TW200726949A - Cooling system, operation method thereof and plasma system using the same - Google Patents

Cooling system, operation method thereof and plasma system using the same

Info

Publication number
TW200726949A
TW200726949A TW095136088A TW95136088A TW200726949A TW 200726949 A TW200726949 A TW 200726949A TW 095136088 A TW095136088 A TW 095136088A TW 95136088 A TW95136088 A TW 95136088A TW 200726949 A TW200726949 A TW 200726949A
Authority
TW
Taiwan
Prior art keywords
same
operation method
heat
refrigerant
cooling system
Prior art date
Application number
TW095136088A
Other languages
Chinese (zh)
Other versions
TWI323330B (en
Inventor
Katsushi Kishimoto
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of TW200726949A publication Critical patent/TW200726949A/en
Application granted granted Critical
Publication of TWI323330B publication Critical patent/TWI323330B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/002—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant

Abstract

A cooling system in which a compressor (1), a heat source (2), a heat exchanger (3), and a buffer tank (4) are connected in that order by piping (5) to form a closed circuit. In the closed circuit, nitrogen as the refrigerant is circulated without being in contact with the outside air. The refrigerant is sufficient if only it is gas (refrigerant) other than air, absorbs heat from the heat source (2) without being liquefied when circulated in the closed circuit, and discharges the heat to the outside at the heat exchanger (3).
TW095136088A 2005-09-30 2006-09-28 Cooling system, operation method thereof and plasma system using the same TW200726949A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005287921 2005-09-30

Publications (2)

Publication Number Publication Date
TW200726949A true TW200726949A (en) 2007-07-16
TWI323330B TWI323330B (en) 2010-04-11

Family

ID=37906077

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136088A TW200726949A (en) 2005-09-30 2006-09-28 Cooling system, operation method thereof and plasma system using the same

Country Status (4)

Country Link
US (1) US20090113912A1 (en)
JP (1) JPWO2007040033A1 (en)
TW (1) TW200726949A (en)
WO (1) WO2007040033A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9874077B2 (en) * 2008-04-30 2018-01-23 Altarock Energy Inc. Method and cooling system for electric submersible pumps/motors for use in geothermal wells
JP2011003464A (en) * 2009-06-19 2011-01-06 Tokyo Electron Ltd Plasma processing device and cooling device for plasma processing device
JP5862249B2 (en) * 2011-12-01 2016-02-16 いすゞ自動車株式会社 Thermoacoustic refrigeration equipment
KR20180086669A (en) * 2017-01-23 2018-08-01 에드워드 코리아 주식회사 Nitrogen oxide reduction apparatus and gas treating apparatus
KR102646623B1 (en) * 2017-01-23 2024-03-11 에드워드 코리아 주식회사 Plasma generating apparatus and gas treating apparatus

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4175400A (en) * 1977-02-18 1979-11-27 The Rovac Corporation Air conditioning system employing non-condensing gas with accumulator for pressurization and storage of gas
JP2609327B2 (en) * 1989-05-26 1997-05-14 三菱電機株式会社 refrigerator
JPH04147615A (en) * 1990-10-09 1992-05-21 Mitsubishi Electric Corp Mocvd system
JPH04242926A (en) * 1991-01-08 1992-08-31 Matsushita Electric Ind Co Ltd Temperature control method of semiconductor substrate, temperature control device of semiconductor substrate, and various kinds of vacuum devices
JPH0927459A (en) * 1995-07-10 1997-01-28 Canon Inc Processing equipment for semiconductor device
JPH0992624A (en) * 1995-09-25 1997-04-04 Semitsukusu Eng Kk Heat treatment oven
JP3375906B2 (en) * 1999-03-26 2003-02-10 住友重機械工業株式会社 Control method and device for helium liquefaction device
JP2001196321A (en) * 2000-01-07 2001-07-19 Ohkura Electric Co Ltd Gas-cooled vertical wafer processing device
US6986382B2 (en) * 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
JP2004193307A (en) * 2002-12-11 2004-07-08 Matsushita Electric Ind Co Ltd Thin film manufacturing device
JP2005079539A (en) * 2003-09-03 2005-03-24 Hitachi Ltd Plasma treatment apparatus
JP4073854B2 (en) * 2003-09-26 2008-04-09 三菱エンジニアリングプラスチックス株式会社 Injection molding method for molded product having hollow part
US7024883B2 (en) * 2003-12-19 2006-04-11 Carrier Corporation Vapor compression systems using an accumulator to prevent over-pressurization

Also Published As

Publication number Publication date
TWI323330B (en) 2010-04-11
JPWO2007040033A1 (en) 2009-04-16
US20090113912A1 (en) 2009-05-07
WO2007040033A1 (en) 2007-04-12

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