TW200703688A - Chip package structure - Google Patents

Chip package structure

Info

Publication number
TW200703688A
TW200703688A TW094123502A TW94123502A TW200703688A TW 200703688 A TW200703688 A TW 200703688A TW 094123502 A TW094123502 A TW 094123502A TW 94123502 A TW94123502 A TW 94123502A TW 200703688 A TW200703688 A TW 200703688A
Authority
TW
Taiwan
Prior art keywords
chip
package structure
circuit substrate
die pad
chip package
Prior art date
Application number
TW094123502A
Other languages
Chinese (zh)
Inventor
Char-Jung Lee
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW094123502A priority Critical patent/TW200703688A/en
Publication of TW200703688A publication Critical patent/TW200703688A/en

Links

Landscapes

  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)

Abstract

A chip package structure including a circuit substrate, an inner adhesive layer, a chip, bonding wires and an optical element module is provided. The circuit substrate has a die pad and fingers. The circuit substrate has an inner groove located between the die pad and the fingers. The inner adhesive layer is disposed on the die pad. The chip is adhered to the die pad by the inner adhesive layer. The chip is electrically connected to the fingers by the bonding wires. The optical element module is disposed on the circuit substrate and located above the chip. In the chip package structure, the flush phenomenon or contamination is avoided by the inner groove.
TW094123502A 2005-07-12 2005-07-12 Chip package structure TW200703688A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094123502A TW200703688A (en) 2005-07-12 2005-07-12 Chip package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094123502A TW200703688A (en) 2005-07-12 2005-07-12 Chip package structure

Publications (1)

Publication Number Publication Date
TW200703688A true TW200703688A (en) 2007-01-16

Family

ID=57910556

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123502A TW200703688A (en) 2005-07-12 2005-07-12 Chip package structure

Country Status (1)

Country Link
TW (1) TW200703688A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110941064A (en) * 2018-09-21 2020-03-31 先进光电科技股份有限公司 Optical imaging module
CN110941066A (en) * 2018-09-21 2020-03-31 先进光电科技股份有限公司 Optical imaging module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110941064A (en) * 2018-09-21 2020-03-31 先进光电科技股份有限公司 Optical imaging module
CN110941066A (en) * 2018-09-21 2020-03-31 先进光电科技股份有限公司 Optical imaging module

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