TW200731293A - Conductive glue and ceramics multi-layer circuit substrate using such conductive glue - Google Patents
Conductive glue and ceramics multi-layer circuit substrate using such conductive glueInfo
- Publication number
- TW200731293A TW200731293A TW095110878A TW95110878A TW200731293A TW 200731293 A TW200731293 A TW 200731293A TW 095110878 A TW095110878 A TW 095110878A TW 95110878 A TW95110878 A TW 95110878A TW 200731293 A TW200731293 A TW 200731293A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive glue
- circuit substrate
- layer circuit
- conductive
- ceramics
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Conductive Materials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006025826A JP4819516B2 (ja) | 2006-02-02 | 2006-02-02 | 導電性ペースト及びその導電性ペーストを用いたセラミック多層回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200731293A true TW200731293A (en) | 2007-08-16 |
TWI322995B TWI322995B (ja) | 2010-04-01 |
Family
ID=38486870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095110878A TW200731293A (en) | 2006-02-02 | 2006-03-29 | Conductive glue and ceramics multi-layer circuit substrate using such conductive glue |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4819516B2 (ja) |
KR (1) | KR101118361B1 (ja) |
TW (1) | TW200731293A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI508103B (zh) * | 2008-01-17 | 2015-11-11 | Nichia Corp | A method of manufacturing a conductive material, a conductive material obtained by the method, an electronic device including the conductive material, a light-emitting device, a light-emitting device manufacturing method |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100866577B1 (ko) * | 2007-09-28 | 2008-11-03 | 삼성전기주식회사 | 인쇄회로기판의 층간 도통방법 |
JP5313526B2 (ja) * | 2008-03-17 | 2013-10-09 | 京都エレックス株式会社 | 低温焼成多層基板用導電性ペースト |
KR100946589B1 (ko) * | 2008-04-03 | 2010-03-09 | 엘지이노텍 주식회사 | 반도체 소자 제조용 접착 페이스트 조성물 |
JP5814204B2 (ja) * | 2012-09-10 | 2015-11-17 | 京都エレックス株式会社 | Led用セラミックパッケージ用ペースト |
JP5849036B2 (ja) * | 2012-09-27 | 2016-01-27 | 富士フイルム株式会社 | 導電ペースト、プリント配線基板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0613756A (ja) * | 1992-06-25 | 1994-01-21 | Matsushita Electric Ind Co Ltd | 導体ペースト組成物 |
JP2001307549A (ja) | 2000-04-21 | 2001-11-02 | Furuya Kinzoku:Kk | 銀ペースト及びその製造方法 |
JP3757211B2 (ja) * | 2003-03-14 | 2006-03-22 | 富士通株式会社 | 配線基板及びその製造方法 |
JP2005293851A (ja) * | 2004-03-10 | 2005-10-20 | Toyobo Co Ltd | 導電性ペースト |
JP2005267900A (ja) * | 2004-03-16 | 2005-09-29 | Sumitomo Osaka Cement Co Ltd | 導電性ペースト及びその製造方法 |
-
2006
- 2006-02-02 JP JP2006025826A patent/JP4819516B2/ja active Active
- 2006-03-29 TW TW095110878A patent/TW200731293A/zh not_active IP Right Cessation
- 2006-04-07 KR KR1020060032083A patent/KR101118361B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI508103B (zh) * | 2008-01-17 | 2015-11-11 | Nichia Corp | A method of manufacturing a conductive material, a conductive material obtained by the method, an electronic device including the conductive material, a light-emitting device, a light-emitting device manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
JP4819516B2 (ja) | 2011-11-24 |
JP2007207604A (ja) | 2007-08-16 |
TWI322995B (ja) | 2010-04-01 |
KR20070079548A (ko) | 2007-08-07 |
KR101118361B1 (ko) | 2012-03-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |