TW200708890A - Pattern-forming material, pattern-forming device and pattern-forming process - Google Patents

Pattern-forming material, pattern-forming device and pattern-forming process

Info

Publication number
TW200708890A
TW200708890A TW095119305A TW95119305A TW200708890A TW 200708890 A TW200708890 A TW 200708890A TW 095119305 A TW095119305 A TW 095119305A TW 95119305 A TW95119305 A TW 95119305A TW 200708890 A TW200708890 A TW 200708890A
Authority
TW
Taiwan
Prior art keywords
pattern
forming
forming material
exposure
blue
Prior art date
Application number
TW095119305A
Other languages
Chinese (zh)
Inventor
Kimi Ikeda
Hiroshi Kamikawa
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200708890A publication Critical patent/TW200708890A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection

Abstract

The object of the present invention is to provide a pattern-forming material which aims at forming a solder resist-like pattern and is to obtain a pattern having excellent surface configuration of resist and higher fineness being to be suitable in blue and green color; as well as to provide a pattern-forming device having said pattern-forming material and a pattern-forming method suing said pattern-forming material. Therefore, provided is a pattern-forming material which on a support has a photosensitive layer formed from a photosensitive composition comprising a binder, a filler, a polymerizable compound, a heat crosslinking agent , an optical polymerization initiator and a colorant; as well as the minimum energy being used in the said exposure and without changing the thickness of the portion to be exposed of said photosensitive layer before exposure and after development is 0.1 to 200 mJ/cm<SP>2</SP>, the haze value of said prospective layer at the wave length under said exposure is 0.140%, and the pattern formed through said exposure and development is blue to green color
TW095119305A 2005-06-03 2006-06-01 Pattern-forming material, pattern-forming device and pattern-forming process TW200708890A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005164864 2005-06-03

Publications (1)

Publication Number Publication Date
TW200708890A true TW200708890A (en) 2007-03-01

Family

ID=37481493

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095119305A TW200708890A (en) 2005-06-03 2006-06-01 Pattern-forming material, pattern-forming device and pattern-forming process

Country Status (2)

Country Link
TW (1) TW200708890A (en)
WO (1) WO2006129564A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4620700B2 (en) * 2006-03-17 2011-01-26 富士フイルム株式会社 Photosensitive composition, photosensitive film, method for forming permanent pattern, and printed circuit board
CN101627338A (en) * 2007-03-12 2010-01-13 富士胶片株式会社 Photosensitive composition, photosensitive film, method for formation of permanent pattern, and print substrate
JP2009122504A (en) * 2007-11-16 2009-06-04 Toyo Ink Mfg Co Ltd Halogen atom-free ultraviolet-curing green ink composition for printed wiring board, method for producing the same and substrate coated with the same
JP6278933B2 (en) * 2015-09-02 2018-02-14 株式会社タムラ製作所 Insulating film forming method, electronic substrate manufacturing method, and photosensitive resin composition
CN111393899A (en) * 2020-04-13 2020-07-10 深圳职业技术学院 Liquid photosensitive solder mask material for 5G high-frequency board and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0815861A (en) * 1994-04-27 1996-01-19 Mitsubishi Rayon Co Ltd Crosslink hardening resin composition, hardening method and hardened resin
JP2000144071A (en) * 1998-11-06 2000-05-26 Sekisui Chem Co Ltd Photopolymerizable composition, photocurable hardenable pressure sensitive adhesive sheet, and bonding of member
JP2000181058A (en) * 1998-12-18 2000-06-30 Hitachi Chem Co Ltd Photosensitive resin composition
JP2004020917A (en) * 2002-06-17 2004-01-22 Fuji Photo Film Co Ltd Colored photosensitive resin composition, transfer material using the same, color filter, photomask and image forming method
JP2005043580A (en) * 2003-07-25 2005-02-17 Mitsubishi Chemicals Corp Thermosetting photosensitive composition and image forming material using the same, imaging material and method for forming image
JP4501402B2 (en) * 2003-10-20 2010-07-14 三菱化学株式会社 Photocurable composition, photocurable image forming material using the same, photocurable image forming material, and image forming method

Also Published As

Publication number Publication date
WO2006129564A1 (en) 2006-12-07

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