TW200717670A - Image sensor module of circuit packaging - Google Patents

Image sensor module of circuit packaging

Info

Publication number
TW200717670A
TW200717670A TW094138156A TW94138156A TW200717670A TW 200717670 A TW200717670 A TW 200717670A TW 094138156 A TW094138156 A TW 094138156A TW 94138156 A TW94138156 A TW 94138156A TW 200717670 A TW200717670 A TW 200717670A
Authority
TW
Taiwan
Prior art keywords
image sensor
circuit
frame
electrical contacts
sensor module
Prior art date
Application number
TW094138156A
Other languages
Chinese (zh)
Other versions
TWI287842B (en
Inventor
Chih-Hung Hsieh
Siew-Sin Hiew
Original Assignee
Acme System Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acme System Technologies Corp filed Critical Acme System Technologies Corp
Priority to TW94138156A priority Critical patent/TWI287842B/en
Publication of TW200717670A publication Critical patent/TW200717670A/en
Application granted granted Critical
Publication of TWI287842B publication Critical patent/TWI287842B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
    • H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
    • H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
    • H01L2224/48478—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
    • H01L2224/4848—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Abstract

An image sensor module of circuit packaging includes: a circuit board having a surface formed thereon a module circuit and multiple electrical contacts formed on the module circuit; and a sensor chip configured on the surface of the circuit board and having a sensing area and multiple pads formed around the sensing area wherein the pads and the electrical contacts are connected by wire bonding. A frame (or a lens fixer) is attached to the surface of the circuit board, so that the solder wires inside the electrical contacts and closed to the end area is placed in between the frame (or the lens fixer) and a first surface. Therefore, the frame can be pasted with a light penetrating plate or the lens fixer can be assembled with a lens set.
TW94138156A 2005-10-31 2005-10-31 Image sensor module of circuit packaging TWI287842B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94138156A TWI287842B (en) 2005-10-31 2005-10-31 Image sensor module of circuit packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94138156A TWI287842B (en) 2005-10-31 2005-10-31 Image sensor module of circuit packaging

Publications (2)

Publication Number Publication Date
TW200717670A true TW200717670A (en) 2007-05-01
TWI287842B TWI287842B (en) 2007-10-01

Family

ID=39201785

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94138156A TWI287842B (en) 2005-10-31 2005-10-31 Image sensor module of circuit packaging

Country Status (1)

Country Link
TW (1) TWI287842B (en)

Also Published As

Publication number Publication date
TWI287842B (en) 2007-10-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees