CN205798241U - A kind of surface mount semiconductor element pin forming device - Google Patents
A kind of surface mount semiconductor element pin forming device Download PDFInfo
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- CN205798241U CN205798241U CN201620605257.4U CN201620605257U CN205798241U CN 205798241 U CN205798241 U CN 205798241U CN 201620605257 U CN201620605257 U CN 201620605257U CN 205798241 U CN205798241 U CN 205798241U
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- semiconductor element
- mold
- element pin
- pin forming
- forming device
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Abstract
This utility model relates to a kind of surface mount semiconductor element pin forming device, belongs to hyundai electronics package technique field.A kind of surface mount semiconductor element pin forming device, including upper die structure and lower die structure, position of turning back is had twice during semiconductor element pin forming, upper die structure includes governor motion, pressing mold and with the upper mold running through groove, pressing mold is located at running through in groove and being slidably connected with upper mold of upper mold, governor motion and upper mold, pressing mold is connected, lower die structure includes die shoe and the lower mold core being connected with die shoe, described lower mold core top is boss structure, described lower mold core boss is round-corner transition structure corresponding to twice place of turning back of semiconductor element pin, described pressing mold lower end is the pressing mold boss of cooperation corresponding with lower mold core boss.This utility model can effectively protect semiconductor element pin when semiconductor element pin forming, and turning back and cutting of semiconductor element pin once completes, and can significantly improve work efficiency.
Description
Technical field
This utility model belongs to hyundai electronics package technique field, particularly relates to a kind of surface mount semiconductor element and draws
Foot shaped device.
Technical background
In the fields such as Aero-Space, biology, medicine, electric power, apply to various printed circuit assembly, and component surface
Mounting technology is advanced printed circuit assembly production technology, for the semiconductor element that some are special, needs according to design need
Ask and pin is carried out ad hoc fashion molding.This based semiconductor device is expensive, and size is little, and semiconductor element pin is fragile,
Transportation is easily destroyed semiconductor element pin shapes, causes semiconductor element normally to mount.
Generally, in order to ensure the pin shapes of semiconductor element, this based semiconductor device when dispatching from the factory not to semiconductor element
Part pin is shaped, and pin is parallel to semiconductor element body construction, uses metal framework to fix pin configuration, directly in outer ring
Connect and transport in user's hands, user carry out pin forming according to self-demand.User typically through manual bending, manually prunes
Carrying out pin forming Deng multiple working procedure, be easily destroyed semiconductor element pin, Forming Quality is undesirable.
Utility model content
For the deficiencies in the prior art, the purpose of this utility model is to provide a kind of semiconductor element pin forming
Device, uses high efficiency, high-quality pin forming method to make semiconductor element meet surface mount requirement, this semiconductor element
Pin forming device overall structure is simple, easy and simple to handle, can carry out molding and the cutting of semiconductor element pin forming simultaneously
Work, during being particularly well-suited in small lot batch manufacture, can reduce production cost and improve formed product qualification rate.
The purpose of this utility model is achieved through the following technical solutions:
A kind of surface mount semiconductor element pin forming device, including upper die structure and lower die structure, described quasiconductor
Component pin forming process there are twice position of turning back, described upper die structure to include governor motion, pressing mold and with running through groove
Upper mold, described pressing mold is located at running through in groove and being slidably connected with upper mold of upper mold, and described governor motion is connected with upper mold, pressing mold
Connecing, described lower die structure includes die shoe and the lower mold core being connected with die shoe, and described lower mold core top is boss structure, described
Lower mold core boss is round-corner transition structure corresponding to twice place of turning back of semiconductor element pin, and described pressing mold lower end is and lower mold core
The pressing mold boss of the corresponding cooperation of boss.Lower mold core boss and pressing mold boss are corresponding to twice place of turning back of semiconductor element pin all
For round-corner transition structure, injury when can effectively reduce semiconductor element pin forming, pin caused, improve yield rate.
Preferably, described governor motion includes spring and the top pull bar with screwed hole, described spring and upper mold, pressing mold
Contact, described pull bar is connected with upper mold, pressing mold.In use, pull bar can be adjusted according to demand to control amount of spring compression,
And then control the molding dynamics of pressing mold in the reasonable scope.
Preferably, the lower limb of described upper mold is provided with cutting edge.The lower limb of upper mold is provided with cutting edge, completes quasiconductor
The cutting work of pin can be carried out again while component pin molding, improve work efficiency.
Preferably, described die shoe is provided with the supporting surface matched with cutting edge, and described supporting surface is inclined-plane.Supporting surface is
Inclined-plane, remains certain resilience nargin during for semiconductor element pin forming.
Preferably, described upper mold bottom is provided with two or more taper bolt, and described straight pin is slidably connected with die shoe.Circular cone
Pin can ensure that pressing mold and the centering of lower mold core when device works.
Preferably, described upper mold top connects cover plate, and described cover plate and pull bar corresponding position have through hole.Cover plate can be right
Upper mold and pull bar play a protective role, and in use, can be adjusted pull bar by the through hole on cover plate.
Preferably, described spring upper end contacts with upper mold, and lower spring end contacts with pressing mold, and described pull bar upper end is sliding with upper mold
Being dynamically connected, threadeds with pressing mold in pull bar lower end.
Preferably, described spring housing is on pull bar.
Preferably, described die shoe and lower mold core are connected by two sunk screws.
Preferably, described cover plate is connected by four sunk screws with upper mold.
The beneficial effects of the utility model: this utility model one surface mount semiconductor element pin forming device structure
Simply, easy and simple to handle.This device is all round-corner transition structure corresponding to twice place of turning back of semiconductor element pin, can effectively subtract
The injury that pin is caused when turning back by not a half conductor element pin, improves yield rate.Semiconductor element pin is being turned back
While, complete again the cutting work to semiconductor element pin redundance, work efficiency can be greatly improved.
Accompanying drawing explanation
Fig. 1 is this utility model one surface mount semiconductor element pin forming device schematic diagram；
Fig. 2 is this utility model one surface mount semiconductor element pin forming device centre section structural representation；
Fig. 3 is the signal of this utility model one surface mount semiconductor element pin forming device formed cores portion structure
Figure；
Fig. 4 is this utility model one surface mount semiconductor element pin forming device lower mold core structural representation；
Fig. 5 is this utility model one surface mount semiconductor element pin forming device stamper architecture schematic diagram；
In Fig. 1 to Fig. 5: 1 is lower mold core, 2 is die shoe, and 3 is pressing mold, and 4 is spring, and 5 is pull bar, and 6 is upper mold, and 7 is heavy
Head screw, 8 be cover plate, and 9 is sunk screw, and 10 is taper bolt, 11 be lower mold core boss, 12 be pressing mold boss, 13 is cutting edge.
Detailed description of the invention
With embodiment, this utility model is further described below in conjunction with the accompanying drawings:
Embodiment:
As Fig. 1 is to shown in 5, and a kind of surface mount semiconductor element pin forming device, it includes lower die structure and upper mold
Structure, have twice during described semiconductor element pin forming position of turning back, described lower die structure include die shoe 2 and with under
The lower mold core 1 that die holder 2 connects, described upper die structure includes governor motion, pressing mold 3 and with running through the upper mold 6 of groove, described pressing mold
3 are located at running through in groove and being slidably connected with upper mold 6 of upper mold 6, and described governor motion includes that spring 4 and top are with screwed hole
Pull bar 5, described spring 4 is enclosed within pull bar 5, and described spring 4 upper end contacts with upper mold 6, lower end contacts with pressing mold 3, described pull bar 5
Upper end is slidably connected with upper mold 6, threaded with pressing mold 3 in lower end, and described lower mold core 1 top is boss structure, described lower mold core
Boss 11 is round-corner transition structure corresponding to twice place of turning back of semiconductor element pin, and described pressing mold 3 lower end is convex with lower mold core
The pressing mold boss 12 of the corresponding cooperation of platform 11, the lower limb of described upper mold 6 is provided with cutting edge 13, and the top of described upper mold 6 connects
Having and have the cover plate 8 of through hole with pull bar 5 corresponding position, described die shoe 2 is provided with the supporting surface matched with cutting edge 13, described
Support face is inclined-plane, and described upper mold 6 bottom is provided with the taper bolt 10 being slidably connected with die shoe 2, described die shoe 2 and lower mold core 1
Being connected by two sunk screws 9, described cover plate 8 is connected by four sunk screws 7 with upper mold 6.
Semiconductor element before molding, is typically with the metal frame of a fixation outside pin.
Before operation first, need by the through hole on cover plate 8, pull bar 5 to be adjusted, regulate the compression of spring 4
Amount, makes pressing mold 3 there is suitable pressure with lower mold core 1 when coordinating, it is ensured that pin forming effect.Described taper bolt 10 and upper mold 6
Interference fit together, before operation, mentions upper mold 6, is faced up by semiconductor element and is placed in lower mold core 1 correspondence position,
Being provided with groove in the middle of lower mold core 1, it is internal that what semiconductor element body can be complete is placed in lower mold core 1, protects semiconductor element
Body.Then, by the mating holes of the taper bolt 10 centering die shoe 2 of upper mold 6, after putting into upper mold 6, mould 3 is joined with lower mold core 1
Close.
After placing element, this utility model shaped device is put in manual type forcing press, apply pressure, pressing mold boss
Semiconductor element pin is pressed to lower mold core boss 11 by 12, completes semiconductor element pin and turns back work.The cutting edge 13 of upper mold 6
Act directly on the bearing-surface of lower mold core 1, it is ensured that completely cutting through of pin, complete the cutting work of semiconductor element pin.
Open upper mold 6, i.e. can use tweezers to take out the semiconductor element of forming.
Claims (10)
1. a surface mount semiconductor element pin forming device, including upper die structure and lower die structure, described semiconductor element
Have position of turning back during part pin forming twice, it is characterised in that described upper die structure include governor motion, pressing mold and with
Running through the upper mold of groove, described pressing mold is located at running through in groove and being slidably connected with upper mold of upper mold, described governor motion and upper mold, pressure
Mould is connected, and described lower die structure includes die shoe and the lower mold core being connected with die shoe, and described lower mold core top is boss knot
Structure, described lower mold core boss is round-corner transition structure corresponding to twice place of turning back of semiconductor element pin, and described pressing mold lower end is
The pressing mold boss of cooperation corresponding with lower mold core boss.
A kind of surface mount semiconductor element pin forming device the most according to claim 1, it is characterised in that described tune
Joint mechanism includes spring and the top pull bar with screwed hole, and described spring contacts with upper mold, pressing mold, described pull bar and upper mold,
Pressing mold is connected.
A kind of surface mount semiconductor element pin forming device the most according to claim 1, it is characterised in that on described
The lower limb of mould is provided with cutting edge.
A kind of surface mount semiconductor element pin forming device the most according to claim 1, it is characterised in that under described
Die holder is provided with the supporting surface matched with cutting edge, and described supporting surface is inclined-plane.
A kind of surface mount semiconductor element pin forming device the most according to claim 1, it is characterised in that on described
Mould bottom is provided with two or more taper bolt, and described taper bolt is slidably connected with die shoe.
A kind of surface mount semiconductor element pin forming device the most according to claim 1, it is characterised in that on described
Mould top connects cover plate, and described cover plate and pull bar corresponding position have through hole.
A kind of surface mount semiconductor element pin forming device the most according to claim 2, it is characterised in that described bullet
Spring upper end contacts with upper mold, and lower spring end contacts with pressing mold, and described pull bar upper end is slidably connected with upper mold, pull bar lower end and pressing mold
Threaded.
A kind of surface mount semiconductor element pin forming device the most according to claim 2, it is characterised in that described bullet
Spring is enclosed within pull bar.
A kind of surface mount semiconductor element pin forming device the most according to claim 1, it is characterised in that under described
Die holder and lower mold core are connected by two sunk screws.
A kind of surface mount semiconductor element pin forming device the most according to claim 6, it is characterised in that described
Cover plate is connected by four sunk screws with upper mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620605257.4U CN205798241U (en) | 2016-06-20 | 2016-06-20 | A kind of surface mount semiconductor element pin forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620605257.4U CN205798241U (en) | 2016-06-20 | 2016-06-20 | A kind of surface mount semiconductor element pin forming device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205798241U true CN205798241U (en) | 2016-12-14 |
Family
ID=58142349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620605257.4U Active CN205798241U (en) | 2016-06-20 | 2016-06-20 | A kind of surface mount semiconductor element pin forming device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205798241U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108091578A (en) * | 2017-11-30 | 2018-05-29 | 贵州航天电子科技有限公司 | A kind of leads of IC molding machine |
| CN113458280A (en) * | 2021-06-17 | 2021-10-01 | 江苏大学 | Device is surely rolled over to axial components and parts pin in batches based on vision |
-
2016
- 2016-06-20 CN CN201620605257.4U patent/CN205798241U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108091578A (en) * | 2017-11-30 | 2018-05-29 | 贵州航天电子科技有限公司 | A kind of leads of IC molding machine |
| CN113458280A (en) * | 2021-06-17 | 2021-10-01 | 江苏大学 | Device is surely rolled over to axial components and parts pin in batches based on vision |
| CN113458280B (en) * | 2021-06-17 | 2022-08-23 | 江苏大学 | Device is surely rolled over to axial components and parts pin in batches based on vision |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |