TW200723474A - High thermal conducting circuit substrate and manufacturing process thereof - Google Patents
High thermal conducting circuit substrate and manufacturing process thereofInfo
- Publication number
- TW200723474A TW200723474A TW094142906A TW94142906A TW200723474A TW 200723474 A TW200723474 A TW 200723474A TW 094142906 A TW094142906 A TW 094142906A TW 94142906 A TW94142906 A TW 94142906A TW 200723474 A TW200723474 A TW 200723474A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit substrate
- high thermal
- thermal conducting
- manufacturing process
- conducting circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094142906A TWI294674B (en) | 2005-12-06 | 2005-12-06 | High thermal conducting circuit substrate and manufacturing process thereof |
US11/565,836 US7540969B2 (en) | 2005-12-06 | 2006-12-01 | High thermal conducting circuit substrate and manufacturing process thereof |
US12/034,564 US20080257590A1 (en) | 2005-12-06 | 2008-02-20 | High thermal conducting circuit substrate and manufacturing process thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094142906A TWI294674B (en) | 2005-12-06 | 2005-12-06 | High thermal conducting circuit substrate and manufacturing process thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200723474A true TW200723474A (en) | 2007-06-16 |
TWI294674B TWI294674B (en) | 2008-03-11 |
Family
ID=38134473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094142906A TWI294674B (en) | 2005-12-06 | 2005-12-06 | High thermal conducting circuit substrate and manufacturing process thereof |
Country Status (2)
Country | Link |
---|---|
US (2) | US7540969B2 (zh) |
TW (1) | TWI294674B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8344500B2 (en) | 2008-06-02 | 2013-01-01 | Mutual-Pak Technology Co., Ltd. | Integrated circuit package module and method of the same |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8129742B2 (en) * | 2008-03-25 | 2012-03-06 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and plated through-hole |
US20110278638A1 (en) * | 2008-03-25 | 2011-11-17 | Lin Charles W C | Semiconductor chip assembly with post/dielectric/post heat spreader |
US8324723B2 (en) * | 2008-03-25 | 2012-12-04 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump |
US20110156090A1 (en) * | 2008-03-25 | 2011-06-30 | Lin Charles W C | Semiconductor chip assembly with post/base/post heat spreader and asymmetric posts |
DE102008024704A1 (de) * | 2008-04-17 | 2009-10-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils |
KR100998010B1 (ko) * | 2008-04-28 | 2010-12-03 | 삼성엘이디 주식회사 | 발광소자 패키지 및 그 제조방법 |
KR100958024B1 (ko) * | 2008-08-05 | 2010-05-17 | 삼성엘이디 주식회사 | 발광 다이오드 패키지 및 그 제조방법 |
KR101077359B1 (ko) * | 2009-09-23 | 2011-10-26 | 삼성전기주식회사 | 방열회로기판 및 그 제조방법 |
KR20120026870A (ko) * | 2010-09-10 | 2012-03-20 | 삼성전자주식회사 | 회로 기판 및 이를 포함하는 반도체 모듈 |
TW201236228A (en) * | 2011-02-18 | 2012-09-01 | Bridge Semiconductor Corp | Semiconductor chip assembly with post/base/post heat spreader and asymmetric posts |
DE102012108107A1 (de) * | 2012-08-31 | 2014-03-27 | Epcos Ag | Leuchtdiodenvorrichtung |
CN108322993A (zh) * | 2017-12-31 | 2018-07-24 | 长沙牧泰莱电路技术有限公司 | 一种热电分离的pcb板件及其加工方法 |
JP6568637B1 (ja) * | 2018-12-04 | 2019-08-28 | 板橋精機株式会社 | プリント基板及びその製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5263245A (en) * | 1992-01-27 | 1993-11-23 | International Business Machines Corporation | Method of making an electronic package with enhanced heat sinking |
JP3540471B2 (ja) * | 1995-11-30 | 2004-07-07 | 三菱電機株式会社 | 半導体モジュール |
TW365047B (en) * | 1996-10-04 | 1999-07-21 | Winbond Electronics Corp | Manufacturing method for simultaneously forming trenches of different depths |
