TW200720664A - Probe card for wafer test, wafer-testing device, and wafer-testing method - Google Patents
Probe card for wafer test, wafer-testing device, and wafer-testing methodInfo
- Publication number
- TW200720664A TW200720664A TW095133312A TW95133312A TW200720664A TW 200720664 A TW200720664 A TW 200720664A TW 095133312 A TW095133312 A TW 095133312A TW 95133312 A TW95133312 A TW 95133312A TW 200720664 A TW200720664 A TW 200720664A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- electrodes
- sheet
- electrode sheet
- tested
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Measurement Of Resistance Or Impedance (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005260473 | 2005-09-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200720664A true TW200720664A (en) | 2007-06-01 |
Family
ID=37835881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095133312A TW200720664A (en) | 2005-09-08 | 2006-09-08 | Probe card for wafer test, wafer-testing device, and wafer-testing method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2007029766A1 (zh) |
TW (1) | TW200720664A (zh) |
WO (1) | WO2007029766A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110546517A (zh) * | 2017-02-27 | 2019-12-06 | 迪睿合株式会社 | 电特性的检查夹具 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108051645B (zh) * | 2017-12-26 | 2023-10-27 | 宁夏钜晶源晶体科技有限公司 | 一种钽酸锂、铌酸锂晶片电阻率测试装置及测试方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003322665A (ja) * | 2002-05-01 | 2003-11-14 | Jsr Corp | 電気抵抗測定用コネクター並びに回路基板の電気抵抗測定装置および測定方法 |
-
2006
- 2006-09-07 WO PCT/JP2006/317737 patent/WO2007029766A1/ja active Application Filing
- 2006-09-07 JP JP2007534463A patent/JPWO2007029766A1/ja not_active Withdrawn
- 2006-09-08 TW TW095133312A patent/TW200720664A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110546517A (zh) * | 2017-02-27 | 2019-12-06 | 迪睿合株式会社 | 电特性的检查夹具 |
Also Published As
Publication number | Publication date |
---|---|
WO2007029766A1 (ja) | 2007-03-15 |
JPWO2007029766A1 (ja) | 2009-03-19 |
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