TW200703537A - Substrate processing apparatus and substrate housing method - Google Patents
Substrate processing apparatus and substrate housing methodInfo
- Publication number
- TW200703537A TW200703537A TW095109170A TW95109170A TW200703537A TW 200703537 A TW200703537 A TW 200703537A TW 095109170 A TW095109170 A TW 095109170A TW 95109170 A TW95109170 A TW 95109170A TW 200703537 A TW200703537 A TW 200703537A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- processing apparatus
- substrate processing
- housing method
- transport means
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005081607A JP2006269497A (ja) | 2005-03-22 | 2005-03-22 | 基板処理装置及び基板収納方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200703537A true TW200703537A (en) | 2007-01-16 |
TWI417977B TWI417977B (zh) | 2013-12-01 |
Family
ID=37015718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095109170A TWI417977B (zh) | 2005-03-22 | 2006-03-17 | 基材處理裝置與基材收納方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7747343B2 (zh) |
JP (1) | JP2006269497A (zh) |
CN (1) | CN100533704C (zh) |
TW (1) | TWI417977B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8600150B2 (en) * | 2006-02-13 | 2013-12-03 | Samsung Electronics Co., Ltd. | Wafer aligning apparatus and related method |
JP4914761B2 (ja) * | 2007-05-16 | 2012-04-11 | オリンパス株式会社 | 外観検査装置 |
JP5303254B2 (ja) * | 2008-12-15 | 2013-10-02 | 東京エレクトロン株式会社 | 異物除去方法及び記憶媒体 |
KR102238649B1 (ko) * | 2014-09-16 | 2021-04-09 | 삼성전자주식회사 | 반도체 칩 본딩 장치 |
JP6985815B2 (ja) * | 2017-05-09 | 2021-12-22 | キヤノン株式会社 | 搬送装置、システム、および物品の製造方法 |
KR102624577B1 (ko) * | 2020-10-28 | 2024-01-15 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
TW202238803A (zh) * | 2021-02-26 | 2022-10-01 | 日商東京威力科創股份有限公司 | 搬運系統、搬運裝置及搬運方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07263518A (ja) | 1994-03-18 | 1995-10-13 | Fujitsu Ltd | 半導体ウェハの搬送装置及び搬送方法並びに半導体ウェハ処理装置 |
JPH09102257A (ja) | 1995-07-28 | 1997-04-15 | Matsushita Electric Works Ltd | 封止接点装置 |
US5822213A (en) * | 1996-03-29 | 1998-10-13 | Lam Research Corporation | Method and apparatus for determining the center and orientation of a wafer-like object |
US5980194A (en) * | 1996-07-15 | 1999-11-09 | Applied Materials, Inc. | Wafer position error detection and correction system |
TW350115B (en) * | 1996-12-02 | 1999-01-11 | Toyota Automatic Loom Co Ltd | Misregistration detection device and method thereof |
WO2001084606A1 (fr) * | 2000-04-27 | 2001-11-08 | Shin-Etsu Handotai Co., Ltd. | Plaquette de semi-conducteur et dispositif pour procede de fabrication d'un dispositif a semi-conducteurs |
US6327517B1 (en) * | 2000-07-27 | 2001-12-04 | Applied Materials, Inc. | Apparatus for on-the-fly center finding and notch aligning for wafer handling robots |
TW559855B (en) | 2000-09-06 | 2003-11-01 | Olympus Optical Co | Wafer transfer apparatus |
US6678055B2 (en) * | 2001-11-26 | 2004-01-13 | Tevet Process Control Technologies Ltd. | Method and apparatus for measuring stress in semiconductor wafers |
US6900877B2 (en) * | 2002-06-12 | 2005-05-31 | Asm American, Inc. | Semiconductor wafer position shift measurement and correction |
US20050151947A1 (en) * | 2002-07-31 | 2005-07-14 | Nikon Corporation | Position measuring method, position control method, exposure method and exposure apparatus, and device manufacturing method |
KR100935291B1 (ko) * | 2002-11-28 | 2010-01-06 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템 및 도포 현상 장치 |
JP3880589B2 (ja) * | 2004-03-31 | 2007-02-14 | キヤノン株式会社 | 位置計測装置、露光装置及びデバイス製造方法 |
-
2005
- 2005-03-22 JP JP2005081607A patent/JP2006269497A/ja not_active Withdrawn
-
2006
- 2006-03-16 US US11/377,509 patent/US7747343B2/en not_active Expired - Fee Related
- 2006-03-17 CN CNB2006100570585A patent/CN100533704C/zh not_active Expired - Fee Related
- 2006-03-17 TW TW095109170A patent/TWI417977B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20060215152A1 (en) | 2006-09-28 |
CN1838398A (zh) | 2006-09-27 |
TWI417977B (zh) | 2013-12-01 |
JP2006269497A (ja) | 2006-10-05 |
US7747343B2 (en) | 2010-06-29 |
CN100533704C (zh) | 2009-08-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |