TW200702940A - Exposure apparatus - Google Patents

Exposure apparatus

Info

Publication number
TW200702940A
TW200702940A TW095115059A TW95115059A TW200702940A TW 200702940 A TW200702940 A TW 200702940A TW 095115059 A TW095115059 A TW 095115059A TW 95115059 A TW95115059 A TW 95115059A TW 200702940 A TW200702940 A TW 200702940A
Authority
TW
Taiwan
Prior art keywords
scanning direction
air
cooling air
chamber
along
Prior art date
Application number
TW095115059A
Other languages
Chinese (zh)
Inventor
Akihiro Hashiguchi
Hiroyuki Kohda
Takashi Fukui
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005133409A external-priority patent/JP2006308996A/en
Priority claimed from JP2005150976A external-priority patent/JP2006330167A/en
Priority claimed from JP2005150974A external-priority patent/JP2006330165A/en
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200702940A publication Critical patent/TW200702940A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Light Sources And Details Of Projection-Printing Devices (AREA)

Abstract

An accommodation chamber 13 (an exposure chamber 15) of a cover body 12 at which an apparatus main body 20 of an exposure apparatus 10 is accommodated is air conditioned by cooling air from an air conditioner. A photosensitive material 40 is placed on a stage 28 in the accommodation chamber 13 and is conveyed in a scanning direction. Cooling air, which is blown out into the exposure chamber 15 from an outflow port 82B of a duct 82, is blown along the scanning direction by an airflow direction-altering plate 90. A temperature distribution of the accommodation chamber 13 along the scanning direction is made uniform by this cooling air. Air conditioning which inhibits temperature divergences and temperature changes which occur along the scanning direction is realized.
TW095115059A 2005-04-28 2006-04-27 Exposure apparatus TW200702940A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005133409A JP2006308996A (en) 2005-04-28 2005-04-28 Exposure device
JP2005150976A JP2006330167A (en) 2005-05-24 2005-05-24 Exposure apparatus
JP2005150974A JP2006330165A (en) 2005-05-24 2005-05-24 Exposure apparatus

Publications (1)

Publication Number Publication Date
TW200702940A true TW200702940A (en) 2007-01-16

Family

ID=37308119

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115059A TW200702940A (en) 2005-04-28 2006-04-27 Exposure apparatus

Country Status (3)

Country Link
KR (1) KR20080005382A (en)
TW (1) TW200702940A (en)
WO (1) WO2006118343A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113204175A (en) * 2021-04-25 2021-08-03 华虹半导体(无锡)有限公司 Exposure method of immersion lithography machine
TWI823472B (en) * 2021-08-26 2023-11-21 日商斯庫林集團股份有限公司 Drawing apparatus

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4950101B2 (en) 2008-03-05 2012-06-13 富士フイルム株式会社 Method for processing a workpiece having a photoresist layer
US9372407B2 (en) * 2013-04-18 2016-06-21 E I Du Pont De Nemours And Company Exposure apparatus and a method for exposing a photosensitive element and a method for preparing a printing form from the photosensitive element
JP7045890B2 (en) * 2018-03-20 2022-04-01 株式会社Ｓｃｒｅｅｎホールディングス Pattern drawing device and pattern drawing method
CN112612180B (en) * 2020-12-07 2022-10-25 华虹半导体(无锡)有限公司 Photoetching exposure method
CN112925175A (en) * 2021-01-29 2021-06-08 深圳市大族数控科技股份有限公司 Exposure machine

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0580526A (en) * 1991-09-25 1993-04-02 Dainippon Screen Mfg Co Ltd Movable placing device for photosensing plate
JP3372782B2 (en) * 1996-10-04 2003-02-04 キヤノン株式会社 Scanning stage apparatus and scanning type exposure apparatus
JP2001092145A (en) * 1999-09-17 2001-04-06 Fuji Photo Film Co Ltd Dust removing device for printing plate
JP2002202570A (en) * 2000-12-28 2002-07-19 Fuji Photo Film Co Ltd Image exposure-recording equipment and method
JP2004085664A (en) * 2002-08-23 2004-03-18 Pentax Corp Drawing system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113204175A (en) * 2021-04-25 2021-08-03 华虹半导体(无锡)有限公司 Exposure method of immersion lithography machine
CN113204175B (en) * 2021-04-25 2022-10-28 华虹半导体(无锡)有限公司 Exposure method of immersion lithography machine
TWI823472B (en) * 2021-08-26 2023-11-21 日商斯庫林集團股份有限公司 Drawing apparatus

Also Published As

Publication number Publication date
KR20080005382A (en) 2008-01-11
WO2006118343A1 (en) 2006-11-09

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