TW200721343A - Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit - Google Patents
Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unitInfo
- Publication number
- TW200721343A TW200721343A TW095128736A TW95128736A TW200721343A TW 200721343 A TW200721343 A TW 200721343A TW 095128736 A TW095128736 A TW 095128736A TW 95128736 A TW95128736 A TW 95128736A TW 200721343 A TW200721343 A TW 200721343A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer holder
- wafer
- heater unit
- less
- holder
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005226203A JP2007042909A (ja) | 2005-08-04 | 2005-08-04 | ウェハ保持体およびそれを搭載したウェハプローバ |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200721343A true TW200721343A (en) | 2007-06-01 |
Family
ID=37800605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095128736A TW200721343A (en) | 2005-08-04 | 2006-08-04 | Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit |
Country Status (3)
Country | Link |
---|---|
US (1) | US20070046306A1 (zh) |
JP (1) | JP2007042909A (zh) |
TW (1) | TW200721343A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI775566B (zh) * | 2021-08-13 | 2022-08-21 | 美商第一檢測有限公司 | 晶片檢測設備 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3945527B2 (ja) * | 2004-11-30 | 2007-07-18 | 住友電気工業株式会社 | ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ |
CN212874436U (zh) | 2017-11-21 | 2021-04-02 | 沃特洛电气制造公司 | 一种陶瓷基座组件 |
CN109930132B (zh) * | 2019-03-08 | 2021-06-18 | 拓荆科技股份有限公司 | 陶瓷环及具有陶瓷环的半导体反应腔体 |
CN112462221B (zh) * | 2020-11-05 | 2022-06-17 | 清华大学 | 一种用于压接式半导体的高温老化失效的模拟测试装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100660416B1 (ko) * | 1997-11-03 | 2006-12-22 | 에이에스엠 아메리카, 인코포레이티드 | 개량된 저질량 웨이퍼 지지 시스템 |
US20020036881A1 (en) * | 1999-05-07 | 2002-03-28 | Shamouil Shamouilian | Electrostatic chuck having composite base and method |
JP3813421B2 (ja) * | 1999-08-23 | 2006-08-23 | イビデン株式会社 | ウエハプローバ装置 |
JP2002064133A (ja) * | 2000-03-30 | 2002-02-28 | Ibiden Co Ltd | 支持容器および半導体製造・検査装置 |
JP2001302330A (ja) * | 2000-04-24 | 2001-10-31 | Ibiden Co Ltd | セラミック基板 |
US6498504B2 (en) * | 2000-08-28 | 2002-12-24 | Nec Corporation | Wafer inspection device and wafer inspection method |
JP2003163244A (ja) * | 2001-11-28 | 2003-06-06 | Taiheiyo Cement Corp | ウェハプローバ |
-
2005
- 2005-08-04 JP JP2005226203A patent/JP2007042909A/ja active Pending
-
2006
- 2006-08-03 US US11/498,273 patent/US20070046306A1/en not_active Abandoned
- 2006-08-04 TW TW095128736A patent/TW200721343A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI775566B (zh) * | 2021-08-13 | 2022-08-21 | 美商第一檢測有限公司 | 晶片檢測設備 |
Also Published As
Publication number | Publication date |
---|---|
US20070046306A1 (en) | 2007-03-01 |
JP2007042909A (ja) | 2007-02-15 |
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