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Structures For Mounting Electric Components On Printed Circuit Boards
(AREA)
Abstract
A flip chip BGA package is disclosed. A flip chip is disposed on an upper surface of a substrate. The flip chip includes a plurality of central bumps forming on its active surface. The substrate includes a plurality of connecting pads on the upper surface, and a wetting layer formed on the connecting pads. A non-conductive paste (NCP) is formed on the upper surface of the substrate to fix the active surface of the flip chip. A plurality of solder balls are disposed on a lower surface of the substrate. The central bumps of the flip chip pass through the non-conductive paste and are bonded to the wetting layer on the connecting pads. The lower surface of the substrate has wider area to dispose more solder balls and the flip chip BGA package have shorter electric transmission path for high frequency memory package.
Stack type flip-chip package including a substrate board, a first chip, a second chip, multiple conductive wire, an underfill, and a packaging material
Semiconductor constructions having interconnect structures, methods of forming interconnect structures, and methods of forming semiconductor constructions