TW200721343A - Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit - Google Patents

Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit

Info

Publication number
TW200721343A
TW200721343A TW095128736A TW95128736A TW200721343A TW 200721343 A TW200721343 A TW 200721343A TW 095128736 A TW095128736 A TW 095128736A TW 95128736 A TW95128736 A TW 95128736A TW 200721343 A TW200721343 A TW 200721343A
Authority
TW
Taiwan
Prior art keywords
wafer holder
wafer
heater unit
less
holder
Prior art date
Application number
TW095128736A
Other languages
English (en)
Inventor
Tomoyuki Awazu
Katsuhiro Itakura
Masuhiro Natsuhara
Hirohiko Nakata
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW200721343A publication Critical patent/TW200721343A/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
TW095128736A 2005-08-04 2006-08-04 Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit TW200721343A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005226203A JP2007042909A (ja) 2005-08-04 2005-08-04 ウェハ保持体およびそれを搭載したウェハプローバ

Publications (1)

Publication Number Publication Date
TW200721343A true TW200721343A (en) 2007-06-01

Family

ID=37800605

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128736A TW200721343A (en) 2005-08-04 2006-08-04 Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit

Country Status (3)

Country Link
US (1) US20070046306A1 (zh)
JP (1) JP2007042909A (zh)
TW (1) TW200721343A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI775566B (zh) * 2021-08-13 2022-08-21 美商第一檢測有限公司 晶片檢測設備

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3945527B2 (ja) * 2004-11-30 2007-07-18 住友電気工業株式会社 ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
CN212874436U (zh) 2017-11-21 2021-04-02 沃特洛电气制造公司 一种陶瓷基座组件
CN109930132B (zh) * 2019-03-08 2021-06-18 拓荆科技股份有限公司 陶瓷环及具有陶瓷环的半导体反应腔体
CN112462221B (zh) * 2020-11-05 2022-06-17 清华大学 一种用于压接式半导体的高温老化失效的模拟测试装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100660416B1 (ko) * 1997-11-03 2006-12-22 에이에스엠 아메리카, 인코포레이티드 개량된 저질량 웨이퍼 지지 시스템
US20020036881A1 (en) * 1999-05-07 2002-03-28 Shamouil Shamouilian Electrostatic chuck having composite base and method
JP3813421B2 (ja) * 1999-08-23 2006-08-23 イビデン株式会社 ウエハプローバ装置
JP2002064133A (ja) * 2000-03-30 2002-02-28 Ibiden Co Ltd 支持容器および半導体製造・検査装置
JP2001302330A (ja) * 2000-04-24 2001-10-31 Ibiden Co Ltd セラミック基板
US6498504B2 (en) * 2000-08-28 2002-12-24 Nec Corporation Wafer inspection device and wafer inspection method
JP2003163244A (ja) * 2001-11-28 2003-06-06 Taiheiyo Cement Corp ウェハプローバ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI775566B (zh) * 2021-08-13 2022-08-21 美商第一檢測有限公司 晶片檢測設備

Also Published As

Publication number Publication date
US20070046306A1 (en) 2007-03-01
JP2007042909A (ja) 2007-02-15

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