TW200712607A - Flexible pixel array substrate and method of fabricating the same - Google Patents

Flexible pixel array substrate and method of fabricating the same

Info

Publication number
TW200712607A
TW200712607A TW094131598A TW94131598A TW200712607A TW 200712607 A TW200712607 A TW 200712607A TW 094131598 A TW094131598 A TW 094131598A TW 94131598 A TW94131598 A TW 94131598A TW 200712607 A TW200712607 A TW 200712607A
Authority
TW
Taiwan
Prior art keywords
pixel array
fabricating
array substrate
same
polymer film
Prior art date
Application number
TW094131598A
Other languages
English (en)
Other versions
TWI321241B (en
Inventor
Chin-Jen Huang
Jung-Fang Chang
Yih-Rong Luo
Yu-Hung Chen
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW094131598A priority Critical patent/TWI321241B/zh
Priority to US11/164,408 priority patent/US7566950B2/en
Publication of TW200712607A publication Critical patent/TW200712607A/zh
Priority to US12/487,657 priority patent/US7807551B2/en
Application granted granted Critical
Publication of TWI321241B publication Critical patent/TWI321241B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
TW094131598A 2005-09-14 2005-09-14 Flexible pixel array substrate and method of fabricating the same TWI321241B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094131598A TWI321241B (en) 2005-09-14 2005-09-14 Flexible pixel array substrate and method of fabricating the same
US11/164,408 US7566950B2 (en) 2005-09-14 2005-11-22 Flexible pixel array substrate
US12/487,657 US7807551B2 (en) 2005-09-14 2009-06-19 Method for fabricating flexible pixel array substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094131598A TWI321241B (en) 2005-09-14 2005-09-14 Flexible pixel array substrate and method of fabricating the same

Publications (2)

Publication Number Publication Date
TW200712607A true TW200712607A (en) 2007-04-01
TWI321241B TWI321241B (en) 2010-03-01

Family

ID=37855707

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131598A TWI321241B (en) 2005-09-14 2005-09-14 Flexible pixel array substrate and method of fabricating the same

Country Status (2)

Country Link
US (2) US7566950B2 (zh)
TW (1) TWI321241B (zh)

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CN102082150A (zh) * 2009-08-28 2011-06-01 三星移动显示器株式会社 柔性显示器及其制造方法
CN102455453A (zh) * 2010-10-21 2012-05-16 元太科技工业股份有限公司 可挠性彩色滤光基板的制造方法
TWI406608B (zh) * 2007-06-25 2013-08-21 Haeun Chemtec Co Ltd Ｆｐｃｂ之製造方法
WO2013135066A1 (zh) * 2012-03-14 2013-09-19 京东方科技集团股份有限公司 柔性显示装置的制备方法
TWI413038B (zh) * 2009-10-02 2013-10-21 Innolux Corp 軟性顯示器元件之製作方法
US8834655B2 (en) 2009-04-17 2014-09-16 Industrial Technology Research Institute Method for isolating flexible substrate from support substrate
US8883053B2 (en) 2009-04-17 2014-11-11 Industrial Technology Research Institute Method for isolating flexible film from support substrate
TWI464633B (zh) * 2010-02-12 2014-12-11 Cando Corp Method of manufacturing flexible touch panel
US9096044B2 (en) 2010-06-24 2015-08-04 Au Optronics Corporation Flexible display panel and method of fabricating the same
US9142797B2 (en) 2010-05-31 2015-09-22 Industrial Technology Research Institute Gas barrier substrate and organic electro-luminescent device
US10173407B2 (en) 2015-11-20 2019-01-08 Industrial Technology Research Institute Device for removing and adhering substrate and method for using the device

