TW200723568A - Shape of mounting metal substrate for led element and led element mounting substrate - Google Patents

Shape of mounting metal substrate for led element and led element mounting substrate

Info

Publication number
TW200723568A
TW200723568A TW095125705A TW95125705A TW200723568A TW 200723568 A TW200723568 A TW 200723568A TW 095125705 A TW095125705 A TW 095125705A TW 95125705 A TW95125705 A TW 95125705A TW 200723568 A TW200723568 A TW 200723568A
Authority
TW
Taiwan
Prior art keywords
led element
recess
shape
substrate
metal
Prior art date
Application number
TW095125705A
Other languages
English (en)
Chinese (zh)
Other versions
TWI345316B (enExample
Inventor
Noboru Tanaka
Original Assignee
Noboru Tanaka
Ke Guang Yu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noboru Tanaka, Ke Guang Yu filed Critical Noboru Tanaka
Publication of TW200723568A publication Critical patent/TW200723568A/zh
Application granted granted Critical
Publication of TWI345316B publication Critical patent/TWI345316B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
TW095125705A 2005-12-06 2006-07-13 Shape of mounting metal substrate for led element and led element mounting substrate TW200723568A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005352112A JP2007158086A (ja) 2005-12-06 2005-12-06 Ｌｅｄ素子の実装金属基板の形状及びｌｅｄ素子実装基板。

Publications (2)

Publication Number Publication Date
TW200723568A true TW200723568A (en) 2007-06-16
TWI345316B TWI345316B (enExample) 2011-07-11

Family

ID=38242040

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125705A TW200723568A (en) 2005-12-06 2006-07-13 Shape of mounting metal substrate for led element and led element mounting substrate

Country Status (2)

Country Link
JP (1) JP2007158086A (enExample)
TW (1) TW200723568A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100888228B1 (ko) 2007-06-22 2009-03-12 (주)웨이브닉스이에스피 금속베이스 광소자 패키지 모듈 및 그 제조방법
JP5833850B2 (ja) * 2011-07-08 2015-12-16 シチズン電子株式会社 半導体発光装置及びその製造方法

Also Published As

Publication number Publication date
TWI345316B (enExample) 2011-07-11
JP2007158086A (ja) 2007-06-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees