TW200704319A - Method of mounting processing for flexible circuit board - Google Patents

Method of mounting processing for flexible circuit board

Info

Publication number
TW200704319A
TW200704319A TW095117514A TW95117514A TW200704319A TW 200704319 A TW200704319 A TW 200704319A TW 095117514 A TW095117514 A TW 095117514A TW 95117514 A TW95117514 A TW 95117514A TW 200704319 A TW200704319 A TW 200704319A
Authority
TW
Taiwan
Prior art keywords
circuit board
flexible circuit
pieces
sheet
guide holes
Prior art date
Application number
TW095117514A
Other languages
English (en)
Chinese (zh)
Other versions
TWI353203B (enrdf_load_stackoverflow
Inventor
Kazuo Inoue
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200704319A publication Critical patent/TW200704319A/zh
Application granted granted Critical
Publication of TWI353203B publication Critical patent/TWI353203B/zh

Links

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
TW095117514A 2005-05-27 2006-05-17 Method of mounting processing for flexible circuit board TW200704319A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005155785A JP4472582B2 (ja) 2005-05-27 2005-05-27 可撓性回路基板の実装処理方法

Publications (2)

Publication Number Publication Date
TW200704319A true TW200704319A (en) 2007-01-16
TWI353203B TWI353203B (enrdf_load_stackoverflow) 2011-11-21

Family

ID=37444402

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095117514A TW200704319A (en) 2005-05-27 2006-05-17 Method of mounting processing for flexible circuit board

Country Status (3)

Country Link
JP (1) JP4472582B2 (enrdf_load_stackoverflow)
CN (1) CN1870884B (enrdf_load_stackoverflow)
TW (1) TW200704319A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407848B (zh) * 2011-07-26 2013-09-01 Zhen Ding Technology Co Ltd 具感壓膠片的軟性電路板裝置及其製作方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104118644A (zh) * 2013-04-23 2014-10-29 凯吉凯精密电子技术开发（苏州）有限公司 电路板输送治具
CN103309505A (zh) * 2013-05-23 2013-09-18 无锡力合光电石墨烯应用研发中心有限公司 用于单片式ogs触摸屏与fpc的对位装置及对准方法
JP6873732B2 (ja) * 2017-02-15 2021-05-19 日本メクトロン株式会社 フレキシブルプリント基板の製造方法およびフレキシブルプリント基板の製造システム
CN109436416A (zh) * 2018-11-09 2019-03-08 深圳市新宇腾跃电子有限公司 一种fpc包装方法、fpc包装装置及fpc产品
CN110248481B (zh) * 2019-07-02 2025-02-25 珠海奇川精密设备有限公司 Fpc铝片贴装机
CN110817406B (zh) * 2019-11-06 2021-02-02 昆山中新捷信自动化设备科技有限公司 一种自动转料机构的作业方法
KR102795587B1 (ko) * 2020-10-05 2025-04-15 가부시키가이샤 크리에이티브 코팅즈 위치 결정 지그 어셈블리 및 위치 결정 지그 그리고 전자부품 본체의 위치 결정 방법 및 반송 지그로의 장착 방법
CN113582125B (zh) * 2021-07-21 2023-06-06 深圳清华大学研究院 一种超滑封装器件及其封装方法
CN114845477B (zh) * 2022-04-08 2024-10-25 瑞华高科技电子工业园(厦门)有限公司 一种超长挠性电路板的制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997044823A1 (de) * 1996-05-17 1997-11-27 Siemens Aktiengesellschaft Trägerelement für einen halbleiterchip
US6012713A (en) * 1998-12-23 2000-01-11 Gleason Service Company, L.C. Reflow pallet with lever arm
US20040154529A1 (en) * 2003-02-07 2004-08-12 Tatsuki Nogiwa Substrate holder, method for producing substrate holder, and method for producing mold

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407848B (zh) * 2011-07-26 2013-09-01 Zhen Ding Technology Co Ltd 具感壓膠片的軟性電路板裝置及其製作方法

Also Published As

Publication number Publication date
CN1870884B (zh) 2010-12-08
TWI353203B (enrdf_load_stackoverflow) 2011-11-21
CN1870884A (zh) 2006-11-29
JP2006332441A (ja) 2006-12-07
JP4472582B2 (ja) 2010-06-02

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees