TW200707814A - Light emitting device with a lens of silicone - Google Patents
Light emitting device with a lens of siliconeInfo
- Publication number
- TW200707814A TW200707814A TW095128081A TW95128081A TW200707814A TW 200707814 A TW200707814 A TW 200707814A TW 095128081 A TW095128081 A TW 095128081A TW 95128081 A TW95128081 A TW 95128081A TW 200707814 A TW200707814 A TW 200707814A
- Authority
- TW
- Taiwan
- Prior art keywords
- light emitting
- lens
- emitting device
- silicone
- heat sink
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050070271A KR100757196B1 (ko) | 2005-08-01 | 2005-08-01 | 실리콘 렌즈를 구비하는 발광소자 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200707814A true TW200707814A (en) | 2007-02-16 |
TWI323519B TWI323519B (en) | 2010-04-11 |
Family
ID=37708874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095128081A TWI323519B (en) | 2005-08-01 | 2006-08-01 | Light emitting device with a lens of silicone |
Country Status (4)
Country | Link |
---|---|
US (1) | US8283693B2 (zh) |
KR (1) | KR100757196B1 (zh) |
TW (1) | TWI323519B (zh) |
WO (1) | WO2007015606A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102054928A (zh) * | 2009-10-26 | 2011-05-11 | Lg伊诺特有限公司 | 发光器件封装和照明系统 |
CN102364710A (zh) * | 2011-11-04 | 2012-02-29 | 苏州晶雷光电照明科技有限公司 | Led白光光源装置 |
Families Citing this family (50)
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US8562184B2 (en) * | 2004-03-18 | 2013-10-22 | Brasscorp Limited | LED work light |
CA2501447C (en) | 2004-03-18 | 2014-05-13 | Brasscorp Limited | Led work light |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US8669572B2 (en) | 2005-06-10 | 2014-03-11 | Cree, Inc. | Power lamp package |
US7674018B2 (en) | 2006-02-27 | 2010-03-09 | Illumination Management Solutions Inc. | LED device for wide beam generation |
US8434912B2 (en) | 2006-02-27 | 2013-05-07 | Illumination Management Solutions, Inc. | LED device for wide beam generation |
US7675145B2 (en) | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
US8748915B2 (en) | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
US7635915B2 (en) | 2006-04-26 | 2009-12-22 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
US8735920B2 (en) | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
US8367945B2 (en) | 2006-08-16 | 2013-02-05 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
US8066402B2 (en) * | 2006-12-24 | 2011-11-29 | Brasscorp Limited | LED lamps including LED work lights |
US7687823B2 (en) * | 2006-12-26 | 2010-03-30 | Nichia Corporation | Light-emitting apparatus and method of producing the same |
US9711703B2 (en) * | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
KR100887598B1 (ko) * | 2007-03-07 | 2009-03-10 | 우리이티아이 주식회사 | 발광소자의 제조 방법 및 리드 프레임 구조 |
TW200915597A (en) * | 2007-09-17 | 2009-04-01 | Everlight Electronics Co Ltd | Light emitting diode device |
US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
JP5692952B2 (ja) * | 2007-12-11 | 2015-04-01 | シチズン電子株式会社 | 発光ダイオード |
USD633631S1 (en) | 2007-12-14 | 2011-03-01 | Cree Hong Kong Limited | Light source of light emitting diode |
USD634863S1 (en) | 2008-01-10 | 2011-03-22 | Cree Hong Kong Limited | Light source of light emitting diode |
KR101255280B1 (ko) * | 2008-02-22 | 2013-04-15 | 엘지디스플레이 주식회사 | 백라이트 유닛 |
EP2286468B1 (en) | 2008-05-05 | 2019-08-21 | Dialight Corporation | Surface mount circuit board indicator |
US8049230B2 (en) * | 2008-05-16 | 2011-11-01 | Cree Huizhou Opto Limited | Apparatus and system for miniature surface mount devices |
CN103459919B (zh) | 2008-08-14 | 2016-10-26 | 库帕技术公司 | 用于偏置宽光束生成的led设备 |
US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
US20100289055A1 (en) * | 2009-05-14 | 2010-11-18 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Silicone leaded chip carrier |
KR101018671B1 (ko) * | 2009-06-16 | 2011-03-04 | (주) 골드파로스 | 소프트 렌즈가 장착된 led 소자 |
US8415692B2 (en) | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
TWI396310B (zh) * | 2009-10-02 | 2013-05-11 | Everlight Electronics Co Ltd | 發光二極體結構 |
KR101233731B1 (ko) * | 2010-07-12 | 2013-02-18 | 김강 | Led 조명 장치 |
KR101647796B1 (ko) * | 2010-04-06 | 2016-08-12 | 엘지이노텍 주식회사 | 발광 소자 및 그 제조방법 |
KR20120024104A (ko) * | 2010-09-06 | 2012-03-14 | 서울옵토디바이스주식회사 | 발광 소자 |
ES2965529T3 (es) | 2011-02-28 | 2024-04-15 | Signify Holding Bv | Método y sistema para la gestión de luz desde un diodo emisor de luz |
US9140430B2 (en) | 2011-02-28 | 2015-09-22 | Cooper Technologies Company | Method and system for managing light from a light emitting diode |
CN102655198B (zh) * | 2011-03-03 | 2015-09-23 | 展晶科技(深圳)有限公司 | 发光二极管光源 |
US9041046B2 (en) | 2011-03-15 | 2015-05-26 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method and apparatus for a light source |
US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
KR101883344B1 (ko) * | 2011-12-27 | 2018-08-24 | 엘지이노텍 주식회사 | 발광소자 어레이 |
JP5938912B2 (ja) * | 2012-01-13 | 2016-06-22 | 日亜化学工業株式会社 | 発光装置及び照明装置 |
US9200765B1 (en) | 2012-11-20 | 2015-12-01 | Cooper Technologies Company | Method and system for redirecting light emitted from a light emitting diode |
US9335023B2 (en) * | 2013-12-11 | 2016-05-10 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Quantum dot lens and manufacturing method thereof |
JP6188602B2 (ja) * | 2014-02-26 | 2017-08-30 | 株式会社ファーストシステム | 照明モジュール |
JP2016015443A (ja) * | 2014-07-03 | 2016-01-28 | Kisco株式会社 | 発光モジュール、及び、照明器具 |
US10367126B2 (en) * | 2014-07-18 | 2019-07-30 | Xiamen Sanan Optoelectronics Technology Co., Ltd. | Light-emitting device |
US9653435B2 (en) * | 2015-07-14 | 2017-05-16 | SemiLEDs Optoelectronics Co., Ltd. | Light emitting diode (LED) package having short circuit (VLED) die, lens support dam and same side electrodes and method of fabrication |
EP3205584B1 (en) | 2016-02-12 | 2020-06-03 | Goodrich Lighting Systems GmbH | Exterior aircraft light and aircraft comprising the same |
US11600754B2 (en) * | 2018-11-29 | 2023-03-07 | Lumileds Llc | Light-emitting device and method of packaging the same |
WO2021085458A1 (ja) * | 2019-10-30 | 2021-05-06 | 京セラ株式会社 | 発光素子搭載用パッケージおよび発光装置 |
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US6580097B1 (en) * | 1998-02-06 | 2003-06-17 | General Electric Company | Light emitting device with phosphor composition |
JP4045781B2 (ja) * | 2001-08-28 | 2008-02-13 | 松下電工株式会社 | 発光装置 |
US6936855B1 (en) * | 2002-01-16 | 2005-08-30 | Shane Harrah | Bendable high flux LED array |
JP4211359B2 (ja) * | 2002-03-06 | 2009-01-21 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
US6679621B2 (en) * | 2002-06-24 | 2004-01-20 | Lumileds Lighting U.S., Llc | Side emitting LED and lens |
DE60330023D1 (de) * | 2002-08-30 | 2009-12-24 | Lumination Llc | Geschichtete led mit verbessertem wirkungsgrad |
US6682331B1 (en) | 2002-09-20 | 2004-01-27 | Agilent Technologies, Inc. | Molding apparatus for molding light emitting diode lamps |
US7633093B2 (en) * | 2003-05-05 | 2009-12-15 | Lighting Science Group Corporation | Method of making optical light engines with elevated LEDs and resulting product |
JP2004342870A (ja) * | 2003-05-16 | 2004-12-02 | Stanley Electric Co Ltd | 大電流駆動用発光ダイオード |
WO2004107461A1 (en) * | 2003-05-28 | 2004-12-09 | Seoul Semiconductor Co., Ltd. | Light emitting diode package and light emitting diode system having at least two heat sinks |
DE102004063978B4 (de) * | 2003-07-17 | 2019-01-24 | Toyoda Gosei Co., Ltd. | Lichtemittierende Vorrichtung |
KR100555174B1 (ko) * | 2003-09-29 | 2006-03-03 | 바이오닉스(주) | 고출력 엘이디패키지 제작방법 및 이를 이용한 고출력엘이디패키지 |
KR100586944B1 (ko) | 2003-12-26 | 2006-06-07 | 삼성전기주식회사 | 고출력 발광다이오드 패키지 및 제조방법 |
US20060086945A1 (en) * | 2004-10-27 | 2006-04-27 | Harvatek Corporation | Package structure for optical-electrical semiconductor |
US7352011B2 (en) * | 2004-11-15 | 2008-04-01 | Philips Lumileds Lighting Company, Llc | Wide emitting lens for LED useful for backlighting |
US7119422B2 (en) * | 2004-11-15 | 2006-10-10 | Unity Opto Technology Co., Ltd. | Solid-state semiconductor light emitting device |
US7416906B2 (en) * | 2005-05-18 | 2008-08-26 | Asahi Rubber Inc. | Soldering method for semiconductor optical device, and semiconductor optical device |
US20070029559A1 (en) * | 2005-08-04 | 2007-02-08 | Taiwan Oasis Technology Co., Ltd. | Light emitting chip carrier structure |
-
2005
- 2005-08-01 KR KR1020050070271A patent/KR100757196B1/ko active IP Right Grant
-
2006
- 2006-07-26 WO PCT/KR2006/002943 patent/WO2007015606A1/en active Application Filing
- 2006-07-26 US US11/997,459 patent/US8283693B2/en not_active Expired - Fee Related
- 2006-08-01 TW TW095128081A patent/TWI323519B/zh not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102054928A (zh) * | 2009-10-26 | 2011-05-11 | Lg伊诺特有限公司 | 发光器件封装和照明系统 |
US9035325B2 (en) | 2009-10-26 | 2015-05-19 | Lg Innotek Co., Ltd. | Light emitting device package and lighting system |
CN102364710A (zh) * | 2011-11-04 | 2012-02-29 | 苏州晶雷光电照明科技有限公司 | Led白光光源装置 |
Also Published As
Publication number | Publication date |
---|---|
KR100757196B1 (ko) | 2007-09-07 |
WO2007015606A1 (en) | 2007-02-08 |
TWI323519B (en) | 2010-04-11 |
US8283693B2 (en) | 2012-10-09 |
US20080191232A1 (en) | 2008-08-14 |
KR20070015738A (ko) | 2007-02-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |