TW200722356A - Flat material conveying method and its device - Google Patents
Flat material conveying method and its deviceInfo
- Publication number
- TW200722356A TW200722356A TW095123392A TW95123392A TW200722356A TW 200722356 A TW200722356 A TW 200722356A TW 095123392 A TW095123392 A TW 095123392A TW 95123392 A TW95123392 A TW 95123392A TW 200722356 A TW200722356 A TW 200722356A
- Authority
- TW
- Taiwan
- Prior art keywords
- flat
- conveyed material
- pad
- flat conveyed
- bend
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Abstract
To provide a flat material conveying method and its device capable of miniaturizing a holder part such as a finger and capable of accurately conveying flat conveyed materials by restricting bend of the flat conveyed material due to dead wight thereof, while restricting a contact with the flat conveyed material. The flat conveyed material 17 is held by a holding part formed of a pad 18 and a suction part 19. The pad 18 abuts on a lower surface of the flat conveyed material 17 to support it. The suction part 19 is arranged between the pad 18, and height of the pad 18 is set low in the suction condition to vacuum-suck the lower surface of the flat conveyed material 17. The flat conveyed material 17 is thereby forcibly bent to reduce the amount of bend in a direction along an angle and/or a valley of the bend.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005194685A JP4873895B2 (en) | 2005-07-04 | 2005-07-04 | Method and apparatus for transporting flat plate-like conveyed product |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200722356A true TW200722356A (en) | 2007-06-16 |
TWI300052B TWI300052B (en) | 2008-08-21 |
Family
ID=37596836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095123392A TW200722356A (en) | 2005-07-04 | 2006-06-28 | Flat material conveying method and its device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4873895B2 (en) |
KR (2) | KR20070004428A (en) |
CN (1) | CN1891589A (en) |
TW (1) | TW200722356A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI725115B (en) * | 2016-01-29 | 2021-04-21 | 日商達誼恆股份有限公司 | Robot for substrate transfer |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007052182B4 (en) * | 2007-10-31 | 2009-07-02 | Grenzebach Maschinenbau Gmbh | Apparatus and method for reacting shock-sensitive glass plates in clean rooms |
CN102741993B (en) * | 2009-12-16 | 2016-06-22 | 株式会社尼康 | Supporting member for substrate, base board delivery device, substrate transfer method adopted therein, exposure device and manufacturing method |
KR101314146B1 (en) * | 2011-11-23 | 2013-10-04 | (주)제니스월드 | Fixing apparatus for ceramic product |
CN103287847B (en) * | 2012-02-27 | 2016-08-31 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate transmission mechanism and the substrate transport system with it |
CN102774652A (en) * | 2012-07-31 | 2012-11-14 | 深圳市华星光电技术有限公司 | Supporting arm of LCD (liquid crystal display) panel handling device |
CN102897536B (en) * | 2012-11-02 | 2015-04-15 | 深圳市华星光电技术有限公司 | Transferring system for transporting flat plate and mechanical device thereof as well as transporting method |
CN103354216B (en) * | 2013-07-02 | 2016-05-18 | 中国电子科技集团公司第四十八研究所 | A kind of batch is transmitted the atmosphere manipulator terminal clamper of solar battery sheet |
CN103594409A (en) * | 2013-10-23 | 2014-02-19 | 中国电子科技集团公司第四十八研究所 | Device for absorbing silicon wafers in batches |
CN108292620B (en) * | 2015-11-20 | 2022-08-09 | 盛美半导体设备(上海)股份有限公司 | Robot for transferring semiconductor substrate |
JP2019010690A (en) * | 2017-06-29 | 2019-01-24 | 日本電産サンキョー株式会社 | Industrial Robot Hand and Industrial Robot |
JP7278930B2 (en) * | 2019-11-29 | 2023-05-22 | 川崎重工業株式会社 | Holding device, robot and robot system |
CN111791255B (en) * | 2020-08-14 | 2022-01-25 | 维信诺科技股份有限公司 | Mechanical arm |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10279070A (en) * | 1997-04-11 | 1998-10-20 | Canon Inc | Finger for conveying substrate |
JP4067810B2 (en) * | 2001-11-07 | 2008-03-26 | 大日本印刷株式会社 | Substrate transfer device and arm thereof |
-
2005
- 2005-07-04 JP JP2005194685A patent/JP4873895B2/en not_active Expired - Fee Related
-
2006
- 2006-06-28 TW TW095123392A patent/TW200722356A/en not_active IP Right Cessation
- 2006-06-29 KR KR1020060059470A patent/KR20070004428A/en active Search and Examination
- 2006-07-04 CN CNA2006100934280A patent/CN1891589A/en active Pending
-
2008
- 2008-08-05 KR KR1020080076636A patent/KR20080076895A/en active Search and Examination
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI725115B (en) * | 2016-01-29 | 2021-04-21 | 日商達誼恆股份有限公司 | Robot for substrate transfer |
Also Published As
Publication number | Publication date |
---|---|
CN1891589A (en) | 2007-01-10 |
TWI300052B (en) | 2008-08-21 |
KR20070004428A (en) | 2007-01-09 |
JP4873895B2 (en) | 2012-02-08 |
JP2007008700A (en) | 2007-01-18 |
KR20080076895A (en) | 2008-08-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |