TW200702931A - Pattern-forming material, pattern-forming device and pattern-forming method - Google Patents

Pattern-forming material, pattern-forming device and pattern-forming method

Info

Publication number
TW200702931A
TW200702931A TW095112640A TW95112640A TW200702931A TW 200702931 A TW200702931 A TW 200702931A TW 095112640 A TW095112640 A TW 095112640A TW 95112640 A TW95112640 A TW 95112640A TW 200702931 A TW200702931 A TW 200702931A
Authority
TW
Taiwan
Prior art keywords
pattern
forming
thickness
forming material
photosensitive layer
Prior art date
Application number
TW095112640A
Other languages
Chinese (zh)
Other versions
TWI421639B (en
Inventor
Morimasa Sato
Kazumori Minami
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200702931A publication Critical patent/TW200702931A/en
Application granted granted Critical
Publication of TWI421639B publication Critical patent/TWI421639B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

Abstract

The present invention provides a pattern-forming material having at least a photosensitive layer formed on a support, wherein the photosensitive layer comprises a photosensitive composition consisting of an alkali-soluble binder, a polymerizable monomer and an optical polymerization initiator; the photosensitive composition has molten viscosity of 1 x 10<SP>4</SP> to 1 x 10<SP>7</SP> mPa x s at 30 DEG C to 40 DEG C; and the minimum energy being used in the exposure that the thickness of a pattern obtained by exposing and developing is turned to 90% of the thickness at the sate without being exposed, is 20 mJ/cm<SP>2</SP> at 405 nm of laser light.
TW95112640A 2005-04-11 2006-04-10 Pattern forming material, pattern forming device, and pattern forming method TWI421639B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005114022A JP2006293039A (en) 2005-04-11 2005-04-11 Pattern forming material, pattern forming apparatus and pattern forming method

Publications (2)

Publication Number Publication Date
TW200702931A true TW200702931A (en) 2007-01-16
TWI421639B TWI421639B (en) 2014-01-01

Family

ID=37086994

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95112640A TWI421639B (en) 2005-04-11 2006-04-10 Pattern forming material, pattern forming device, and pattern forming method

Country Status (3)

Country Link
JP (1) JP2006293039A (en)
TW (1) TWI421639B (en)
WO (1) WO2006109721A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101670245B1 (en) * 2014-03-21 2016-10-28 동우 화인켐 주식회사 Photosensitive resin comopsition
JP7216365B2 (en) * 2018-10-01 2023-02-01 旭化成株式会社 Photosensitive resin laminate for microchannel

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3195428B2 (en) * 1992-07-15 2001-08-06 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, and method for producing plating resist
JP2004062156A (en) * 2002-06-07 2004-02-26 Fuji Photo Film Co Ltd Exposure head and exposure apparatus
JP4082186B2 (en) * 2002-11-19 2008-04-30 三菱化学株式会社 Blue-violet laser photosensitive composition, and image forming material, image forming material, and image forming method using the same
JP2004240216A (en) * 2003-02-06 2004-08-26 Fuji Photo Film Co Ltd Method for manufacturing printed circuit board
JP2004287090A (en) * 2003-03-20 2004-10-14 Hitachi Chem Co Ltd Photosensitive resin composition layer, photosensitive element, and method for manufacturing resist pattern and method for manufacturing printed wiring board using the same
US7187399B2 (en) * 2003-07-31 2007-03-06 Fuji Photo Film Co., Ltd. Exposure head with spatial light modulator
JP4450689B2 (en) * 2003-07-31 2010-04-14 富士フイルム株式会社 Exposure head
JP4337485B2 (en) * 2003-09-16 2009-09-30 三菱化学株式会社 Blue-violet laser photosensitive composition, and image forming material, image forming material, and image forming method using the same
JP4096857B2 (en) * 2003-09-30 2008-06-04 三菱化学株式会社 Blue-violet laser-sensitive image forming material, blue-violet laser-sensitive image forming material, and image forming method

Also Published As

Publication number Publication date
WO2006109721A1 (en) 2006-10-19
JP2006293039A (en) 2006-10-26
TWI421639B (en) 2014-01-01

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