TW398040B (en) * | 1997-10-20 | 2000-07-11 | United Microelectronics Corp | A method to improve inequivalent metal etching rate |
US5965944A (en) * | 1997-11-12 | 1999-10-12 | International Business Machines Corporation | Printed circuit boards for mounting a semiconductor integrated circuit die |
US20020189853A1 (en) * | 2001-06-15 | 2002-12-19 | Phoenix Precision Technology Corp. | BGA substrate with direct heat dissipating structure |
TW538658B (en) * | 2001-08-27 | 2003-06-21 | Sanyo Electric Co | Manufacturing method for circuit device |
US7358116B2 (en) * | 2002-04-29 | 2008-04-15 | Intel Corporation | Substrate conductive post formation |
TWI246783B (en) * | 2003-09-24 | 2006-01-01 | Matsushita Electric Works Ltd | Light-emitting device and its manufacturing method |
-
2005
- 2005-12-06 TW TW094142906A patent/TWI294674B/zh active
-
2006
- 2006-12-01 US US11/565,836 patent/US7540969B2/en active Active
-
2008
- 2008-02-20 US US12/034,564 patent/US20080257590A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8344500B2 (en) | 2008-06-02 | 2013-01-01 | Mutual-Pak Technology Co., Ltd. | Integrated circuit package module and method of the same |
TWI489599B (zh) * | 2008-06-02 | 2015-06-21 | Mutual Pak Technology Co Ltd | 積體電路模組及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI294674B (en) | 2008-03-11 |
US20080257590A1 (en) | 2008-10-23 |
US7540969B2 (en) | 2009-06-02 |
US20070126093A1 (en) | 2007-06-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200723474A (en) | High thermal conducting circuit substrate and manufacturing process thereof | |
TW200623400A (en) | Method for manufacturing semiconductor device | |
TW200717710A (en) | Method of manufacturing semiconductor device | |
WO2005027233A3 (en) | Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same | |
TW200717672A (en) | Method of manufacturing wiring board | |
TW200633000A (en) | Method for forming dual damascene structure with tapered via portion and improved performance | |
TW200703590A (en) | Method of fabricating wiring board and method of fabricating semiconductor device | |
TW200741959A (en) | A die and method fabricating the same | |
TW200501216A (en) | Organic semiconductor device and method of manufacture of same | |
TW200707757A (en) | Method for forming contact hole and method for fabricating thin film transistor plate using the same | |
TW200610470A (en) | Method for fabricating electrical connecting member of circuit board | |
TW200740307A (en) | Glass circuit board and manufacturing method thereof | |
TW200501317A (en) | Method of forming a contact hole and method of forming a semiconductor device | |
WO2007043972A8 (en) | Device carrying an integrated circuit/components and method of producing the same | |
TWI265570B (en) | Semiconductor device with composite etch stop layer and fabrication method thereof | |
TW200802766A (en) | Substrate strip and substrate structure and method for manufacturing the same | |
TW200640311A (en) | A method of manufacturing a film printed circuit board | |
TW200742016A (en) | Insulation structure for high temperature conditions and manufacturing method thereof | |
TW200727293A (en) | Method for manufacturing a semiconductor device, method for manufacturing magnetic random access memory and device thereof | |
JP2007184390A (ja) | 半導体基板のエッチング方法 | |
TW200644068A (en) | Manufacturing method for gate dielectric layer | |
TW200707524A (en) | Substrate process and structure for embedded component | |
TW200740323A (en) | Glass circuit board and manufacturing method thereof | |
TW200644160A (en) | Method for fabricating metal line in semiconductor device | |
TW200509301A (en) | Structure of interconnects and fabricating method thereof |