TW200703688A - Chip package structure - Google Patents
Chip package structureInfo
- Publication number
- TW200703688A TW200703688A TW094123502A TW94123502A TW200703688A TW 200703688 A TW200703688 A TW 200703688A TW 094123502 A TW094123502 A TW 094123502A TW 94123502 A TW94123502 A TW 94123502A TW 200703688 A TW200703688 A TW 200703688A
- Authority
- TW
- Taiwan
- Prior art keywords
- chip
- package structure
- circuit substrate
- die pad
- chip package
- Prior art date
Links
Landscapes
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
Abstract
A chip package structure including a circuit substrate, an inner adhesive layer, a chip, bonding wires and an optical element module is provided. The circuit substrate has a die pad and fingers. The circuit substrate has an inner groove located between the die pad and the fingers. The inner adhesive layer is disposed on the die pad. The chip is adhered to the die pad by the inner adhesive layer. The chip is electrically connected to the fingers by the bonding wires. The optical element module is disposed on the circuit substrate and located above the chip. In the chip package structure, the flush phenomenon or contamination is avoided by the inner groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094123502A TW200703688A (en) | 2005-07-12 | 2005-07-12 | Chip package structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094123502A TW200703688A (en) | 2005-07-12 | 2005-07-12 | Chip package structure |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200703688A true TW200703688A (en) | 2007-01-16 |
Family
ID=57910556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094123502A TW200703688A (en) | 2005-07-12 | 2005-07-12 | Chip package structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200703688A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110941064A (en) * | 2018-09-21 | 2020-03-31 | 先进光电科技股份有限公司 | Optical imaging module |
CN110941066A (en) * | 2018-09-21 | 2020-03-31 | 先进光电科技股份有限公司 | Optical imaging module |
-
2005
- 2005-07-12 TW TW094123502A patent/TW200703688A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110941064A (en) * | 2018-09-21 | 2020-03-31 | 先进光电科技股份有限公司 | Optical imaging module |
CN110941066A (en) * | 2018-09-21 | 2020-03-31 | 先进光电科技股份有限公司 | Optical imaging module |
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