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US20100330748A1 (en) * 1999-10-25 2010-12-30 Xi Chu Method of encapsulating an environmentally sensitive device
TWI276191B (en) * 2005-08-30 2007-03-11 Ind Tech Res Inst Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same
TWI265606B (en) * 2005-09-19 2006-11-01 Ind Tech Res Inst Method of fabricating flexible thin film transistor array substrate
TWI354854B (en) 2008-09-15 2011-12-21 Ind Tech Res Inst Substrate structures applied in flexible electrica
KR101009415B1 (ko) * 2008-11-18 2011-01-19 삼성모바일디스플레이주식회사 플라스틱 기판을 구비한 전자장치 제조방법, 이에 의해 제조된 전자장치 및 상기 제조방법에 사용되는 장치
US9601530B2 (en) 2008-12-02 2017-03-21 Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
US9721825B2 (en) 2008-12-02 2017-08-01 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
US9991311B2 (en) 2008-12-02 2018-06-05 Arizona Board Of Regents On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
US8273439B2 (en) * 2008-12-08 2012-09-25 Industrial Technology Research Institute Release layer materials, substrate structures comprising the same and fabrication method thereof
TWI505410B (zh) * 2008-12-30 2015-10-21 Ind Tech Res Inst 應用於軟性電子元件之基板結構及其製造方法
TWI419091B (zh) 2009-02-10 2013-12-11 Ind Tech Res Inst 可轉移的可撓式電子裝置結構及可撓式電子裝置的製造方法
TWI410329B (zh) * 2009-03-09 2013-10-01 Ind Tech Res Inst 可撓式裝置的取下設備及其取下方法
JP5545970B2 (ja) * 2009-03-26 2014-07-09 株式会社半導体エネルギー研究所 発光装置及びその作製方法
CN102013414A (zh) * 2009-09-08 2011-04-13 群康科技(深圳)有限公司 软性显示器组件的制作方法
KR101618157B1 (ko) * 2009-12-21 2016-05-09 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN102194829B (zh) * 2010-03-11 2013-07-10 财团法人工业技术研究院 基板结构及其制造方法
US20110291544A1 (en) * 2010-05-31 2011-12-01 Industrial Technology Research Institute Gas barrier substrate, package of organic electro-luminenscent device and packaging method thereof
CN101916022B (zh) * 2010-07-06 2012-10-10 友达光电股份有限公司 可挠性显示面板及其制造方法
WO2012043971A2 (ko) * 2010-09-29 2012-04-05 포항공과대학교 산학협력단 롤 형상의 모기판을 이용한 플렉서블 전자소자의 제조방법, 플렉서블 전자소자 및 플렉서블 기판
TWI457614B (zh) * 2010-10-05 2014-10-21 E Ink Holdings Inc 可撓性彩色濾光基板的製造方法
TWI486259B (zh) 2010-12-27 2015-06-01 Au Optronics Corp 可撓式基板結構及其製作方法
JP2012146448A (ja) * 2011-01-11 2012-08-02 Nitto Denko Corp 有機ｅｌ装置の製造方法および有機ｅｌ装置製造用基板
JP5355618B2 (ja) * 2011-03-10 2013-11-27 三星ディスプレイ株式會社 可撓性表示装置及びこの製造方法
KR101893530B1 (ko) * 2011-03-10 2018-08-31 삼성디스플레이 주식회사 가요성 표시 장치 및 이의 제조 방법
TWI433625B (zh) 2011-07-04 2014-04-01 Ind Tech Res Inst 軟性電子元件的製法
CN103518262B (zh) * 2011-07-06 2016-07-06 松下电器产业株式会社 挠性器件的制造方法及挠性器件
TWI539414B (zh) 2011-09-21 2016-06-21 友達光電股份有限公司 可撓式顯示器的製作方法
CN102738078B (zh) 2012-06-21 2014-11-12 京东方科技集团股份有限公司 柔性显示基板的制作方法
TWI492373B (zh) * 2012-08-09 2015-07-11 Au Optronics Corp 可撓式顯示模組的製作方法
KR20230003401A (ko) 2012-08-10 2023-01-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치
KR20140060776A (ko) * 2012-11-12 2014-05-21 삼성디스플레이 주식회사 플렉서블 표시 장치 및 그 제조 방법
TWI500077B (zh) * 2012-11-29 2015-09-11 Ind Tech Res Inst 軟性元件的取出方法及基板之間的分離方法
CN103531722B (zh) * 2012-12-24 2016-01-20 Tcl集团股份有限公司 一种柔性显示器的制备方法
KR20150029429A (ko) * 2013-09-10 2015-03-18 삼성디스플레이 주식회사 표시 패널 및 그의 제조 방법
CN103682177B (zh) * 2013-12-16 2015-03-25 深圳市华星光电技术有限公司 柔性oled面板的制作方法
CN103700672A (zh) * 2013-12-24 2014-04-02 华映视讯（吴江）有限公司 可挠性组件基板以及其制作方法
WO2015156891A2 (en) * 2014-01-23 2015-10-15 Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
WO2017034644A2 (en) 2015-06-09 2017-03-02 ARIZONA BOARD OF REGENTS a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY Method of providing an electronic device and electronic device thereof
US10381224B2 (en) 2014-01-23 2019-08-13 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
JP6610534B2 (ja) * 2014-03-31 2019-11-27 日産化学株式会社 剥離層形成用組成物
CN106663640B (zh) 2014-05-13 2020-01-07 代表亚利桑那大学的亚利桑那校董会 提供电子器件的方法及其电子器件
CN104505467B (zh) * 2014-12-05 2017-09-19 上海天马微电子有限公司 一种复合基板、柔性显示器的制造方法以及柔性显示器
US10446582B2 (en) 2014-12-22 2019-10-15 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an imaging system and imaging system thereof
US10074816B2 (en) * 2014-12-22 2018-09-11 Industrial Technology Research Institute Substrate structure for electronic device and production method thereof
US9741742B2 (en) 2014-12-22 2017-08-22 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Deformable electronic device and methods of providing and using deformable electronic device
CN105185809B (zh) * 2015-08-03 2018-09-11 深圳市华星光电技术有限公司 柔性显示屏的制作方法、柔性玻璃基板及柔性显示屏
CN106793488B (zh) 2015-11-20 2019-04-30 财团法人工业技术研究院 软性电子装置与软性电子装置制作工艺方法
CN105374952A (zh) * 2015-12-15 2016-03-02 信利半导体有限公司 一种oled器件的制造方法及oled器件和应用
US20190011616A1 (en) * 2016-03-01 2019-01-10 Hewlett-Packard Development Company, L.P. Light absorption privacy film
CN105977277B (zh) * 2016-05-05 2018-08-07 上海天马微电子有限公司 一种柔性显示面板及其制造方法、以及柔性显示装置
CN108987338B (zh) * 2017-05-31 2021-12-03 南京瀚宇彩欣科技有限责任公司 软性电子装置的形成方法
CN107516666B (zh) * 2017-08-18 2020-01-10 武汉华星光电技术有限公司 一种柔性oled显示器件剥离方法及柔性oled显示器件
US10438895B1 (en) 2018-06-08 2019-10-08 American Semiconductor, Inc. Flexible micro-module
CN109216546A (zh) * 2018-09-13 2019-01-15 京东方科技集团股份有限公司 一种柔性衬底与载体基板的连接方法及柔性显示面板
CN109860431A (zh) * 2018-12-12 2019-06-07 武汉华星光电半导体显示技术有限公司 有机发光二极管(oled)面板及制作方法
CN110098225B (zh) * 2019-04-18 2021-06-01 武汉华星光电半导体显示技术有限公司 柔性显示面板及其制备方法

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TWI406608B (zh) * 2007-06-25 2013-08-21 Haeun Chemtec Co Ltd Ｆｐｃｂ之製造方法
US8834655B2 (en) 2009-04-17 2014-09-16 Industrial Technology Research Institute Method for isolating flexible substrate from support substrate
US8883053B2 (en) 2009-04-17 2014-11-11 Industrial Technology Research Institute Method for isolating flexible film from support substrate
CN102082150A (zh) * 2009-08-28 2011-06-01 三星移动显示器株式会社 柔性显示器及其制造方法
US9623633B2 (en) 2009-08-28 2017-04-18 Samsung Display Co., Ltd. Flexible display and method for manufacturing the same
TWI554988B (zh) * 2009-08-28 2016-10-21 三星顯示器有限公司 用於製造可撓性顯示器之方法
TWI413038B (zh) * 2009-10-02 2013-10-21 Innolux Corp 軟性顯示器元件之製作方法
TWI464633B (zh) * 2010-02-12 2014-12-11 Cando Corp Method of manufacturing flexible touch panel
US9142797B2 (en) 2010-05-31 2015-09-22 Industrial Technology Research Institute Gas barrier substrate and organic electro-luminescent device
US9096044B2 (en) 2010-06-24 2015-08-04 Au Optronics Corporation Flexible display panel and method of fabricating the same
CN102455453B (zh) * 2010-10-21 2014-04-23 元太科技工业股份有限公司 可挠性彩色滤光基板的制造方法
CN102455453A (zh) * 2010-10-21 2012-05-16 元太科技工业股份有限公司 可挠性彩色滤光基板的制造方法
WO2013135066A1 (zh) * 2012-03-14 2013-09-19 京东方科技集团股份有限公司 柔性显示装置的制备方法
US10173407B2 (en) 2015-11-20 2019-01-08 Industrial Technology Research Institute Device for removing and adhering substrate and method for using the device

Also Published As

Publication number Publication date
US7807551B2 (en) 2010-10-05
US20090269874A1 (en) 2009-10-29
US7566950B2 (en) 2009-07-28
TWI321241B (en) 2010-03-01
US20070059854A1 (en) 2007-03-15

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