TW200730829A - Finger tester for the testing of non-componented printed circuit boards and method of testing non-componented printed circuit boards with a finger tester - Google Patents

Finger tester for the testing of non-componented printed circuit boards and method of testing non-componented printed circuit boards with a finger tester

Info

Publication number
TW200730829A
TW200730829A TW095149348A TW95149348A TW200730829A TW 200730829 A TW200730829 A TW 200730829A TW 095149348 A TW095149348 A TW 095149348A TW 95149348 A TW95149348 A TW 95149348A TW 200730829 A TW200730829 A TW 200730829A
Authority
TW
Taiwan
Prior art keywords
printed circuit
testing
circuit boards
finger tester
componented
Prior art date
Application number
TW095149348A
Other languages
English (en)
Other versions
TWI356168B (en
Inventor
Victor Romanov
Original Assignee
Atg Test Systems Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atg Test Systems Gmbh filed Critical Atg Test Systems Gmbh
Publication of TW200730829A publication Critical patent/TW200730829A/zh
Application granted granted Critical
Publication of TWI356168B publication Critical patent/TWI356168B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07392—Multiple probes manipulating each probe element or tip individually
TW095149348A 2006-02-10 2006-12-27 Finger tester for the testing of non-componented p TWI356168B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006006255A DE102006006255A1 (de) 2006-02-10 2006-02-10 Fingertester zum Prüfen von unbestückten Leiterplatten und Verfahren zum Prüfen unbestückter Leiterplatten mit einem Fingertester

Publications (2)

Publication Number Publication Date
TW200730829A true TW200730829A (en) 2007-08-16
TWI356168B TWI356168B (en) 2012-01-11

Family

ID=37684491

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095149348A TWI356168B (en) 2006-02-10 2006-12-27 Finger tester for the testing of non-componented p

Country Status (10)

