WO2009011246A1 - Method for processing brittle material substrate and crack forming apparatus used in the method - Google Patents

Method for processing brittle material substrate and crack forming apparatus used in the method Download PDF

Info

Publication number
WO2009011246A1
WO2009011246A1 PCT/JP2008/062305 JP2008062305W WO2009011246A1 WO 2009011246 A1 WO2009011246 A1 WO 2009011246A1 JP 2008062305 W JP2008062305 W JP 2008062305W WO 2009011246 A1 WO2009011246 A1 WO 2009011246A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
cut
crack
laser
cutting
Prior art date
Application number
PCT/JP2008/062305
Other languages
French (fr)
Japanese (ja)
Inventor
Seiji Shimizu
Hideki Morita
Kenji Fukuhara
Koji Yamamoto
Original Assignee
Mitsuboshi Diamond Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2007184613 priority Critical
Priority to JP2007-184613 priority
Application filed by Mitsuboshi Diamond Industrial Co., Ltd. filed Critical Mitsuboshi Diamond Industrial Co., Ltd.
Publication of WO2009011246A1 publication Critical patent/WO2009011246A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00Metal working
    • Y10S29/001Method or apparatus involving adhesive

Abstract

Provided is a method for processing a brittle material substrate, in which cutting is performed with excellent end surface qualities on a cut surface and excellent linearity. In the method for cutting the brittle material substrate to be cut, the substrate is cut by permitting a crack to develop in the substrate. The substrate is cut by the following steps. In a step (a), a supporting substrate is firmly fixed on the substrate. The supporting substrate permits heat, which reaches the lower surface of the substrate from the upper surface when the substrate is irradiated with a laser beam, to be transmitted from the lower surface of the substrate by heat conduction and operates to generate distortion to form a protrusion in the vicinity of a cut planned line after cooling. Then, in a step (b), the substrate is irradiated with a laser beam by relatively moving the laser beam, and a crack is developed while cutting the substrate by a vertical breakage wherein the crack develops in the thickness direction by being cooled, and in a step (c) firm adhesion between the supporting substrate and the substrate to be processed is released.
PCT/JP2008/062305 2007-07-13 2008-07-08 Method for processing brittle material substrate and crack forming apparatus used in the method WO2009011246A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007184613 2007-07-13
JP2007-184613 2007-07-13

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020097025243A KR101094699B1 (en) 2007-07-13 2008-07-08 Method for processing brittle material substrate and crack forming apparatus used in the method
CN200880024033.2A CN101687342B (en) 2007-07-13 2008-07-08 Method for processing brittle material substrate and crack forming apparatus used in the method
JP2009523603A JP5108886B2 (en) 2007-07-13 2008-07-08 Method for processing brittle material substrate and crack forming apparatus used therefor

Publications (1)

Publication Number Publication Date
WO2009011246A1 true WO2009011246A1 (en) 2009-01-22

Family

ID=40259584

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062305 WO2009011246A1 (en) 2007-07-13 2008-07-08 Method for processing brittle material substrate and crack forming apparatus used in the method

Country Status (5)

Country Link
JP (1) JP5108886B2 (en)
KR (1) KR101094699B1 (en)
CN (1) CN101687342B (en)
TW (1) TWI409122B (en)
WO (1) WO2009011246A1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101927402A (en) * 2009-06-17 2010-12-29 三星钻石工业股份有限公司 Method for cutting off brittle material substrate
JP2012526721A (en) * 2009-05-13 2012-11-01 コーニング インコーポレイテッド How to cut brittle materials
KR101200789B1 (en) * 2009-06-30 2012-11-13 미쓰보시 다이야몬도 고교 가부시키가이샤 Method for dividing brittle material substrate
WO2013082830A1 (en) * 2011-12-05 2013-06-13 深圳市华星光电技术有限公司 Cutting device and method for glass substrate
JP2013136073A (en) * 2011-12-28 2013-07-11 Mitsuboshi Diamond Industrial Co Ltd Method for splitting workpiece and method for splitting substrate with optical element pattern
WO2013151075A1 (en) * 2012-04-05 2013-10-10 日本電気硝子株式会社 Glass film fracturing method and glass film laminate body
WO2013151074A1 (en) * 2012-04-05 2013-10-10 日本電気硝子株式会社 Glass film fracturing method and glass film laminate body
KR101369211B1 (en) * 2010-08-27 2014-03-04 미쓰보시 다이야몬도 고교 가부시키가이샤 Laser cutting device
JP2014065629A (en) * 2012-09-26 2014-04-17 Mitsuboshi Diamond Industrial Co Ltd Dividing method and scribing device of brittle material substrate
JP2014065630A (en) * 2012-09-26 2014-04-17 Mitsuboshi Diamond Industrial Co Ltd Dividing method and scribing device of brittle material substrate
WO2014171396A1 (en) * 2013-04-15 2014-10-23 旭硝子株式会社 Method for cutting glass sheet
JP2015071515A (en) * 2013-10-04 2015-04-16 日本電気硝子株式会社 Glass film cleaving method and film glass manufacturing method
EP2873481A1 (en) * 2013-11-13 2015-05-20 Asahi Glass Co., Ltd. A method and an apparatus for forming a groove in a substrate using laser or arc heating spot
JP2017095295A (en) * 2015-11-20 2017-06-01 旭硝子株式会社 Method for cutting glass laminate

