TW200722916A - Photosensitive composition, pattern forming material, photosensitive laminate and pattern forming apparatus and pattern forming method - Google Patents

Photosensitive composition, pattern forming material, photosensitive laminate and pattern forming apparatus and pattern forming method

Info

Publication number
TW200722916A
TW200722916A TW095133150A TW95133150A TW200722916A TW 200722916 A TW200722916 A TW 200722916A TW 095133150 A TW095133150 A TW 095133150A TW 95133150 A TW95133150 A TW 95133150A TW 200722916 A TW200722916 A TW 200722916A
Authority
TW
Taiwan
Prior art keywords
pattern forming
photosensitive
sensitizer
photo
wave length
Prior art date
Application number
TW095133150A
Other languages
Chinese (zh)
Inventor
Kazumori Minami
Yoshiharu Sasaki
Yuichi Wakata
Takashi Takayanagi
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005264491A external-priority patent/JP4546367B2/en
Priority claimed from JP2005264493A external-priority patent/JP4546368B2/en
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW200722916A publication Critical patent/TW200722916A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

The invention provides a photo-sensitive composition which has an almost constant sensitivity distribution to the exposing light with a wave length among 400 to 410 nm, no influence caused by variation of wave length of the exposing light and has excellent reproduction of a pattern, as well as it is capable of extremely inhibiting variation of a pattern profile and can be treated under a bright circumstance. Therefore, provided is a photo-sensitive composition characterized in it is formed by at least comprising a binder, polymerizable compound, photo-polymerization initiator and sensitizer, wherein the said sensitizer at least comprises 2 kinds of sensitizer having a maximum absorption wave length of 340 to 500nm.
TW095133150A 2005-09-12 2006-09-08 Photosensitive composition, pattern forming material, photosensitive laminate and pattern forming apparatus and pattern forming method TW200722916A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005264491A JP4546367B2 (en) 2005-09-12 2005-09-12 Pattern forming material, pattern forming apparatus and pattern forming method
JP2005264493A JP4546368B2 (en) 2005-09-12 2005-09-12 Photosensitive composition, pattern forming material, photosensitive laminate, pattern forming apparatus and pattern forming method

Publications (1)

Publication Number Publication Date
TW200722916A true TW200722916A (en) 2007-06-16

Family

ID=37864814

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095133150A TW200722916A (en) 2005-09-12 2006-09-08 Photosensitive composition, pattern forming material, photosensitive laminate and pattern forming apparatus and pattern forming method

Country Status (2)

Country Link
TW (1) TW200722916A (en)
WO (1) WO2007032215A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427553B (en) * 2009-04-21 2014-02-21 新力電腦娛樂股份有限公司 Generation of cubic bezier control points in computer graphics systems
TWI507820B (en) * 2010-07-30 2015-11-11 Hitachi Chemical Co Ltd Photosensitive resin composition, and photosensitive element, method for producing resist pattern, method for producing lead frame, printed wiring board and method for producing printed wiring board using the same
TWI841687B (en) * 2019-02-28 2024-05-11 日商東京應化工業股份有限公司 Photosensitive resin composition and etching method for glass substrate

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3324349B2 (en) * 1994-09-05 2002-09-17 三菱化学株式会社 Photopolymerizable composition and photosensitive material
JPH1010714A (en) * 1996-06-21 1998-01-16 Konica Corp Photosensitive composition
JP4305695B2 (en) * 1999-05-28 2009-07-29 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, resist pattern manufacturing method, and printed wiring board manufacturing method
JP4685259B2 (en) * 2000-04-19 2011-05-18 コダック株式会社 Photosensitive lithographic printing plate and printing plate making method
JP2003270780A (en) * 2002-03-13 2003-09-25 Konica Corp Photosensitive planographic printing plate
JP2004061583A (en) * 2002-07-25 2004-02-26 Fuji Photo Film Co Ltd Method for making planographic printing plate
JP2004191472A (en) * 2002-12-09 2004-07-08 Konica Minolta Holdings Inc Photosensitive composition and photosensitive lithographic printing plate
JP2004318016A (en) * 2003-04-21 2004-11-11 Konica Minolta Medical & Graphic Inc Photosensitive lithographic printing plate material and method for forming image thereon
JP4306319B2 (en) * 2003-04-25 2009-07-29 コニカミノルタエムジー株式会社 Photosensitive composition and photosensitive lithographic printing plate
JP2005084303A (en) * 2003-09-08 2005-03-31 Fuji Photo Film Co Ltd Plate making method for photopolymerizable photosensitive planographic printing plate
JP2005221717A (en) * 2004-02-05 2005-08-18 Konica Minolta Medical & Graphic Inc Photosensitive composition, photosensitive lithographic printing plate and recording method for lithographic printing plate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427553B (en) * 2009-04-21 2014-02-21 新力電腦娛樂股份有限公司 Generation of cubic bezier control points in computer graphics systems
TWI507820B (en) * 2010-07-30 2015-11-11 Hitachi Chemical Co Ltd Photosensitive resin composition, and photosensitive element, method for producing resist pattern, method for producing lead frame, printed wiring board and method for producing printed wiring board using the same
TWI841687B (en) * 2019-02-28 2024-05-11 日商東京應化工業股份有限公司 Photosensitive resin composition and etching method for glass substrate

Also Published As

Publication number Publication date
WO2007032215A1 (en) 2007-03-22

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