CN108724600B - Production process of coated electronic component product - Google Patents
Production process of coated electronic component product Download PDFInfo
- Publication number
- CN108724600B CN108724600B CN201810282911.6A CN201810282911A CN108724600B CN 108724600 B CN108724600 B CN 108724600B CN 201810282911 A CN201810282911 A CN 201810282911A CN 108724600 B CN108724600 B CN 108724600B
- Authority
- CN
- China
- Prior art keywords
- base
- pcb
- key cap
- surface cover
- battery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000003825 pressing Methods 0.000 claims abstract description 14
- 239000003292 glue Substances 0.000 claims abstract description 8
- 238000001746 injection moulding Methods 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000010329 laser etching Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 3
- 238000010030 laminating Methods 0.000 abstract description 3
- 238000007493 shaping process Methods 0.000 abstract description 3
- MTLMVEWEYZFYTH-UHFFFAOYSA-N 1,3,5-trichloro-2-phenylbenzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=CC=C1 MTLMVEWEYZFYTH-UHFFFAOYSA-N 0.000 description 3
- 230000036760 body temperature Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Abstract
The invention discloses a production process of a coated electronic element product, which comprises the following steps: (1) forming a key cap by oil pressure, and attaching an elastic sheet in the key cap; (2) placing the PCB in an injection molding die, and attaching the key cap to the PCB; (3) injection molding the base to fix the PCB on the base; (4) placing a battery on the base and welding and conducting the battery with the PCB; (5) and pressing the surface cover in an oil pressing mode, and attaching the surface cover to the base by adopting low-temperature glue, so that the surface cover covers the PCB and the battery, and the pressing part of the key cap is exposed out of the surface cover through the through hole of the surface cover. Through will pressing key cap, base and face lid separately the shaping to adopt low temperature to glue face lid and base laminating fixed, replaced the one shot forming's of tradition mode and, effectively avoid high temperature high pressure to electronic component's influence, thereby improved the yield of product greatly, and guarantee better waterproof performance, bring the convenience for the use.
Description
Technical Field
The invention relates to the technical field of electronic product production, in particular to a production process of a coated electronic element product.
Background
At present, various coated electronic element products, such as heart rate patches, body temperature patches and the like, are provided, and electronic elements are wrapped in the coated electronic element products and are used for measuring various indexes of the heart rate, the body temperature and the like of a human body, so that great convenience is brought to the use of people.
However, the current electronic component products are wrapped by the electronic component in a one-step molding manner, which generates high temperature and high pressure during the production process, so that a part of the electronic component is damaged, and the product yield is low.
Disclosure of Invention
In view of the above, the present invention is directed to the defects of the prior art, and the main objective of the present invention is to provide a production process of a packaged electronic device product, which can effectively solve the problem of low product yield caused by the production method of the conventional packaged electronic device product.
In order to achieve the purpose, the invention adopts the following technical scheme:
a production process of a coated electronic component product comprises the following steps:
(1) forming a key cap by oil pressure, and attaching an elastic sheet in the key cap;
(2) placing the PCB in an injection molding die, and attaching the key cap to the PCB;
(3) injection molding the base to fix the PCB on the base;
(4) placing a battery on the base and welding and conducting the battery with the PCB;
(5) and pressing the surface cover in an oil pressing mode, and attaching the surface cover to the base by adopting low-temperature glue, so that the surface cover covers the PCB and the battery, and the pressing part of the key cap is exposed out of the surface cover through the through hole of the surface cover.
As a preferred scheme, the elastic sheet is an iron sheet.
As a preferable scheme, in the step (1), after the key cap is formed, spraying and shading are performed on the key cap, and then laser etching is performed.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
through will pressing key cap, base and face lid separately the shaping to adopt low temperature to glue face lid and base laminating fixed, replaced the one shot forming's of tradition mode and, effectively avoid high temperature high pressure to electronic component's influence, thereby improved the yield of product greatly, and guarantee better waterproof performance, bring the convenience for the use.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a cross-sectional view of a packaged electronic component product in accordance with a preferred embodiment of the present invention.
The attached drawings indicate the following:
10. key cap 11, pressing part
20. Spring sheet 30 and PCB
40. Base 50 and battery
60. Surface cover 61, through hole
70. And (5) low-temperature glue.
Detailed Description
The invention discloses a production process of a coated electronic element product, which comprises the following steps:
(1) forming a key cap 10 by oil pressure, and attaching an elastic sheet 20 in the key cap 10; in this embodiment, after the key cap 10 is molded, the key cap 10 is sprayed and shielded, and then laser etching is performed, and the elastic sheet 20 is an iron sheet to increase the hand feeling.
(2) The PCB 30 is placed in an injection molding mold, and the key cap 10 is attached to the PCB 30.
(3) The base 40 is injection molded such that the PCB board 30 is fixed on the base 40.
(4) The battery 50 is placed on the base 40 and is soldered to the PCB 30.
(5) The surface cover 60 is formed by oil pressure, and the surface cover 60 is attached to the base 40 by using the low temperature glue 70, so that the surface cover 60 covers the PCB board 30 and the battery 50, and the pressing part 11 of the key cap 10 is exposed out of the surface cover 60 through the through hole 61 of the surface cover 60.
The design of the invention is characterized in that: through will pressing key cap, base and face lid separately the shaping to adopt low temperature to glue face lid and base laminating fixed, replaced the one shot forming's of tradition mode and, effectively avoid high temperature high pressure to electronic component's influence, thereby improved the yield of product greatly, and guarantee better waterproof performance, bring the convenience for the use.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.
Claims (3)
1. A production process of a coated electronic component product is characterized by comprising the following steps: the method comprises the following steps:
(1) forming a key cap by oil pressure, and attaching an elastic sheet in the key cap;
(2) placing the PCB in an injection molding die, and attaching the key cap to the PCB;
(3) injection molding the base to fix the PCB on the base;
(4) placing a battery on the base and welding and conducting the battery with the PCB;
(5) and pressing the surface cover in an oil pressing mode, and attaching the surface cover to the base by adopting low-temperature glue, so that the surface cover covers the PCB and the battery, and the pressing part of the key cap is exposed out of the surface cover through the through hole of the surface cover.
2. The process for producing a coated electronic component product as claimed in claim 1, wherein: the elastic sheet is an iron sheet.
3. The process for producing a coated electronic component product as claimed in claim 1, wherein: and (2) in the step (1), spraying and shading the key cap after the key cap is formed, and then carrying out laser etching treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810282911.6A CN108724600B (en) | 2018-04-02 | 2018-04-02 | Production process of coated electronic component product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810282911.6A CN108724600B (en) | 2018-04-02 | 2018-04-02 | Production process of coated electronic component product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108724600A CN108724600A (en) | 2018-11-02 |
| CN108724600B true CN108724600B (en) | 2020-04-03 |
Family
ID=63941091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810282911.6A Active CN108724600B (en) | 2018-04-02 | 2018-04-02 | Production process of coated electronic component product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108724600B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109920680A (en) * | 2019-01-11 | 2019-06-21 | 捷讯精密橡胶（苏州）有限公司 | A kind of route board production technology with silica gel push-button |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1340992A (en) * | 2000-07-17 | 2002-03-20 | 日本电气株式会社 | Structure for electronic device with operation key and its manufacture method |
| CN1899797A (en) * | 2005-07-21 | 2007-01-24 | 毅嘉科技股份有限公司 | Touch control plate and its making method |
| KR20070064254A (en) * | 2005-12-15 | 2007-06-20 | 친-통 리우 | Method for packaging flash memory cards |
| CN202068461U (en) * | 2011-05-06 | 2011-12-07 | 中兴通讯股份有限公司 | Terminal keyboard structure and terminal |
-
2018
- 2018-04-02 CN CN201810282911.6A patent/CN108724600B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1340992A (en) * | 2000-07-17 | 2002-03-20 | 日本电气株式会社 | Structure for electronic device with operation key and its manufacture method |
| CN1899797A (en) * | 2005-07-21 | 2007-01-24 | 毅嘉科技股份有限公司 | Touch control plate and its making method |
| KR20070064254A (en) * | 2005-12-15 | 2007-06-20 | 친-통 리우 | Method for packaging flash memory cards |
| CN202068461U (en) * | 2011-05-06 | 2011-12-07 | 中兴通讯股份有限公司 | Terminal keyboard structure and terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108724600A (en) | 2018-11-02 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Production process of encapsulated electronic component products Granted publication date: 20200403 Pledgee: Zhuhai China Resources Bank Co.,Ltd. Dongguan Branch Pledgor: DONGGUAN TAIYANG RUBBER PLASTIC INDUSTRIAL Co.,Ltd. Registration number: Y2024980012774 |