TW200719805A - Heat dissipation module - Google Patents
Heat dissipation moduleInfo
- Publication number
- TW200719805A TW200719805A TW094138935A TW94138935A TW200719805A TW 200719805 A TW200719805 A TW 200719805A TW 094138935 A TW094138935 A TW 094138935A TW 94138935 A TW94138935 A TW 94138935A TW 200719805 A TW200719805 A TW 200719805A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- dissipation module
- heat
- bending
- fixing part
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 6
- 238000005452 bending Methods 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094138935A TWI300325B (en) | 2005-11-07 | 2005-11-07 | Heat dissipation module |
| US11/538,440 US20070103871A1 (en) | 2005-11-07 | 2006-10-04 | Heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094138935A TWI300325B (en) | 2005-11-07 | 2005-11-07 | Heat dissipation module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200719805A true TW200719805A (en) | 2007-05-16 |
| TWI300325B TWI300325B (en) | 2008-08-21 |
Family
ID=38003517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094138935A TWI300325B (en) | 2005-11-07 | 2005-11-07 | Heat dissipation module |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20070103871A1 (zh) |
| TW (1) | TWI300325B (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202009012555U1 (de) * | 2009-09-17 | 2010-03-04 | Kunstwadl, Hans | Kühlvorrichtung |
| CN102573386A (zh) * | 2010-12-20 | 2012-07-11 | 富准精密工业(深圳)有限公司 | 散热模组及其制造方法 |
| CN114789750A (zh) * | 2022-05-12 | 2022-07-26 | 一汽解放汽车有限公司 | 一种散热转向油管总成 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6598295B1 (en) * | 2002-03-07 | 2003-07-29 | Brazeway, Inc. | Plate-fin and tube heat exchanger with a dog-bone and serpentine tube insertion method |
| CN2842733Y (zh) * | 2005-06-10 | 2006-11-29 | 富准精密工业(深圳)有限公司 | 散热装置 |
-
2005
- 2005-11-07 TW TW094138935A patent/TWI300325B/zh active
-
2006
- 2006-10-04 US US11/538,440 patent/US20070103871A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| TWI300325B (en) | 2008-08-21 |
| US20070103871A1 (en) | 2007-05-10 |
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