TW200709318A - Method and system for inspecting the image on a wafer - Google Patents

Method and system for inspecting the image on a wafer

Info

Publication number
TW200709318A
TW200709318A TW094129060A TW94129060A TW200709318A TW 200709318 A TW200709318 A TW 200709318A TW 094129060 A TW094129060 A TW 094129060A TW 94129060 A TW94129060 A TW 94129060A TW 200709318 A TW200709318 A TW 200709318A
Authority
TW
Taiwan
Prior art keywords
image
die
chip
inspecting
wafer
Prior art date
Application number
TW094129060A
Other languages
Chinese (zh)
Other versions
TWI315897B (en
Inventor
Kuang-Wen Cheng
Original Assignee
King Yuan Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by King Yuan Electronics Co Ltd filed Critical King Yuan Electronics Co Ltd
Priority to TW94129060A priority Critical patent/TWI315897B/en
Priority to JP2005317074A priority patent/JP2007059858A/en
Publication of TW200709318A publication Critical patent/TW200709318A/en
Application granted granted Critical
Publication of TWI315897B publication Critical patent/TWI315897B/en

Links

Abstract

The present invention is directed to a method and system for inspecting the image (such as the ink mark) on a wafer. After the image of a die/chip is captured, the contrast of the captured content is enhanced. The number of the enhanced image pixels is counted, and is used to be compared to a predetermined value. Whenever the counted number is greater than the predetermined value, the die/chip under inspection is then decided as having an ink mark thereon. The present invention provides a definite, fast, and simple procedure to identify the ink mark on the die/chip, and accordingly increases the efficiency of integrated circuit packaging.
TW94129060A 2005-08-25 2005-08-25 Method and system for inspecting the image on a wafer TWI315897B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW94129060A TWI315897B (en) 2005-08-25 2005-08-25 Method and system for inspecting the image on a wafer
JP2005317074A JP2007059858A (en) 2005-08-25 2005-10-31 Chip image inspection method and its system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94129060A TWI315897B (en) 2005-08-25 2005-08-25 Method and system for inspecting the image on a wafer

Publications (2)

Publication Number Publication Date
TW200709318A true TW200709318A (en) 2007-03-01
TWI315897B TWI315897B (en) 2009-10-11

Family

ID=37923036

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94129060A TWI315897B (en) 2005-08-25 2005-08-25 Method and system for inspecting the image on a wafer

Country Status (2)

Country Link
JP (1) JP2007059858A (en)
TW (1) TWI315897B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014132358A1 (en) * 2013-02-27 2014-09-04 富士機械製造株式会社 Defective member determination device and defective member determination method
CN110085545B (en) * 2019-03-26 2021-07-23 上海华力微电子有限公司 Auxiliary alignment method and system
CN116298811B (en) * 2023-03-31 2024-04-02 上海威固信息技术股份有限公司 Chip packaging detection system based on FPGA and packaging method thereof

Also Published As

Publication number Publication date
JP2007059858A (en) 2007-03-08
TWI315897B (en) 2009-10-11

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees