TW200639417A - PC board inspecting apparatus, inspection logic setting method, and inspection logic setting apparatus - Google Patents

PC board inspecting apparatus, inspection logic setting method, and inspection logic setting apparatus

Info

Publication number
TW200639417A
TW200639417A TW095100679A TW95100679A TW200639417A TW 200639417 A TW200639417 A TW 200639417A TW 095100679 A TW095100679 A TW 095100679A TW 95100679 A TW95100679 A TW 95100679A TW 200639417 A TW200639417 A TW 200639417A
Authority
TW
Taiwan
Prior art keywords
inspection logic
logic setting
inspection
images
board inspecting
Prior art date
Application number
TW095100679A
Other languages
English (en)
Other versions
TWI291561B (en
Inventor
Toshihiro Moriya
Hirotaka Wada
Takako Onishi
Atsushi Shimizu
Akira Nakajima
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Publication of TW200639417A publication Critical patent/TW200639417A/zh
Application granted granted Critical
Publication of TWI291561B publication Critical patent/TWI291561B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards
    • G01R31/71—Testing of solder joints

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Tests Of Electronic Circuits (AREA)
TW095100679A 2005-01-11 2006-01-06 PC board inspecting apparatus, inspection logic setting method, and inspection logic setting apparatus TWI291561B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005003724 2005-01-11
JP2005352001A JP4736764B2 (ja) 2005-01-11 2005-12-06 基板検査装置並びにその検査ロジック設定方法および検査ロジック設定装置

Publications (2)

Publication Number Publication Date
TW200639417A true TW200639417A (en) 2006-11-16
TWI291561B TWI291561B (en) 2007-12-21

Family

ID=36168468

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095100679A TWI291561B (en) 2005-01-11 2006-01-06 PC board inspecting apparatus, inspection logic setting method, and inspection logic setting apparatus

Country Status (4)

Country Link
US (1) US20060153439A1 (zh)
EP (1) EP1679520A1 (zh)
JP (1) JP4736764B2 (zh)
TW (1) TWI291561B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4830767B2 (ja) * 2006-10-02 2011-12-07 オムロン株式会社 部品実装基板の品質表示データの作成方法およびプログラム
JP4814116B2 (ja) * 2007-01-29 2011-11-16 三菱重工業株式会社 実装基板外観検査方法
JP4840327B2 (ja) * 2007-10-22 2011-12-21 株式会社デンソー 外観検査方法
DE102010064640B3 (de) 2009-05-13 2018-05-09 Koh Young Technology Inc. Verfahren zur Messung eines Messungsziels
DE102010028894B4 (de) * 2009-05-13 2018-05-24 Koh Young Technology Inc. Verfahren zur Messung eines Messobjekts
KR101205970B1 (ko) * 2010-11-18 2012-11-28 주식회사 고영테크놀러지 브리지 연결불량 검출방법
KR101642897B1 (ko) * 2011-07-13 2016-07-26 주식회사 고영테크놀러지 검사방법
JP6034109B2 (ja) * 2012-09-25 2016-11-30 株式会社総合車両製作所 窓材の外観検査装置及び窓材の外観検査方法
JP6461692B2 (ja) * 2015-04-10 2019-01-30 株式会社レクザム 基板検査装置
JP6521735B2 (ja) * 2015-05-20 2019-05-29 Juki株式会社 検査装置、検査方法及び検査装置で用いられるプログラム
CA2977847A1 (en) * 2017-01-27 2018-07-27 Hootsuite Media Inc. Automated extraction tools and their use in social content tagging systems
JP2019027922A (ja) * 2017-07-31 2019-02-21 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
KR20190084167A (ko) * 2017-12-21 2019-07-16 주식회사 고영테크놀러지 인쇄 회로 기판 검사 장치, 스크린 프린터의 결함 유형 결정 방법 및 컴퓨터 판독 가능한 기록 매체
JP7214432B2 (ja) * 2018-10-22 2023-01-30 キヤノン株式会社 画像処理方法、画像処理プログラム、記録媒体、画像処理装置、生産システム、物品の製造方法
CN113240618A (zh) * 2020-01-23 2021-08-10 株式会社理光 工件检测方法、装置及计算机可读存储介质
US11599988B2 (en) * 2020-09-11 2023-03-07 Super Micro Computer, Inc. Inspection of circuit boards for unauthorized modifications
JP2022123234A (ja) * 2021-02-12 2022-08-24 オムロン株式会社 画像検査装置、画像検査方法及び学習済みモデル生成装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG66545A1 (en) * 1988-05-09 1999-07-20 Omron Tateisi Electronics Co Apparatus for inspecting printed circuit boards and the like and method of operating the same
JP3250309B2 (ja) * 1993-03-02 2002-01-28 オムロン株式会社 実装部品検査用データの教示方法
JPH06273346A (ja) * 1993-03-24 1994-09-30 Hitachi Denshi Ltd はんだ付け状態検査装置
US5544256A (en) * 1993-10-22 1996-08-06 International Business Machines Corporation Automated defect classification system
US5548697A (en) * 1994-12-30 1996-08-20 Panasonic Technologies, Inc. Non-linear color corrector having a neural network and using fuzzy membership values to correct color and a method thereof
JPH08247960A (ja) * 1995-03-14 1996-09-27 Adtec Eng:Kk 外観検査装置
KR0176661B1 (ko) * 1995-12-28 1999-05-15 김광호 납땜부 검사방법 및 검사장치
KR100200215B1 (ko) * 1996-04-08 1999-06-15 윤종용 상관 신경 회로망을 이용한 납땜 검사 장치 및방법
US6236747B1 (en) * 1997-02-26 2001-05-22 Acuity Imaging, Llc System and method for image subtraction for ball and bumped grid array inspection
ATE246803T1 (de) * 1997-05-05 2003-08-15 Macrotron Process Technologies Verfahren und schaltungsanordnung zur prüfung von lötstellen
JP3120767B2 (ja) * 1998-01-16 2000-12-25 日本電気株式会社 外観検査装置、外観検査方法及び外観検査プログラムを記録した記録媒体
US6088109A (en) * 1998-09-24 2000-07-11 Advanced Semiconductor Engineering, Inc. System for detecting the presence of deposited metals on soldering points of an integrated circuit board substrate
US7062080B2 (en) * 2001-11-26 2006-06-13 Omron Corporation Method of inspecting curved surface and device for inspecting printed circuit board
JP3551188B2 (ja) * 2002-01-10 2004-08-04 オムロン株式会社 表面状態検査方法および基板検査装置
JP4190243B2 (ja) * 2002-09-30 2008-12-03 日本特殊陶業株式会社 電子回路用部品の外観検査方法及び外観検査装置並びに電子回路用部品の製造方法。
US7019826B2 (en) * 2003-03-20 2006-03-28 Agilent Technologies, Inc. Optical inspection system, apparatus and method for reconstructing three-dimensional images for printed circuit board and electronics manufacturing inspection

Also Published As

Publication number Publication date
EP1679520A1 (en) 2006-07-12
TWI291561B (en) 2007-12-21
JP2006220648A (ja) 2006-08-24
JP4736764B2 (ja) 2011-07-27
US20060153439A1 (en) 2006-07-13

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