TW200635082A - Process for manufacturing a light emitting array - Google Patents

Process for manufacturing a light emitting array

Info

Publication number
TW200635082A
TW200635082A TW094137984A TW94137984A TW200635082A TW 200635082 A TW200635082 A TW 200635082A TW 094137984 A TW094137984 A TW 094137984A TW 94137984 A TW94137984 A TW 94137984A TW 200635082 A TW200635082 A TW 200635082A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting array
manufacturing
abrade
precisely shaped
Prior art date
Application number
TW094137984A
Other languages
English (en)
Inventor
Andrew John Ouderkirk
Catherine Anne Leatherdale
Olester Benson Jr
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200635082A publication Critical patent/TW200635082A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B24B13/02—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor by means of tools with abrading surfaces corresponding in shape with the lenses to be made
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D2203/00—Tool surfaces formed with a pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
TW094137984A 2004-10-29 2005-10-28 Process for manufacturing a light emitting array TW200635082A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/977,240 US20060094322A1 (en) 2004-10-29 2004-10-29 Process for manufacturing a light emitting array

Publications (1)

Publication Number Publication Date
TW200635082A true TW200635082A (en) 2006-10-01

Family

ID=35954095

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094137984A TW200635082A (en) 2004-10-29 2005-10-28 Process for manufacturing a light emitting array

Country Status (7)

Country Link
US (1) US20060094322A1 (zh)
EP (1) EP1805816A1 (zh)
JP (1) JP2008518478A (zh)
KR (1) KR20070074644A (zh)
CN (1) CN101088177A (zh)
TW (1) TW200635082A (zh)
WO (1) WO2006049849A1 (zh)

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* Cited by examiner, † Cited by third party
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US20060091411A1 (en) * 2004-10-29 2006-05-04 Ouderkirk Andrew J High brightness LED package
EP1927024A1 (en) * 2005-08-29 2008-06-04 Koninklijke Philips Electronics N.V. Light source and method of providing a bundle of light
US20070258241A1 (en) * 2006-05-02 2007-11-08 3M Innovative Properties Company Led package with non-bonded converging optical element
US7953293B2 (en) * 2006-05-02 2011-05-31 Ati Technologies Ulc Field sequence detector, method and video device
US7525126B2 (en) 2006-05-02 2009-04-28 3M Innovative Properties Company LED package with converging optical element
US7390117B2 (en) * 2006-05-02 2008-06-24 3M Innovative Properties Company LED package with compound converging optical element
US20070257271A1 (en) * 2006-05-02 2007-11-08 3M Innovative Properties Company Led package with encapsulated converging optical element
US20070257270A1 (en) * 2006-05-02 2007-11-08 3M Innovative Properties Company Led package with wedge-shaped optical element
CN101467271B (zh) * 2006-06-12 2012-04-25 3M创新有限公司 具有再发光半导体构造和会聚光学元件的led装置
US20070284565A1 (en) * 2006-06-12 2007-12-13 3M Innovative Properties Company Led device with re-emitting semiconductor construction and optical element
US7952110B2 (en) * 2006-06-12 2011-05-31 3M Innovative Properties Company LED device with re-emitting semiconductor construction and converging optical element
US7902542B2 (en) * 2006-06-14 2011-03-08 3M Innovative Properties Company Adapted LED device with re-emitting semiconductor construction
WO2008011377A2 (en) * 2006-07-17 2008-01-24 3M Innovative Properties Company Led package with converging extractor
WO2008109296A1 (en) * 2007-03-08 2008-09-12 3M Innovative Properties Company Array of luminescent elements
KR20110019390A (ko) * 2008-06-05 2011-02-25 쓰리엠 이노베이티브 프로퍼티즈 컴파니 접합형 반도체 파장 변환기를 갖는 발광 다이오드
US8673662B2 (en) * 2009-07-29 2014-03-18 Tien-Tsai Lin Light-emitting diode cutting method and product thereof
SG178067A1 (en) 2009-07-30 2012-03-29 3M Innovative Properties Co Pixelated led
CN102564198B (zh) * 2010-12-28 2014-08-20 碳元科技股份有限公司 金属拉丝型散热复合结构的制造方法及制造系统
CN103465155B (zh) * 2013-09-06 2016-05-11 蓝思科技股份有限公司 一种环氧树脂型金刚石研磨垫及其制备方法

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Also Published As

Publication number Publication date
KR20070074644A (ko) 2007-07-12
CN101088177A (zh) 2007-12-12
EP1805816A1 (en) 2007-07-11
US20060094322A1 (en) 2006-05-04
JP2008518478A (ja) 2008-05-29
WO2006049849A1 (en) 2006-05-11

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