TW200643629A - Positive photosensitive resin composition - Google Patents

Positive photosensitive resin composition

Info

Publication number
TW200643629A
TW200643629A TW095107688A TW95107688A TW200643629A TW 200643629 A TW200643629 A TW 200643629A TW 095107688 A TW095107688 A TW 095107688A TW 95107688 A TW95107688 A TW 95107688A TW 200643629 A TW200643629 A TW 200643629A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
positive photosensitive
monovalent organic
group
Prior art date
Application number
TW095107688A
Other languages
English (en)
Inventor
Hirofumi Fujii
Makoto Saito
Kenji Ohnishi
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200643629A publication Critical patent/TW200643629A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW095107688A 2005-03-07 2006-03-07 Positive photosensitive resin composition TW200643629A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005062889 2005-03-07
JP2005306078A JP4564439B2 (ja) 2005-03-07 2005-10-20 ポジ型感光性樹脂組成物

Publications (1)

Publication Number Publication Date
TW200643629A true TW200643629A (en) 2006-12-16

Family

ID=36602758

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107688A TW200643629A (en) 2005-03-07 2006-03-07 Positive photosensitive resin composition

Country Status (6)

Country Link
US (1) US7371506B2 (zh)
EP (1) EP1701210A1 (zh)
JP (1) JP4564439B2 (zh)
KR (1) KR20060097573A (zh)
CN (1) CN1831648B (zh)
TW (1) TW200643629A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101023089B1 (ko) 2008-09-29 2011-03-24 제일모직주식회사 포지티브형 감광성 수지 조성물
JP5199950B2 (ja) * 2009-05-27 2013-05-15 日東電工株式会社 ネガ型感光性材料およびそれを用いた感光性基材、ならびにネガ型パターン形成方法
JP5208085B2 (ja) * 2009-10-14 2013-06-12 日東電工株式会社 感光性樹脂組成物およびそれを用いた金属支持体付回路基板の製法、ならびに金属支持体付回路基板
KR101333704B1 (ko) * 2009-12-29 2013-11-27 제일모직주식회사 포지티브형 감광성 수지 조성물
JP2012063645A (ja) 2010-09-17 2012-03-29 Nitto Denko Corp 感光性樹脂組成物およびそれを用いた金属支持体付回路基板
KR101400192B1 (ko) 2010-12-31 2014-05-27 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5122436A (en) * 1990-04-26 1992-06-16 Eastman Kodak Company Curable composition
DE69131529T2 (de) 1990-05-29 2000-01-20 Sumitomo Bakelite Co. Ltd., Tokio/Tokyo Positiv arbeitende lichtempfindliche Harzzusammensetzung
EP0502400B1 (en) 1991-03-05 1997-09-17 Nitto Denko Corporation Heat-resistant positive photoresist composition, photosensitive substrate, and process for preparing heat-resistant positive pattern
JP2931143B2 (ja) 1991-04-15 1999-08-09 日東電工株式会社 耐熱性ポジ型フォトレジスト組成物およびそれを用いた感光性基材ならびにパターン形成方法
JP2981024B2 (ja) * 1991-07-05 1999-11-22 住友ベークライト株式会社 ポジ型感光性樹脂組成物
JP2889746B2 (ja) * 1991-10-22 1999-05-10 日東電工株式会社 耐熱性ポジ型フォトレジスト組成物およびそれを用いた感光性基材ならびにパターン形成方法
JPH05281717A (ja) 1992-04-01 1993-10-29 Nitto Denko Corp 感光性物質、およびそれを含有する耐熱性ポジ型フォトレジスト組成物と感光性基材、ならびにパターン形成方法
CN1106788C (zh) * 1996-02-13 2003-04-23 日东电工株式会社 电路基片
SG55276A1 (en) * 1996-02-13 1998-12-21 Nitto Denko Corp Circuit substrate circuit-formed suspension substrate and production method thereof
US6300037B1 (en) 1998-11-30 2001-10-09 Nitto Denko Corporation Photosensitive resin composition and adhesive
JP2000290501A (ja) * 1999-04-05 2000-10-17 Nitto Denko Corp 感光性ポリイミド樹脂前駆体及び接着剤
JP4146037B2 (ja) * 1999-07-07 2008-09-03 日東電工株式会社 感光性樹脂組成物及び回路基板
JP4438227B2 (ja) * 2001-01-09 2010-03-24 日立電線株式会社 感光性ポリイミド樹脂組成物およびその製造方法
WO2003029899A1 (fr) * 2001-09-26 2003-04-10 Nissan Chemical Industries, Ltd. Composition de resine polyimide photosensible positive
KR100529577B1 (ko) * 2001-11-22 2005-11-17 미쓰이 가가쿠 가부시키가이샤 감광성 수지조성물, 드라이필름 및 그것을 이용한 가공부품
US7037637B2 (en) * 2002-07-17 2006-05-02 Nitto Denko Corporation Photosensitive polyimide resin precursor composition, optical polyimide obtained from the composition, optical waveguide using the polyimide, and process for producing the optical waveguide
JP4227461B2 (ja) * 2003-05-29 2009-02-18 日東電工株式会社 感光性ポリアミド酸組成物とそれより得られるパターン化したポリイミド樹脂フィルムとそれらの回路基板への利用

Also Published As

Publication number Publication date
CN1831648A (zh) 2006-09-13
JP2006285193A (ja) 2006-10-19
US7371506B2 (en) 2008-05-13
US20060199102A1 (en) 2006-09-07
CN1831648B (zh) 2011-06-15
EP1701210A1 (en) 2006-09-13
JP4564439B2 (ja) 2010-10-20
KR20060097573A (ko) 2006-09-14

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