TW200709318A - Method and system for inspecting the image on a wafer - Google Patents
Method and system for inspecting the image on a waferInfo
- Publication number
- TW200709318A TW200709318A TW094129060A TW94129060A TW200709318A TW 200709318 A TW200709318 A TW 200709318A TW 094129060 A TW094129060 A TW 094129060A TW 94129060 A TW94129060 A TW 94129060A TW 200709318 A TW200709318 A TW 200709318A
- Authority
- TW
- Taiwan
- Prior art keywords
- image
- die
- chip
- inspecting
- wafer
- Prior art date
Links
Abstract
The present invention is directed to a method and system for inspecting the image (such as the ink mark) on a wafer. After the image of a die/chip is captured, the contrast of the captured content is enhanced. The number of the enhanced image pixels is counted, and is used to be compared to a predetermined value. Whenever the counted number is greater than the predetermined value, the die/chip under inspection is then decided as having an ink mark thereon. The present invention provides a definite, fast, and simple procedure to identify the ink mark on the die/chip, and accordingly increases the efficiency of integrated circuit packaging.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94129060A TWI315897B (en) | 2005-08-25 | 2005-08-25 | Method and system for inspecting the image on a wafer |
JP2005317074A JP2007059858A (en) | 2005-08-25 | 2005-10-31 | Chip image inspection method and its system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94129060A TWI315897B (en) | 2005-08-25 | 2005-08-25 | Method and system for inspecting the image on a wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200709318A true TW200709318A (en) | 2007-03-01 |
TWI315897B TWI315897B (en) | 2009-10-11 |
Family
ID=37923036
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94129060A TWI315897B (en) | 2005-08-25 | 2005-08-25 | Method and system for inspecting the image on a wafer |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2007059858A (en) |
TW (1) | TWI315897B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014132358A1 (en) * | 2013-02-27 | 2014-09-04 | 富士機械製造株式会社 | Defective member determination device and defective member determination method |
CN110085545B (en) * | 2019-03-26 | 2021-07-23 | 上海华力微电子有限公司 | Auxiliary alignment method and system |
CN116298811B (en) * | 2023-03-31 | 2024-04-02 | 上海威固信息技术股份有限公司 | Chip packaging detection system based on FPGA and packaging method thereof |
-
2005
- 2005-08-25 TW TW94129060A patent/TWI315897B/en not_active IP Right Cessation
- 2005-10-31 JP JP2005317074A patent/JP2007059858A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2007059858A (en) | 2007-03-08 |
TWI315897B (en) | 2009-10-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |