TW200641964A - Cleaning composition solution and method of cleaning wafers using the same - Google Patents
Cleaning composition solution and method of cleaning wafers using the sameInfo
- Publication number
- TW200641964A TW200641964A TW094116324A TW94116324A TW200641964A TW 200641964 A TW200641964 A TW 200641964A TW 094116324 A TW094116324 A TW 094116324A TW 94116324 A TW94116324 A TW 94116324A TW 200641964 A TW200641964 A TW 200641964A
- Authority
- TW
- Taiwan
- Prior art keywords
- cleaning
- wafer
- composition solution
- layer
- polishing
- Prior art date
Links
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A method for the cleaning of wafers typically during a chemical mechanical polishing (CMP) process. The method includes polishing a material layer on a wafer in sequential polishing steps, rinsing the wafer using a novel surfactant composition solution after at least one of the polishing steps and rinsing of the wafer using deionized water, respectively. The surfactant composition solution imparts a generally hydrophilic character to a hydrophobic material layer such as a low-k dielectric layer on the wafer. Consequently, the layer is rendered amenable to cleaning by deionized water, thereby significantly enhancing the removal of particles from the layer and reducing the number of defects related to the CMP process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94116324A TWI319203B (en) | 2005-05-19 | 2005-05-19 | Cleaning composition solution and method of cleaning wafers using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94116324A TWI319203B (en) | 2005-05-19 | 2005-05-19 | Cleaning composition solution and method of cleaning wafers using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200641964A true TW200641964A (en) | 2006-12-01 |
TWI319203B TWI319203B (en) | 2010-01-01 |
Family
ID=45073604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94116324A TWI319203B (en) | 2005-05-19 | 2005-05-19 | Cleaning composition solution and method of cleaning wafers using the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI319203B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9592585B2 (en) | 2012-12-28 | 2017-03-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for CMP station cleanliness |
CN113161223A (en) * | 2020-01-07 | 2021-07-23 | 夏泰鑫半导体(青岛)有限公司 | Method and system for processing wafer with polycrystalline silicon layer |
-
2005
- 2005-05-19 TW TW94116324A patent/TWI319203B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9592585B2 (en) | 2012-12-28 | 2017-03-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for CMP station cleanliness |
CN113161223A (en) * | 2020-01-07 | 2021-07-23 | 夏泰鑫半导体(青岛)有限公司 | Method and system for processing wafer with polycrystalline silicon layer |
Also Published As
Publication number | Publication date |
---|---|
TWI319203B (en) | 2010-01-01 |
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