishing composition for polishing semiconductor wafer, method for manufacturing the same, and polishing method

Info

Publication number
TW200732462A
TW200732462A TW096102959A TW96102959A TW200732462A TW 200732462 A TW200732462 A TW 200732462A TW 096102959 A TW096102959 A TW 096102959A TW 96102959 A TW96102959 A TW 96102959A TW 200732462 A TW200732462 A TW 200732462A
Authority
TW
Taiwan
Prior art keywords
polishing
semiconductor wafer
composition
manufacturing
same
Prior art date
Application number
TW096102959A
Other languages
English (en)
Other versions
TWI366598B (zh
Inventor
Kuniaki Maejima
Shinsuke Miyabe
Masahiro Izumi
Hiroaki Tanaka
Original Assignee
Nippon Chemical Ind
Speedfam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemical Ind, Speedfam Co Ltd filed Critical Nippon Chemical Ind
Publication of TW200732462A publication Critical patent/TW200732462A/zh
Application granted granted Critical
Publication of TWI366598B publication Critical patent/TWI366598B/zh

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW096102959A 2006-02-07 2007-01-26 Polishing composition for polishing semiconductor wafer, method for manufacturing the same, and polishing method TW200732462A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006029435A JP5373250B2 (ja) 2006-02-07 2006-02-07 半導体ウエハ研磨用組成物の製造方法

Publications (2)

Publication Number Publication Date
TW200732462A true TW200732462A (en) 2007-09-01
TWI366598B TWI366598B (zh) 2012-06-21

Family

ID=38492367

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096102959A TW200732462A (en) 2006-02-07 2007-01-26 Polishing composition for polishing semiconductor wafer, method for manufacturing the same, and polishing method

Country Status (2)

Country Link
JP (1) JP5373250B2 (zh)
TW (1) TW200732462A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009188058A (ja) * 2008-02-04 2009-08-20 Nippon Chem Ind Co Ltd 半導体ウエハ研磨用コロイダルシリカおよびその製造方法
JP6946377B2 (ja) * 2015-03-19 2021-10-06 株式会社神戸製鋼所 樹脂塗装金属板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61209910A (ja) * 1985-03-15 1986-09-18 Tama Kagaku Kogyo Kk ポリツシング用コロイダルシリカの製造方法
JP2001294417A (ja) * 2000-04-12 2001-10-23 Nippon Chem Ind Co Ltd コロイダルシリカの製造方法
JP4643085B2 (ja) * 2001-09-19 2011-03-02 日本化学工業株式会社 研磨剤用高純度コロイダルシリカの製造方法
JP4042906B2 (ja) * 2003-05-06 2008-02-06 日本化学工業株式会社 研磨用組成物，研磨用組成物の調整方法および研磨方法
JP4291665B2 (ja) * 2003-10-15 2009-07-08 日本化学工業株式会社 珪酸質材料用研磨剤組成物およびそれを用いた研磨方法
JP3691048B1 (ja) * 2004-08-09 2005-08-31 日本化学工業株式会社 高純度コロイダルシリカの製造方法

Also Published As

Publication number Publication date
TWI366598B (zh) 2012-06-21
JP2007214173A (ja) 2007-08-23
JP5373250B2 (ja) 2013-12-18

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