Country Link
US (1) US7859281B2 (zh)
EP (1) EP1982197B1 (zh)
JP (1) JP5080498B2 (zh)
KR (1) KR101005197B1 (zh)
CN (1) CN101479610B (zh)
AT (1) ATE475891T1 (zh)
DE (2) DE102006006255A1 (zh)
HK (1) HK1130538A1 (zh)
TW (1) TWI356168B (zh)
WO (1) WO2007090447A1 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10160119A1 (de) * 2001-12-07 2003-10-02 Atg Test Systems Gmbh Prüfsonde für einen Fingertester
DE102010023187A1 (de) 2010-06-09 2011-12-15 Dtg International Gmbh Vorrichtung und Verfahren zum Untersuchen von Leiterplatten
CN102785252A (zh) * 2011-05-19 2012-11-21 鸿富锦精密工业（深圳）有限公司 机械手及检测装置
CN102621482B (zh) * 2012-04-24 2014-08-20 河南正泰信创新基地有限公司 一种测试探笔针下点校正方法
US9989583B2 (en) * 2013-03-13 2018-06-05 Xcerra Corporation Cross-bar unit for a test apparatus for circuit boards, and test apparatus containing the former
DE102013102564A1 (de) * 2013-03-13 2014-09-18 Dtg International Gmbh Traverseneinheit für eine Prüfvorrichtung für Leiterplatten, sowie Prüfvorrichtung damit
US10330706B2 (en) * 2014-06-04 2019-06-25 Telefonaktiebolaget Lm Ericsson (Publ) Optical electrical measurement system, a measurement probe and a method therefor
TWI530700B (zh) 2015-03-11 2016-04-21 旺矽科技股份有限公司 測試機台及其操作方法
WO2017117257A1 (en) * 2015-12-28 2017-07-06 Celadon Systems, Inc. Modular rail systems, rail systems, mechanisms, and equipment for devices under test
US10371718B2 (en) 2016-11-14 2019-08-06 International Business Machines Corporation Method for identification of proper probe placement on printed circuit board
CN111795930B (zh) * 2020-08-09 2021-09-21 泰州市博泰电子有限公司 一种移动通信电路板通用测试夹具
CN113866587A (zh) * 2021-08-20 2021-12-31 苏州恒测电子科技有限公司 一种飞针测试设备
CN114354986B (zh) * 2022-01-18 2022-11-11 苏州格拉尼视觉科技有限公司 飞针测试机及其测试轴极性分配方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3120114A1 (de) * 1981-05-20 1983-01-05 Roman 8190 Wolfratshausen Koller Anordnung und verfahren zur erfassung und ueberpruefung von elektrischen netzwerken
JPS62176281A (ja) * 1986-01-29 1987-08-03 Toshiba Corp 画像入力装置
JPS6361136U (zh) * 1986-10-08 1988-04-22
US5408189A (en) * 1990-05-25 1995-04-18 Everett Charles Technologies, Inc. Test fixture alignment system for printed circuit boards
EP0468153B1 (de) 1990-07-25 1995-10-11 atg test systems GmbH Kontaktierungsvorrichtung für Prüfzwecke
JPH04340484A (ja) * 1991-05-17 1992-11-26 Fujitsu Ltd 多軸プローブ位置決め装置
US5150041A (en) * 1991-06-21 1992-09-22 Compaq Computer Corporation Optically alignable printed circuit board test fixture apparatus and associated methods
JPH08233862A (ja) * 1995-02-23 1996-09-13 Okano Denki Kk 基板検査用プローブ装置
DE19700505A1 (de) * 1997-01-09 1998-07-16 Atg Test Systems Gmbh Verfahren zum Prüfen von Leiterplatten
JPH10332792A (ja) * 1997-05-29 1998-12-18 Hioki Ee Corp 基板検査用カメラの照明装置
US6268719B1 (en) * 1998-09-23 2001-07-31 Delaware Capital Formation, Inc. Printed circuit board test apparatus
EP0989409A1 (en) 1998-09-23 2000-03-29 Delaware Capital Formation, Inc. Scan test machine for densely spaced test sites
DE19844428B4 (de) * 1998-09-28 2004-05-13 Atg Test Systems Gmbh & Co.Kg Prüfsonde für einen Fingertester, ein Verfahren zum Ansteuern einer Prüfsonde, Fingertester zum Prüfen von Leiterplatten und ein Verfahren zum Prüfen von Leiterplatten mit einem Fingertester
US6384614B1 (en) * 2000-02-05 2002-05-07 Fluke Corporation Single tip Kelvin probe
JP2001284416A (ja) * 2000-03-30 2001-10-12 Nagase & Co Ltd 低温試験装置
DE10160119A1 (de) * 2001-12-07 2003-10-02 Atg Test Systems Gmbh Prüfsonde für einen Fingertester
DE10220343B4 (de) * 2002-05-07 2007-04-05 Atg Test Systems Gmbh & Co. Kg Reicholzheim Vorrichtung und Verfahren zum Prüfen von Leiterplatten und Prüfsonde
WO2004006302A2 (en) * 2002-07-08 2004-01-15 Multiprobe, Inc. Software synchronization of multiple scanning probes
JP2006194685A (ja) * 2005-01-12 2006-07-27 Cabin Industrial Co Ltd プリント基板の外観検査装置
DE102006005800B4 (de) 2006-02-08 2007-12-06 Atg Test Systems Gmbh Verfahren und Vorrichtung zum Testen von unbestückten Leiterplatten

Also Published As

Publication number Publication date
DE102006006255A1 (de) 2007-08-23
CN101479610B (zh) 2015-11-25
US7859281B2 (en) 2010-12-28
HK1130538A1 (zh) 2009-12-31
EP1982197B1 (de) 2010-07-28
KR101005197B1 (ko) 2010-12-31
ATE475891T1 (de) 2010-08-15
DE502006007563D1 (de) 2010-09-09
JP5080498B2 (ja) 2012-11-21
EP1982197A1 (de) 2008-10-22
CN101479610A (zh) 2009-07-08
JP2009524071A (ja) 2009-06-25
KR20080093457A (ko) 2008-10-21
US20080272793A1 (en) 2008-11-06
TWI356168B (en) 2012-01-11
WO2007090447A1 (de) 2007-08-16

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