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011177782A (en) * 2010-03-04 2011-09-15 Mitsubishi Materials Corp Laser beam machining method
CN102858489B (en) * 2010-04-12 2014-12-31 三菱电机株式会社 Laser-cutting method and laser-cutting device
JP6303861B2 (en) * 2014-06-25 2018-04-04 三星ダイヤモンド工業株式会社 Single crystal substrate cutting method
KR101641939B1 (en) * 2014-07-14 2016-07-22 한국미쯔보시다이아몬드공업(주) Apparatus and method for breaking substrate
CN105436712B (en) * 2015-12-07 2017-12-12 武汉铱科赛科技有限公司 The fragility splinter method and system of a kind of brittle semiconductor materials

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002047025A (en) * 2000-07-31 2002-02-12 Seiko Epson Corp Cutting method of substrate, and manufacturing method of electrooptical device using it and laser cutting device for it and electrooptical device and electronic equipment
JP2004025187A (en) * 2002-05-10 2004-01-29 Japan Science & Technology Corp Freeze-chucking method and device in laser cutting
JP2005153035A (en) * 2003-11-20 2005-06-16 Kyocera Corp Wire saw device
JP2005263578A (en) * 2004-03-19 2005-09-29 Shibaura Mechatronics Corp System and method of cleaving brittle material
WO2007049668A1 (en) * 2005-10-28 2007-05-03 Mitsuboshi Diamond Industrial Co., Ltd. Method of forming scribe line on substrate of brittle material and scribe line forming apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005212364A (en) * 2004-01-30 2005-08-11 Shibaura Mechatronics Corp Fracturing system of brittle material and method thereof
WO2006038565A1 (en) * 2004-10-01 2006-04-13 Mitsuboshi Diamond Industrial Co., Ltd. Brittle material scribing method and scribing apparatus
JP2006150642A (en) * 2004-11-26 2006-06-15 Rorze Corp Cell and cell manufacturing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002047025A (en) * 2000-07-31 2002-02-12 Seiko Epson Corp Cutting method of substrate, and manufacturing method of electrooptical device using it and laser cutting device for it and electrooptical device and electronic equipment
JP2004025187A (en) * 2002-05-10 2004-01-29 Japan Science & Technology Corp Freeze-chucking method and device in laser cutting
JP2005153035A (en) * 2003-11-20 2005-06-16 Kyocera Corp Wire saw device
JP2005263578A (en) * 2004-03-19 2005-09-29 Shibaura Mechatronics Corp System and method of cleaving brittle material
WO2007049668A1 (en) * 2005-10-28 2007-05-03 Mitsuboshi Diamond Industrial Co., Ltd. Method of forming scribe line on substrate of brittle material and scribe line forming apparatus

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012526721A (en) * 2009-05-13 2012-11-01 コーニング インコーポレイテッド How to cut brittle materials
CN101927402A (en) * 2009-06-17 2010-12-29 三星钻石工业股份有限公司 Method for cutting off brittle material substrate
KR101200789B1 (en) * 2009-06-30 2012-11-13 미쓰보시 다이야몬도 고교 가부시키가이샤 Method for dividing brittle material substrate
KR101369211B1 (en) * 2010-08-27 2014-03-04 미쓰보시 다이야몬도 고교 가부시키가이샤 Laser cutting device
WO2013082830A1 (en) * 2011-12-05 2013-06-13 深圳市华星光电技术有限公司 Cutting device and method for glass substrate
JP2013136073A (en) * 2011-12-28 2013-07-11 Mitsuboshi Diamond Industrial Co Ltd Method for splitting workpiece and method for splitting substrate with optical element pattern
EP2835361A4 (en) * 2012-04-05 2015-12-30 Nippon Electric Glass Co Glass film fracturing method and glass film laminate body
WO2013151074A1 (en) * 2012-04-05 2013-10-10 日本電気硝子株式会社 Glass film fracturing method and glass film laminate body
JP2013216513A (en) * 2012-04-05 2013-10-24 Nippon Electric Glass Co Ltd Method for cutting glass film and glass film lamination body
JP2013230962A (en) * 2012-04-05 2013-11-14 Nippon Electric Glass Co Ltd Method for cleaving glass film and glass film laminate
US9212080B2 (en) 2012-04-05 2015-12-15 Nippon Electric Glass Co., Ltd. Glass film cleaving method and glass film laminate
WO2013151075A1 (en) * 2012-04-05 2013-10-10 日本電気硝子株式会社 Glass film fracturing method and glass film laminate body
JP2014065630A (en) * 2012-09-26 2014-04-17 Mitsuboshi Diamond Industrial Co Ltd Dividing method and scribing device of brittle material substrate
JP2014065629A (en) * 2012-09-26 2014-04-17 Mitsuboshi Diamond Industrial Co Ltd Dividing method and scribing device of brittle material substrate
WO2014171396A1 (en) * 2013-04-15 2014-10-23 旭硝子株式会社 Method for cutting glass sheet
JP2015071515A (en) * 2013-10-04 2015-04-16 日本電気硝子株式会社 Glass film cleaving method and film glass manufacturing method
EP2873481A1 (en) * 2013-11-13 2015-05-20 Asahi Glass Co., Ltd. A method and an apparatus for forming a groove in a substrate using laser or arc heating spot
JP2017095295A (en) * 2015-11-20 2017-06-01 旭硝子株式会社 Method for cutting glass laminate

Also Published As

Publication number Publication date
JP5108886B2 (en) 2012-12-26
TWI409122B (en) 2013-09-21
CN101687342B (en) 2015-01-21
JPWO2009011246A1 (en) 2010-09-16
CN101687342A (en) 2010-03-31
KR101094699B1 (en) 2011-12-20
KR20100010505A (en) 2010-02-01
TW200918224A (en) 2009-05-01

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