TW200730287A - Laser cutting device, laser cutting system, and laser cutting method for brittle material - Google Patents
Laser cutting device, laser cutting system, and laser cutting method for brittle materialInfo
- Publication number
- TW200730287A TW200730287A TW095134831A TW95134831A TW200730287A TW 200730287 A TW200730287 A TW 200730287A TW 095134831 A TW095134831 A TW 095134831A TW 95134831 A TW95134831 A TW 95134831A TW 200730287 A TW200730287 A TW 200730287A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- laser cutting
- holding table
- relative
- cutting line
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Mining & Mineral Resources (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The present invention provides a laser cutting device for a brittle material capable of realizing the high quality and high speed cutting of a brittle substrate irrespective of the size of the substrate to be cut. In the laser cutting device, the substrate is positioned on the holding table of a substrate holding mechanism while its lower end part is supported by rollers. The holding table is kept in a titled state by a predetermined angle (theta) relative to a vertical direction (P) so that the substrate can be held on the holding table in such a state that a planned cutting line for the substrate is tilted by the predetermined angle (theta) relative to the vertical direction (P). The substrate is held in a floated state by pressure air jetted from the pressure air holes of the holding table. When a laser illuminating unit and a cooling unit are moved, by a moving unit, from the upper side to the lower side of the substrate along the planned cutting line for the substrate relative to the substrate positioned by the substrate holding mechanism, a crack advances from the upper side to the lower side of the substrate along the planned cutting line.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005281612 | 2005-09-28 | ||
JP2006076917 | 2006-03-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200730287A true TW200730287A (en) | 2007-08-16 |
Family
ID=37899548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095134831A TW200730287A (en) | 2005-09-28 | 2006-09-20 | Laser cutting device, laser cutting system, and laser cutting method for brittle material |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200730287A (en) |
WO (1) | WO2007037118A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5171186B2 (en) * | 2007-09-27 | 2013-03-27 | 三星ダイヤモンド工業株式会社 | Brittle material substrate cleaving apparatus and cleaving method |
JP5070299B2 (en) * | 2007-12-21 | 2012-11-07 | 三星ダイヤモンド工業株式会社 | Laser processing apparatus and laser processing method |
ATE531083T1 (en) * | 2008-06-25 | 2011-11-15 | Atec Holding Ag | DEVICE FOR STRUCTURING A SOLAR MODULE |
US8528886B2 (en) | 2009-02-02 | 2013-09-10 | Corning Incorporated | Material sheet handling system and processing methods |
JP2011131229A (en) * | 2009-12-24 | 2011-07-07 | Hitachi High-Technologies Corp | Laser beam machining method, laser beam machining apparatus, and solar panel manufacturing method |
JP6255595B2 (en) * | 2012-10-12 | 2018-01-10 | 株式会社Ihi | Cleaving device |
CN104091914B (en) * | 2014-03-07 | 2016-02-17 | 深圳市信宇人科技有限公司 | Battery pole piece impulse-free robustness hypervelocity cutting method and hypervelocity slicing machine |
JP6269876B2 (en) * | 2017-03-16 | 2018-01-31 | 株式会社Ihi | Cleaving device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69629704T2 (en) * | 1995-08-31 | 2004-07-08 | Corning Inc. | METHOD AND DEVICE FOR BREAKING BRITTLE MATERIAL |
JP2003034545A (en) * | 2001-07-18 | 2003-02-07 | Seiko Epson Corp | Laser cutting device and method used for the same, method for cutting electroptical panel |
JP2003025323A (en) * | 2001-07-18 | 2003-01-29 | Seiko Epson Corp | Method and device for laser cutting, method for cutting electro-optical panel |
EP1350769A1 (en) * | 2002-04-04 | 2003-10-08 | Bystronic Maschinen AG | Apparatus and method to cut vertical glass sheets |
JP2004130342A (en) * | 2002-10-09 | 2004-04-30 | Seishin Shoji Kk | Double-side machining device for blank |
JP3929393B2 (en) * | 2002-12-03 | 2007-06-13 | 株式会社日本エミック | Cutting device |
JP2005001264A (en) * | 2003-06-12 | 2005-01-06 | Sharp Corp | Parting device and parting method |
-
2006
- 2006-09-12 WO PCT/JP2006/318039 patent/WO2007037118A1/en active Application Filing
- 2006-09-20 TW TW095134831A patent/TW200730287A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2007037118A1 (en) | 2007-04-05 |
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