TW200723467A - Method for packaging flash memory cards - Google Patents
Method for packaging flash memory cardsInfo
- Publication number
- TW200723467A TW200723467A TW094144486A TW94144486A TW200723467A TW 200723467 A TW200723467 A TW 200723467A TW 094144486 A TW094144486 A TW 094144486A TW 94144486 A TW94144486 A TW 94144486A TW 200723467 A TW200723467 A TW 200723467A
- Authority
- TW
- Taiwan
- Prior art keywords
- flash memory
- insert molding
- packaging
- present
- memory cards
- Prior art date
Links
Abstract
The method of packaging flash memory cards of the present invention comprises a process of making a protective membrane, which protects the circuitry from influences by movement and heat source of the subsequent insert molding process. The protective membrane can protect the circuitry on the circuit board during sealing of the flash memory card in the insert molding process. The protective membrane is like the membrane inside the eggshell and is formed by insert molding, so the packaging method of the present invention is called eggshell insert molding (ESIM). The present invention can indeed be used to improve traditional COB and SMT packaging methods.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094144486A TW200723467A (en) | 2005-12-15 | 2005-12-15 | Method for packaging flash memory cards |
JP2006122331A JP2007160915A (en) | 2005-12-15 | 2006-04-26 | Mounting method of flash memory card |
KR1020060121596A KR20070064254A (en) | 2005-12-15 | 2006-12-04 | Method for packaging flash memory cards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094144486A TW200723467A (en) | 2005-12-15 | 2005-12-15 | Method for packaging flash memory cards |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200723467A true TW200723467A (en) | 2007-06-16 |
Family
ID=38244339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094144486A TW200723467A (en) | 2005-12-15 | 2005-12-15 | Method for packaging flash memory cards |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2007160915A (en) |
KR (1) | KR20070064254A (en) |
TW (1) | TW200723467A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105792549A (en) * | 2014-12-26 | 2016-07-20 | 宏达国际电子股份有限公司 | Electronic device and manufacturing method thereof |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2018012535A1 (en) * | 2016-07-15 | 2019-06-20 | 富士フイルム株式会社 | Wiring board manufacturing method, wiring board |
CN108724600B (en) * | 2018-04-02 | 2020-04-03 | 东莞太洋橡塑制品有限公司 | Production process of coated electronic component product |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3281859B2 (en) * | 1997-12-22 | 2002-05-13 | 三洋電機株式会社 | Manufacturing method of hybrid integrated circuit device |
JP2000048162A (en) * | 1998-03-17 | 2000-02-18 | Sanyo Electric Co Ltd | Module for ic card, manufacture thereof, hybrid integrated circuit module and manufacture thereof |
JP2005332116A (en) * | 2004-05-19 | 2005-12-02 | Dainippon Printing Co Ltd | Manufacturing method of non-contact ic tag, and non-contact ic tag |
-
2005
- 2005-12-15 TW TW094144486A patent/TW200723467A/en unknown
-
2006
- 2006-04-26 JP JP2006122331A patent/JP2007160915A/en active Pending
- 2006-12-04 KR KR1020060121596A patent/KR20070064254A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105792549A (en) * | 2014-12-26 | 2016-07-20 | 宏达国际电子股份有限公司 | Electronic device and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
JP2007160915A (en) | 2007-06-28 |
KR20070064254A (en) | 2007-06-20 |
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