TW200719806A - Water cooling head and manufacturing method thereof - Google Patents

Water cooling head and manufacturing method thereof

Info

Publication number
TW200719806A
TW200719806A TW094139650A TW94139650A TW200719806A TW 200719806 A TW200719806 A TW 200719806A TW 094139650 A TW094139650 A TW 094139650A TW 94139650 A TW94139650 A TW 94139650A TW 200719806 A TW200719806 A TW 200719806A
Authority
TW
Taiwan
Prior art keywords
cover member
water
cooling head
water cooling
cooling liquid
Prior art date
Application number
TW094139650A
Other languages
English (en)
Other versions
TWI287964B (en
Inventor
Yu-Huang Peng
Original Assignee
Cooler Master Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Priority to TW094139650A priority Critical patent/TWI287964B/zh
Priority to US11/530,872 priority patent/US20070107873A1/en
Publication of TW200719806A publication Critical patent/TW200719806A/zh
Application granted granted Critical
Publication of TWI287964B publication Critical patent/TWI287964B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
TW094139650A 2005-11-11 2005-11-11 Water cooling head and manufacturing method thereof TWI287964B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094139650A TWI287964B (en) 2005-11-11 2005-11-11 Water cooling head and manufacturing method thereof
US11/530,872 US20070107873A1 (en) 2005-11-11 2006-09-11 Water-Cooling Head and Method for making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094139650A TWI287964B (en) 2005-11-11 2005-11-11 Water cooling head and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200719806A true TW200719806A (en) 2007-05-16
TWI287964B TWI287964B (en) 2007-10-01

Family

ID=38057270

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094139650A TWI287964B (en) 2005-11-11 2005-11-11 Water cooling head and manufacturing method thereof

Country Status (2)

Country Link
US (1) US20070107873A1 (zh)
TW (1) TWI287964B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI746344B (zh) * 2021-01-07 2021-11-11 大陸商深圳興奇宏科技有限公司 液冷裝置
US11934213B2 (en) 2021-02-18 2024-03-19 Asia Vital Components (China) Co., Ltd. Liquid-cooling device

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5283836B2 (ja) * 2006-07-25 2013-09-04 富士通株式会社 液冷ユニット用受熱器および液冷ユニット並びに電子機器
JP5148079B2 (ja) * 2006-07-25 2013-02-20 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP2008027374A (ja) * 2006-07-25 2008-02-07 Fujitsu Ltd 液冷ユニット用受熱器および液冷ユニット並びに電子機器
JP5133531B2 (ja) * 2006-07-25 2013-01-30 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
KR101164611B1 (ko) * 2008-09-22 2012-07-13 성균관대학교산학협력단 루프형 히트파이프 시스템용 증발기의 제조방법
US20100296249A1 (en) * 2009-05-19 2010-11-25 Beijing AVC Technology Research Center Co., Ltd. Micro passage cold plate device for a liquid cooling radiator
US20110016906A1 (en) * 2009-07-24 2011-01-27 Powerquest, Inc Highly efficient cooling systems
US9686887B2 (en) 2014-09-15 2017-06-20 Nicholas Michael D'Onofrio Liquid cooled metal core printed circuit board
JP6663899B2 (ja) * 2017-11-29 2020-03-13 本田技研工業株式会社 冷却装置
CN109843021A (zh) * 2017-11-29 2019-06-04 奥斯通有限公司 散热结构及球状体成型散热结构

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4593754A (en) * 1980-06-24 1986-06-10 Holl Richard A Shell and tube heat transfer apparatus and process therefor
US4730665A (en) * 1983-07-14 1988-03-15 Technology Enterprises Company Apparatus for cooling high-density integrated circuit packages
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US4884169A (en) * 1989-01-23 1989-11-28 Technology Enterprises Company Bubble generation in condensation wells for cooling high density integrated circuit chips
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
US5275237A (en) * 1992-06-12 1994-01-04 Micron Technology, Inc. Liquid filled hot plate for precise temperature control
US6867973B2 (en) * 2003-03-05 2005-03-15 Shyy-Woei Chang Heat dissipation device with liquid coolant
US7044199B2 (en) * 2003-10-20 2006-05-16 Thermal Corp. Porous media cold plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI746344B (zh) * 2021-01-07 2021-11-11 大陸商深圳興奇宏科技有限公司 液冷裝置
US11934213B2 (en) 2021-02-18 2024-03-19 Asia Vital Components (China) Co., Ltd. Liquid-cooling device

Also Published As

Publication number Publication date
US20070107873A1 (en) 2007-05-17
TWI287964B (en) 2007-10-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees