TW200716771A - Arrangement for the vapor deposition on substrates - Google Patents
Arrangement for the vapor deposition on substratesInfo
- Publication number
- TW200716771A TW200716771A TW095120340A TW95120340A TW200716771A TW 200716771 A TW200716771 A TW 200716771A TW 095120340 A TW095120340 A TW 095120340A TW 95120340 A TW95120340 A TW 95120340A TW 200716771 A TW200716771 A TW 200716771A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrates
- arrangement
- vapor deposition
- seal
- cover
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Cookers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05023354A EP1788112B1 (de) | 2005-10-26 | 2005-10-26 | Vorrichtung zum Bedampfen von Substraten |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200716771A true TW200716771A (en) | 2007-05-01 |
Family
ID=35276171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095120340A TW200716771A (en) | 2005-10-26 | 2006-06-08 | Arrangement for the vapor deposition on substrates |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070089676A1 (zh) |
EP (1) | EP1788112B1 (zh) |
JP (1) | JP2007119917A (zh) |
KR (1) | KR20070045120A (zh) |
AT (1) | ATE520799T1 (zh) |
RU (1) | RU2006135360A (zh) |
TW (1) | TW200716771A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI496213B (zh) * | 2008-03-17 | 2015-08-11 | Tokyo Electron Ltd | Substrate processing device |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101925688B (zh) * | 2007-12-21 | 2012-12-05 | 工业等离子体服务与技术Ipst有限公司 | 用于控制真空蒸发中蒸汽流的方法和装置 |
WO2010023109A1 (en) * | 2008-08-25 | 2010-03-04 | Applied Materials Inc. | Coating chamber with a moveable shield |
US20100044213A1 (en) * | 2008-08-25 | 2010-02-25 | Applied Materials, Inc. | Coating chamber with a moveable shield |
KR20110110187A (ko) * | 2008-12-18 | 2011-10-06 | 비코 인스트루먼트 아이엔씨. | 열확산 오리피스를 갖는 진공 증착원 |
US20110195187A1 (en) * | 2010-02-10 | 2011-08-11 | Apple Inc. | Direct liquid vaporization for oleophobic coatings |
FR2956412B1 (fr) * | 2010-02-16 | 2012-04-06 | Astron Fiamm Safety | Vanne d'obturation a volume constant d'une source de depot en phase vapeur |
US8801858B2 (en) * | 2010-12-23 | 2014-08-12 | First Solar, Inc. | Non-wear shutter apparatus for a vapor deposition apparatus |
DE102011016814B4 (de) * | 2011-04-12 | 2017-03-23 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Verdampferzellen-Verschlusseinrichtung für eine Beschichtungsanlage |
US8715779B2 (en) | 2011-06-24 | 2014-05-06 | Apple Inc. | Enhanced glass impact durability through application of thin films |
TWI582251B (zh) * | 2014-10-31 | 2017-05-11 | 財團法人工業技術研究院 | 蒸鍍系統以及蒸鍍方法 |
JP6282241B2 (ja) * | 2015-03-02 | 2018-02-21 | マシン・テクノロジー株式会社 | パターニング材料付着装置および積層体形成装置 |
TWI737718B (zh) * | 2016-04-25 | 2021-09-01 | 美商創新先進材料股份有限公司 | 含有瀉流源的沉積系統及相關方法 |
CN113718204A (zh) * | 2021-08-31 | 2021-11-30 | 京东方科技集团股份有限公司 | 一种金属蒸发源设备 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3922187A1 (de) * | 1989-07-06 | 1991-01-17 | Leybold Ag | Vorrichtung zum herstellen von metallfreien streifen bei im vakuum beschichteten folienbahnen, insbesondere fuer kondensatoren |
DE4100643C1 (zh) * | 1991-01-11 | 1991-10-31 | Leybold Ag, 6450 Hanau, De | |
US6011904A (en) * | 1997-06-10 | 2000-01-04 | Board Of Regents, University Of Texas | Molecular beam epitaxy effusion cell |
DE19843818A1 (de) * | 1998-09-24 | 2000-03-30 | Leybold Systems Gmbh | Bedampfungsvorrichtung für Vakuum-Bedampfungsanlagen |
DE19848177A1 (de) * | 1998-10-20 | 2000-04-27 | Leybold Systems Gmbh | Bedampfungsvorrichtung |
JP4380319B2 (ja) * | 2002-12-19 | 2009-12-09 | ソニー株式会社 | 蒸着装置および有機エレクトロルミネッセンス素子の製造方法 |
WO2004105095A2 (en) * | 2003-05-16 | 2004-12-02 | Svt Associates Inc. | Thin-film deposition evaporator |
DE10330401B3 (de) * | 2003-07-04 | 2005-02-24 | Applied Films Gmbh & Co. Kg | Verfahren und Vorrichtung zum bereichsweisen Auftragen von Trennmitteln |
-
2005
- 2005-10-26 AT AT05023354T patent/ATE520799T1/de active
- 2005-10-26 EP EP05023354A patent/EP1788112B1/de not_active Not-in-force
-
2006
- 2006-06-02 US US11/446,445 patent/US20070089676A1/en not_active Abandoned
- 2006-06-08 TW TW095120340A patent/TW200716771A/zh unknown
- 2006-10-06 RU RU2006135360/02A patent/RU2006135360A/ru unknown
- 2006-10-18 JP JP2006283846A patent/JP2007119917A/ja not_active Withdrawn
- 2006-10-25 KR KR1020060104175A patent/KR20070045120A/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI496213B (zh) * | 2008-03-17 | 2015-08-11 | Tokyo Electron Ltd | Substrate processing device |
Also Published As
Publication number | Publication date |
---|---|
EP1788112B1 (de) | 2011-08-17 |
RU2006135360A (ru) | 2008-04-20 |
EP1788112A1 (de) | 2007-05-23 |
JP2007119917A (ja) | 2007-05-17 |
KR20070045120A (ko) | 2007-05-02 |
ATE520799T1 (de) | 2011-09-15 |
US20070089676A1 (en) | 2007-04-26 |
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