TW200727488A - Transistor structure and electronics device - Google Patents
Transistor structure and electronics deviceInfo
- Publication number
- TW200727488A TW200727488A TW095113820A TW95113820A TW200727488A TW 200727488 A TW200727488 A TW 200727488A TW 095113820 A TW095113820 A TW 095113820A TW 95113820 A TW95113820 A TW 95113820A TW 200727488 A TW200727488 A TW 200727488A
- Authority
- TW
- Taiwan
- Prior art keywords
- base wiring
- ballast resistor
- transistor structure
- base
- emitter
- Prior art date
Links
- 230000005684 electric field Effects 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/7302—Bipolar junction transistors structurally associated with other devices
- H01L29/7304—Bipolar junction transistors structurally associated with other devices the device being a resistive element, e.g. ballasting resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005149683A JP2006332117A (ja) | 2005-05-23 | 2005-05-23 | トランジスタ構造および電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200727488A true TW200727488A (en) | 2007-07-16 |
Family
ID=37443884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095113820A TW200727488A (en) | 2005-05-23 | 2006-04-18 | Transistor structure and electronics device |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060261373A1 (zh) |
JP (1) | JP2006332117A (zh) |
KR (1) | KR100742741B1 (zh) |
CN (1) | CN1870290A (zh) |
TW (1) | TW200727488A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190181251A1 (en) * | 2017-12-07 | 2019-06-13 | Qualcomm Incorporated | Mesh structure for heterojunction bipolar transistors for rf applications |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3918080A (en) * | 1968-06-21 | 1975-11-04 | Philips Corp | Multiemitter transistor with continuous ballast resistor |
US4686557A (en) * | 1980-09-19 | 1987-08-11 | Siemens Aktiengesellschaft | Semiconductor element and method for producing the same |
JPS5799771A (en) * | 1980-12-12 | 1982-06-21 | Hitachi Ltd | Semiconductor device |
JPS57138174A (en) * | 1981-02-20 | 1982-08-26 | Hitachi Ltd | Semiconductor device |
US4486770A (en) * | 1981-04-27 | 1984-12-04 | General Motors Corporation | Isolated integrated circuit transistor with transient protection |
DE3329241A1 (de) * | 1983-08-12 | 1985-02-21 | Siemens AG, 1000 Berlin und 8000 München | Leistungstransistor |
US4656496A (en) * | 1985-02-04 | 1987-04-07 | National Semiconductor Corporation | Power transistor emitter ballasting |
JPH0744188B2 (ja) * | 1989-04-28 | 1995-05-15 | 株式会社東海理化電機製作所 | バイポーラトランジスタ |
EP0560123A3 (en) * | 1992-03-12 | 1994-05-25 | Siemens Ag | Power transistor with multiple finger contacts |
US5374844A (en) * | 1993-03-25 | 1994-12-20 | Micrel, Inc. | Bipolar transistor structure using ballast resistor |
JPH08279562A (ja) * | 1994-07-20 | 1996-10-22 | Mitsubishi Electric Corp | 半導体装置、及びその製造方法 |
US5554880A (en) * | 1994-08-08 | 1996-09-10 | Semicoa Semiconductors | Uniform current density and high current gain bipolar transistor |
KR100210330B1 (ko) * | 1996-12-30 | 1999-07-15 | 윤종용 | 바이폴라 소자 및 이의 제조 방법 |
-
2005
- 2005-05-23 JP JP2005149683A patent/JP2006332117A/ja active Pending
-
2006
- 2006-04-14 KR KR1020060033942A patent/KR100742741B1/ko not_active IP Right Cessation
- 2006-04-18 TW TW095113820A patent/TW200727488A/zh unknown
- 2006-05-16 US US11/434,269 patent/US20060261373A1/en not_active Abandoned
- 2006-05-19 CN CNA2006100847418A patent/CN1870290A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2006332117A (ja) | 2006-12-07 |
CN1870290A (zh) | 2006-11-29 |
KR100742741B1 (ko) | 2007-07-25 |
KR20060121094A (ko) | 2006-11-28 |
US20060261373A1 (en) | 2006-11-23 |
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