TW200714949A - Bonding methods and optical assemblies - Google Patents

Bonding methods and optical assemblies

Info

Publication number
TW200714949A
TW200714949A TW095129736A TW95129736A TW200714949A TW 200714949 A TW200714949 A TW 200714949A TW 095129736 A TW095129736 A TW 095129736A TW 95129736 A TW95129736 A TW 95129736A TW 200714949 A TW200714949 A TW 200714949A
Authority
TW
Taiwan
Prior art keywords
optical assemblies
bonding methods
bonding
methods
optical
Prior art date
Application number
TW095129736A
Other languages
English (en)
Inventor
Carl E Gaebe
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200714949A publication Critical patent/TW200714949A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Ceramic Products (AREA)
TW095129736A 2005-08-15 2006-08-14 Bonding methods and optical assemblies TW200714949A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70855205P 2005-08-15 2005-08-15
US70864105P 2005-08-16 2005-08-16

Publications (1)

Publication Number Publication Date
TW200714949A true TW200714949A (en) 2007-04-16

Family

ID=37232862

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095129736A TW200714949A (en) 2005-08-15 2006-08-14 Bonding methods and optical assemblies

Country Status (5)

Country Link
US (1) US20070036496A1 (zh)
EP (1) EP1754763A3 (zh)
JP (1) JP2008026839A (zh)
CA (1) CA2556117A1 (zh)
TW (1) TW200714949A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007294523A (ja) * 2006-04-21 2007-11-08 Oki Electric Ind Co Ltd 表面実装型光結合器、その実装方法、及び、その製造方法
KR101251028B1 (ko) * 2008-04-26 2013-04-04 광주과학기술원 광배선 구조물 및 그 제조방법
GB0813784D0 (en) 2008-07-28 2008-09-03 Ct Integrated Photonics Ltd Optical intergration system
US20110317972A1 (en) * 2010-06-25 2011-12-29 Agency For Science, Technology And Research Optical device, optical arrangement and optical element holder
US9323010B2 (en) 2012-01-10 2016-04-26 Invensas Corporation Structures formed using monocrystalline silicon and/or other materials for optical and other applications
US8757897B2 (en) * 2012-01-10 2014-06-24 Invensas Corporation Optical interposer
CN108459383B (zh) * 2013-11-30 2020-04-24 深圳市迅特通信技术有限公司 一种光耦合模块与光纤连接器
DE102015101878B4 (de) * 2015-02-10 2021-08-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mit Aktivlot versiegelte Mikrosystemtechnik-Bauelemente, Komponenten hierfür und Lottransferverfahren zu ihrer Herstellung

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3533155A (en) * 1967-07-06 1970-10-13 Western Electric Co Bonding with a compliant medium
DE2417478A1 (de) * 1974-04-10 1975-10-30 Deutsche Bundespost Verfahren zum verbinden von anorganischen koerpern mit metall
US5178319A (en) * 1991-04-02 1993-01-12 At&T Bell Laboratories Compression bonding methods
DE69611282T2 (de) * 1995-12-22 2001-04-26 Lucent Technologies Inc., Murray Hill Optische Unteranordnung mit niedriger Abmessung
EP0895111A1 (en) * 1997-07-22 1999-02-03 Lucent Technologies Inc. Bonding of aluminum oxide components to silicon substrates
US6582548B1 (en) * 2000-07-28 2003-06-24 Triquint Technology Holding Co. Compression bonding method using laser assisted heating
US7345316B2 (en) * 2000-10-25 2008-03-18 Shipley Company, L.L.C. Wafer level packaging for optoelectronic devices
EP1327899A1 (en) * 2002-01-07 2003-07-16 Alcatel A method for manufacturing an optical module and an optical module
EP1509381B1 (de) * 2002-05-25 2005-12-07 Sustech GmbH & Co. KG Verfahren und vorrichtung zum verbinden von formteilen mit wenigstens einer klebstoffnaht aus einem durch wärmebeaufschlagung aushärtbaren klebstoff
US20050140065A1 (en) * 2002-05-25 2005-06-30 Hans-Martin Sauer Method and device for connecting molded parts
JP2005067926A (ja) * 2003-08-21 2005-03-17 Asahi Glass Co Ltd 接合用組成物、接合材および接合体
JP2005077894A (ja) * 2003-09-02 2005-03-24 Matsushita Electric Ind Co Ltd 光学部品のレーザ接合方法
EP2937897A3 (en) * 2003-09-15 2016-03-23 Nuvotronics LLC Device package and methods for the fabrication and testing thereof
JP2007536088A (ja) * 2004-05-04 2007-12-13 エス−ボンド テクノロジーズ、エルエルシー インジウム、ビスマス及び／またはカドミウムを含有する低温活性半田を用いて形成した電子パッケージ

Also Published As

Publication number Publication date
JP2008026839A (ja) 2008-02-07
EP1754763A3 (en) 2007-07-11
CA2556117A1 (en) 2007-02-15
US20070036496A1 (en) 2007-02-15
EP1754763A2 (en) 2007-02-21

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