TW200710992A - Method for forming an anti-etching shielding layer of resist patterns in semiconductor fabrication - Google Patents

Method for forming an anti-etching shielding layer of resist patterns in semiconductor fabrication

Info

Publication number
TW200710992A
TW200710992A TW095120946A TW95120946A TW200710992A TW 200710992 A TW200710992 A TW 200710992A TW 095120946 A TW095120946 A TW 095120946A TW 95120946 A TW95120946 A TW 95120946A TW 200710992 A TW200710992 A TW 200710992A
Authority
TW
Taiwan
Prior art keywords
shielding layer
photoresist pattern
forming
semiconductor fabrication
resist patterns
Prior art date
Application number
TW095120946A
Other languages
English (en)
Other versions
TWI305013B (en
Inventor
Chin-Hsiang Lin
Ching-Yu Chang
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Publication of TW200710992A publication Critical patent/TW200710992A/zh
Application granted granted Critical
Publication of TWI305013B publication Critical patent/TWI305013B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
TW095120946A 2005-06-14 2006-06-13 Method for forming an anti-etching shielding layer of resist patterns in semiconductor fabrication TWI305013B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/152,559 US7566525B2 (en) 2005-06-14 2005-06-14 Method for forming an anti-etching shielding layer of resist patterns in semiconductor fabrication
US11/401,690 US20060281320A1 (en) 2005-06-14 2006-04-11 Method for forming an anti-etching shielding layer of resist patterns in semiconductor fabrication

Publications (2)

Publication Number Publication Date
TW200710992A true TW200710992A (en) 2007-03-16
TWI305013B TWI305013B (en) 2009-01-01

Family

ID=37519321

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095120946A TWI305013B (en) 2005-06-14 2006-06-13 Method for forming an anti-etching shielding layer of resist patterns in semiconductor fabrication

Country Status (3)

Country Link
US (2) US7566525B2 (zh)
CN (1) CN1881078B (zh)
TW (1) TWI305013B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI834262B (zh) * 2021-08-25 2024-03-01 美商杰米納帝歐股份有限公司 多線蝕刻基體的生產技術

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US7972957B2 (en) * 2006-02-27 2011-07-05 Taiwan Semiconductor Manufacturing Company Method of making openings in a layer of a semiconductor device
US7491343B2 (en) * 2006-09-14 2009-02-17 Lam Research Corporation Line end shortening reduction during etch
US7407597B2 (en) * 2006-09-14 2008-08-05 Lam Research Corporation Line end shortening reduction during etch
US8357617B2 (en) * 2008-08-22 2013-01-22 Taiwan Semiconductor Manufacturing Company, Ltd. Method of patterning a metal gate of semiconductor device
US8158335B2 (en) * 2008-09-15 2012-04-17 Taiwan Semiconductor Manufacturing Company, Ltd. High etch resistant material for double patterning
US8822347B2 (en) * 2009-04-27 2014-09-02 Taiwan Semiconductor Manufacturing Company, Ltd. Wet soluble lithography
TWI404615B (zh) * 2010-04-01 2013-08-11 A method of manufacturing an in-mold formed film having a metal surface
US20140335679A1 (en) * 2013-05-09 2014-11-13 Applied Materials, Inc. Methods for etching a substrate
US9059092B2 (en) 2013-09-17 2015-06-16 Taiwan Semiconductor Manufacturing Company Limited Chemical dielectric formation for semiconductor device fabrication
KR102366801B1 (ko) 2015-03-31 2022-02-25 삼성전자주식회사 반도체 소자의 제조 방법
JP2017138514A (ja) 2016-02-04 2017-08-10 アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ 表面処理用組成物およびそれを用いたレジストパターンの表面処理方法
CN105655249A (zh) * 2016-03-21 2016-06-08 京东方科技集团股份有限公司 一种刻蚀方法
US11262495B1 (en) * 2017-10-04 2022-03-01 Facebook Technologies, Llc Waveguides with high refractive index gratings manufactured by post-patterning infusion
US10857724B1 (en) 2018-12-11 2020-12-08 Facebook Technologies, Llc Reducing adhesive failure during nanoimprint lithography demolding
US11294278B1 (en) 2018-12-11 2022-04-05 Facebook Technologies, Llc Reducing adhesive failure during nanoimprint lithography demolding
US11262650B1 (en) 2018-12-11 2022-03-01 Facebook Technologies, Llc Reducing adhesive failure during nanoimprint lithography demolding
CN113327842A (zh) * 2020-02-28 2021-08-31 长鑫存储技术有限公司 半导体结构及其制备方法

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US4751170A (en) * 1985-07-26 1988-06-14 Nippon Telegraph And Telephone Corporation Silylation method onto surface of polymer membrane and pattern formation process by the utilization of silylation method
JP2607870B2 (ja) * 1985-07-26 1997-05-07 富士写真フイルム株式会社 画像形成方法
US5194364A (en) * 1988-03-16 1993-03-16 Fujitsu Limited Process for formation of resist patterns
TW329539B (en) * 1996-07-05 1998-04-11 Mitsubishi Electric Corp The semiconductor device and its manufacturing method
JP3950584B2 (ja) * 1999-06-29 2007-08-01 Ａｚエレクトロニックマテリアルズ株式会社 水溶性樹脂組成物
US6274289B1 (en) * 2000-06-16 2001-08-14 Advanced Micro Devices, Inc. Chemical resist thickness reduction process
US6492075B1 (en) * 2000-06-16 2002-12-10 Advanced Micro Devices, Inc. Chemical trim process
TW483176B (en) * 2001-05-31 2002-04-11 United Microelectronics Corp Method for decreasing leakage current of photodiode
KR100475080B1 (ko) * 2002-07-09 2005-03-10 삼성전자주식회사 Ｓｉ-콘테이닝 수용성 폴리머를 이용한 레지스트 패턴형성방법 및 반도체 소자의 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI834262B (zh) * 2021-08-25 2024-03-01 美商杰米納帝歐股份有限公司 多線蝕刻基體的生產技術

Also Published As

Publication number Publication date
CN1881078A (zh) 2006-12-20
US20060281030A1 (en) 2006-12-14
US7566525B2 (en) 2009-07-28
US20060281320A1 (en) 2006-12-14
TWI305013B (en) 2009-01-01
CN1881078B (zh) 2011-09-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees