TW200714043A - Image sensor package and digital camera module therewith - Google Patents

Image sensor package and digital camera module therewith

Info

Publication number
TW200714043A
TW200714043A TW094130337A TW94130337A TW200714043A TW 200714043 A TW200714043 A TW 200714043A TW 094130337 A TW094130337 A TW 094130337A TW 94130337 A TW94130337 A TW 94130337A TW 200714043 A TW200714043 A TW 200714043A
Authority
TW
Taiwan
Prior art keywords
image sensor
sensor package
digital camera
camera module
substrate
Prior art date
Application number
TW094130337A
Other languages
Chinese (zh)
Inventor
Steven Webster
Ying-Cheng Wu
Original Assignee
Altus Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Altus Technology Inc filed Critical Altus Technology Inc
Priority to TW094130337A priority Critical patent/TW200714043A/en
Publication of TW200714043A publication Critical patent/TW200714043A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

The present invention relates an image sensor package and a digital camera module therewith. The image sensor package includes a holder, an image sensor, a plurality of bonding wires and a plate. The holder includes a conductor gateway and a substrate. The conductor gateway inlays in the substrate. There is a solder pad zone formed out of the body. The image sensor has a sensing area, and is disposed in the holder. One end of each bonding wire is connected to the solder pad zone and another end of the bonding wire is connected to the image sensor. The bonding wires are surrounded by pastern. The pastern is pasted on the plate to form a cavum. The plate is fixed on the substrate.
TW094130337A 2005-09-05 2005-09-05 Image sensor package and digital camera module therewith TW200714043A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094130337A TW200714043A (en) 2005-09-05 2005-09-05 Image sensor package and digital camera module therewith

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094130337A TW200714043A (en) 2005-09-05 2005-09-05 Image sensor package and digital camera module therewith

Publications (1)

Publication Number Publication Date
TW200714043A true TW200714043A (en) 2007-04-01

Family

ID=57911457

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130337A TW200714043A (en) 2005-09-05 2005-09-05 Image sensor package and digital camera module therewith

Country Status (1)

Country Link
TW (1) TW200714043A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425825B (en) * 2009-12-31 2014-02-01 Kingpak Tech Inc Image sensor package structure with predetermined focus
CN104660926A (en) * 2013-11-25 2015-05-27 光宝科技股份有限公司 Optical image acquisition module as well as manufacturing method and optical auxiliary unit thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425825B (en) * 2009-12-31 2014-02-01 Kingpak Tech Inc Image sensor package structure with predetermined focus
CN104660926A (en) * 2013-11-25 2015-05-27 光宝科技股份有限公司 Optical image acquisition module as well as manufacturing method and optical auxiliary unit thereof
CN104660926B (en) * 2013-11-25 2018-04-06 光宝科技股份有限公司 Optical profile type image collection module and preparation method thereof and optics auxiliary unit

Similar Documents

Publication Publication Date Title
GB2411307B (en) Image sensor module and camera module package including the same
SG144891A1 (en) Image sensor package with die receiving opening and method of the same
TW200515567A (en) Chip package and electrical-connection structure between chip and substrate
TW200503209A (en) Semiconductor package
JP2014515187A5 (en)
EP1221716A3 (en) IC chip package
TW200737437A (en) Chip package and package process thereof
SG170096A1 (en) Integrated circuit package system with leads separated from a die paddle
TW200504901A (en) A semiconductor device
SG151238A1 (en) Integrated circuit package system including die having relieved active region
TW200509336A (en) Flip chip stacked package
TWI268584B (en) Optical integrated circuit element package and method for making the same
TW200714043A (en) Image sensor package and digital camera module therewith
TW200715586A (en) Universal chip package structure
TW200639991A (en) A method and package for packaging an image sensor
TW200737445A (en) Chip package structure
JP2011003764A5 (en) Semiconductor device
SG131789A1 (en) Semiconductor package with position member and method of manufacturing the same
TW200717733A (en) Image chip package structure and packaging method thereof
TW200709306A (en) Chip package and package process thereof
TW200709454A (en) Image sensor package
US20080067334A1 (en) Image sensor package structure and method for manufacturing the same
TW200512881A (en) Chip scale package of an image sensor
TW200744165A (en) Chip package structure
TW200729431A (en) Image sensor chip package