TW200715463A - Sticking controller - Google Patents

Sticking controller

Info

Publication number
TW200715463A
TW200715463A TW095117133A TW95117133A TW200715463A TW 200715463 A TW200715463 A TW 200715463A TW 095117133 A TW095117133 A TW 095117133A TW 95117133 A TW95117133 A TW 95117133A TW 200715463 A TW200715463 A TW 200715463A
Authority
TW
Taiwan
Prior art keywords
sticking
wafer
sensors
holding roller
shift amount
Prior art date
Application number
TW095117133A
Other languages
English (en)
Inventor
Koichi Yamaguchi
Takeshi Akechi
Yoshiaki Sugishita
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200715463A publication Critical patent/TW200715463A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
TW095117133A 2005-06-06 2006-05-15 Sticking controller TW200715463A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005166074A JP2006339608A (ja) 2005-06-06 2005-06-06 貼付制御装置

Publications (1)

Publication Number Publication Date
TW200715463A true TW200715463A (en) 2007-04-16

Family

ID=37498283

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095117133A TW200715463A (en) 2005-06-06 2006-05-15 Sticking controller

Country Status (3)

Country Link
JP (1) JP2006339608A (zh)
TW (1) TW200715463A (zh)
WO (1) WO2006132078A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4746012B2 (ja) * 2007-07-04 2011-08-10 リンテック株式会社 貼付装置及び貼付方法
KR101022017B1 (ko) * 2008-10-01 2011-03-16 한국기계연구원 계층화 구조물 제조 장치
KR101048621B1 (ko) * 2009-11-11 2011-07-12 상신이엔지 주식회사 자동차 브레이크 패드용 소음방지판 공급장치
JP2018041916A (ja) * 2016-09-09 2018-03-15 株式会社ディスコ テープ貼着方法
CN108807230B (zh) * 2018-06-11 2020-07-24 皖江新兴产业技术发展中心 分选机吸头工作位精确校准方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05254724A (ja) * 1992-03-11 1993-10-05 Mitsubishi Heavy Ind Ltd 複合材自動積層装置
JP3377847B2 (ja) * 1993-12-29 2003-02-17 日東電工株式会社 基板への粘着フィルム貼着装置
JP2002154737A (ja) * 2000-11-16 2002-05-28 Tokyo Autom Mach Works Ltd 上包み包装機の開封テープ供給制御装置

Also Published As

Publication number Publication date
JP2006339608A (ja) 2006-12-14
WO2006132078A1 (ja) 2006-12-14

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